Abstract: Provided is an evaporator stack. The evaporator stack may be used in power-dense electronic assemblies. The evaporator stack includes a lower floor including at least one mounded portion, and an enclosure surrounding the lower floor, wherein a height of the enclosure is greater than a height of the at least one mounded portion, the at least one mounded portion extending between two walls of the enclosure.

Abstract: A power supply circuit for converting a first voltage to a second voltage where the first voltage is greater than the second voltage, and a power train having the same, are provided. The power supply circuit may have multiple stages and each stage of the power supply circuit may include a first circuit block configured to provide a start-up power to a second circuit block; a second circuit block configured to generate a Pulse-Width-Modulation (PWM) signal that controls a pulse duration of a transistor; a third circuit block configured to activate or deactivate the transistor based on the PWM signal; a fourth circuit block configured to reset a magnetic flux in a transformer to a zero state when the transistor is deactivated; and a fifth circuit block configured to maintain an output of a stage below a predetermined value by adjusting a voltage across the transformer.

Abstract: In accordance with one embodiment, an observed power transfer is estimated based on input and output voltage measurements associated with an observed power transfer from the primary converter to the secondary converter. An electronic controller or electronic data processor determines a ratio or percentage between the observed power transfer and maximum power transfer. A load curve is selected based on the determined ratio or percentage. The modulation frequency is adjusted or maintained for of the primary converter and the secondary converter consistent with an operation point on the selected load curve, where the operation point minimizes the power loss, power difference, or thermal energy dissipated from the converter.

Abstract: A semiconductor device comprises a generally planar semiconductor chip. The semiconductor chip comprises a first side and second side opposite the first side. The first side is associated with a source conductive pad. The second side is associated with a drain conductive pad. A gate pad overlies a portion of the first side. A source terminal comprises a metallic strip assembly with a series of pocket chambers spaced apart from each other and partially filled with a phase-change material filling. A drain terminal is spaced apart from the source terminal by a dielectric layer. The source terminal is bonded to the source conductive pad via a bonding interface material.

Abstract: A method for manufacturing an electronic assembly features a semiconductor device with a first side and a second side opposite the first side to facilitate enhanced thermal dissipation. The first side has a first conductive pad. The second side has a primary metallic surface. By heating the assembly once, a first substrate (e.g. lead frame) is bonded to a first conductive pad via first metallic bonding layer; and second substrate (e.g., heat sinking circuit board) is bonded to a primary metallic surface via a second metallic bonding layer. In one configuration the second metallic bonding layer is composed of solder and copper, for example.

Abstract: A semiconductor device comprises a generally planar semiconductor chip. The semiconductor chip comprises a first side and second side opposite the first side. The first side is associated with a source conductive pad. The second side is associated with a drain conductive pad. A gate pad overlies a portion of the first side. A source terminal comprises a metallic strip assembly with a series of pocket chambers spaced apart from each other and partially filled with a phase-change material filling. A drain terminal is spaced apart from the source terminal by a dielectric layer. The source terminal is bonded to the source conductive pad via a bonding interface material.

Abstract: A method for manufacturing an electronic assembly features a semiconductor device with a first side and a second side opposite the first side to facilitate enhanced thermal dissipation. The first side has a first conductive pad. The second side has a primary metallic surface. By heating the assembly once, a first substrate (e.g. lead frame) is bonded to a first conductive pad via first metallic bonding layer; and second substrate (e.g., heat sinking circuit board) is bonded to a primary metallic surface via a second metallic bonding layer. In one configuration the second metallic bonding layer is composed of solder and copper, for example.

Abstract: In accordance with one aspect of the disclosure, an electronic assembly comprises a semiconductor device with a first side and a second side opposite the first side. The first side has a first conductive pad. The second side has a primary metallic surface. A first substrate (e.g. lead frame) is bonded to a first conductive pad via first metallic bonding layer. A second substrate (e.g., heat sinking circuit board) is bonded to a primary metallic surface via a second metallic bonding layer. In one configuration the second metallic bonding layer is composed of solder and copper, for example.

Abstract: In one example embodiment, a circuit includes a first sub-circuit configured to generate first data corresponding to a frequency and a duration of overloading of a transistor in the inverter, and a second sub-circuit configured to generate second data corresponding to a rate of rise of a voltage and a peