Abstract: There is provided an optical element module comprising a first optical element and an optical element holder. The first optical element has a first coefficient of thermal expansion. The optical element holder holds the first optical element and has a second coefficient of thermal expansion, the second coefficient of thermal expansion being adapted to the first coefficient of thermal expansion. The optical element is directly contacting the optical element holder in a wide contact area. The contact area is defined by a first contact surface of the first optical element and a second contact surface of the optical element holder, wherein the second contact surface matches the first contact surface. Thus, favorable rigidity and deformation behavior is provided.

Abstract: The invention relates to a projection exposure system for microlithography, said system comprising an illumination device for generating a projection light, and a projection objective comprising a plurality of optical elements such as lenses (L5) and enabling a reticle that can be arranged in an object plane of the projection objective to be imaged onto a light-sensitive surface (26) that can be arranged in an image plane of the projection objective and is applied to a carrier (30). The inventive system is also provided with an immersion device between an image-side last optical element (L5) of the projection objective and the light-sensitive surface (26), for introducing an immersion liquid (34) into an immersion chamber (50). Said immersion device comprises means (44; 66) which can prevent the appearance of gas bubbles (48) in the immersion liquid (34), affecting the imaging quality, and/or can remove existing gas bubbles (48). Said means can be, for example, an ultrasound source (66) or a degasifier (44).

Abstract: An arrangement serves for the adjustment of an optical element (1), in particular of a lens in an optical system, in particular in a projection lens system for semiconductor lithography. The optical element (1) is mounted in a mount (3) by means of a number of bearing feet (2) distributed over the circumference of the optical element (1) and is selectively deformable by actuators (5). At least some of the bearing feet (2) are engaged by the actuators (5) in a region of the respective bearing foot (2) in such a way that the respective bearing foot (2) can be displaced in the direction of the optical axis (7).

Abstract: A arrangement serves for the adjustment of an optical element (1), in particular of a lens in an optical system, in particular in a projection lens system for semiconductor lithography. The optical element (1) is mounted in a mount (3) by means of a number of bearing feet (2) distributed over the circumference of the optical element (1) and is selectively deformable by actuators (5). At least some of the bearing feet (2) are engaged by the actuators (5) in a region of the respective bearing foot (2) in such a way that the respective bearing foot (2) can be displaced in the direction of the optical axis (7).

Abstract: There is provided a projection exposure system operable in a scanning mode along a scanning direction. The projection exposure system includes a collector that receives light having a wavelength 193 nm and illuminates a region in a plane. The plane is defined by a local coordinate system having a y-direction parallel to the scanning direction and an x-direction perpendicular to the scanning direction. The collector includes (a) a first mirror shell, (b) a second mirror shell within the first mirror shell, and (c) a fastening device for fastening the first and second mirror shells. The mirror shells are substantially rotational symmetric about a common rotational axis. The fastening device has a support spoke that extends in a radial direction of the mirror shells, and the support spoke, when projected into the plane, yields a projection that is non-parallel to the y-direction.

Abstract: There is provided an optical element comprising an optical element body, a reflecting area and an optical passageway. The optical element body defines an axis of rotational symmetry. The reflecting area is disposed on the optical element body and adapted to be optically used in an exposure process. The optical passageway is arranged within the optical element body and allows light to pass the optical element body, the optical passageway being arranged eccentrically with respect to the axis of rotational symmetry.

Abstract: A microlithographic projection exposure apparatus contains an illumination system for generating projection light and a projection lens with which a reticle that is capable of being arranged in an object plane of the projection lens can be imaged onto a light-sensitive layer that is capable of being arranged in an image plane of the projection lens. The projection lens is designed for immersion mode, in which a final lens element of the projection lens on the image side is immersed in an immersion liquid. A terminating element that is transparent in respect of the projection is fastened between the final lens element on the image side and the light-sensitive layer.

Abstract: There is provided a projection exposure system operable in a scanning mode along a scanning direction. The projection exposure system includes a collector that receives light having a wavelength ?193 nm and illuminates a region in a plane. The plane is defined by a local coordinate system having a y-direction parallel to the scanning direction and an x-direction perpendicular to the scanning direction. The collector includes (a) a first mirror shell, (b) a second mirror shell within the first mirror shell, and (c) a fastening device for fastening the first and second mirror shells. The mirror shells are substantially rotational symmetric about a common rotational axis. The fastening device has a support spoke that extends in a radial direction of the mirror shells, and the support spoke, when projected into the plane, yields a projection that is non-parallel to the y-direction.

Abstract: Arranged in a system for setting and maintaining a gas atmosphere in an objective having at least one optical element is a first, inner gas compartment that is separated from a second, outer gas compartment by an inner casing. Both gas compartments are provided with gas inlet and gas outlet openings. At least one of the two gas compartments is under a pressure that is higher than the ambient pressure.

Abstract: A lithographic apparatus is disclosed. The apparatus includes a projection system configured to project a patterned radiation beam onto a target portion of a substrate. The projection system includes a housing and a plurality of optical elements arranged in the housing. The apparatus also includes an inlet for feeding conditioned gas to the housing and a gas exhaust for exhausting the conditioned gas from the housing for providing a gas conditioned environment in the housing. At least one gate is provided for providing communication of the gas conditioned environment with ambient atmosphere. The gate is arranged to provide a predetermined leakage of the conditioned gas to the ambient atmosphere.

Abstract: In a system for overcoming or at least damping oscillations in or through channels (9) which carry fluid in a component, in particular coolant in cooling channels in an optical element (1), in particular a projection objective lens (1a) for semiconductor lithography, oscillations which occur are detected and evaluated by sensors (5), after which the result is passed, in the form of an adaptronic control loop to piezoelectric elements (9), which are integrated in the optical element, and are in the form of thin plates, films or layers which, when activated, produce the oscillations or frequencies which counteract oscillations and natural frequencies produced by the turbulence.

Abstract: In a system for specific deformation of optical elements in an imaging device, in particular in a projection exposure machine having a projection lens for micro-lithography, for the purpose of eliminating image errors or for active adjustment, piezoelectric elements are applied as actuators in the form of thin plates, films or layers to surfaces to be deformed, or integrated into them. In conjunction with an adaptronic servo loop having sensors, forces and/or moments are exerted on the optical elements for their specific deformation by means of a controlled activation of the piezoelectric elements as actuators.

Abstract: A catadioptric objective comprises a plurality of lenses and at least two deflecting mirrors that have reflecting surfaces that are at a specific angle, in particular of 90°, to one another. The two deflecting mirrors are arranged with their reflecting surfaces on a common base member whose position in the objective can be set.

Abstract: The invention concerns an optical element (1) with an optical axis (3), designed in particular for an exposure lens used in semiconductor lithography. Said optical element comprises at least an extension (2, 2′) in the direction of the optical axis (3). A device (11) enables to induce a two-wave or multiple wave deformation in said optical element (1). At least a system (12) mounted in the extension zone (2, 2′) is designed to apply a force in said extension (2, 2′).

Abstract: An optical measuring system is provided with a measuring machine that has at least one measuring element for determining locations and at least one measuring element for determining angles. At least one common reference surface is provided for the location-determining measuring element and the angle-determining measuring element.

Abstract: There is provided a projection exposure system operable in a scanning mode along a scanning direction. The projection exposure system includes a collector that receives light having a wavelength ≦193 nm and illuminates a region in a plane. The plane is defined by a local coordinate system having a y-direction parallel to the scanning direction and an x-direction perpendicular to the scanning direction. The collector includes (a) a first mirror shell, (b) a second mirror shell within the first mirror shell, and (c) a fastening device for fastening the first and second mirror shells. The mirror shells are substantially rotational symmetric about a common rotational axis. The fastening device has a support spoke that extends in a radial direction of the mirror shells, and the support spoke, when projected into the plane, yields a projection that is non-parallel to the y-direction.

Abstract: In the case of a mounting apparatus, an optical element having an inner mount and an outer mount, in particular a lens in a projection lens system for semiconductor lithography, the inner mount is connected to the outer mount via three circumferentially distributed articulations. Manipulators, whereby said inner mount is displaceable, act on the articulations. The articulations comprise a mechanism which transforms a radial movement into an axial movement.

Abstract: A arrangement serves for the adjustment of an optical element (1), in particular of a lens in an optical system, in particular in a projection lens system for semiconductor lithography. The optical element (1) is mounted in a mount (3) by means of a number of bearing feet (2) distributed over the circumference of the optical element (1) and is selectively deformable by actuators (5). At least some of the bearing feet (2) are engaged by the actuators (5) in a region of the respective bearing foot (2) in such a way that the respective bearing foot (2) can be displaced in the direction of the optical axis (7).

Abstract: A mount for an optical element in an optical imaging device, in particular in a lens system (4) for semiconductor lithography, has at least one mounting ring (2) which bears the optical element (6). The mounting ring (2) is of at least partially hollow design in cross section.

Abstract: In an oscillation damping system, the oscillations which act on an optical element in an imaging device, in particular on deformation-decoupled mounts and manipulators in a projection illumination arrangement, in particular in a projection objective for microlithographic projection exposure objective lithography, are detected by sensors, by actuators waves with same or at least similar frequencies and amplitudes of anti-phases to the disturbing oscillations are generated and introduced in said mount.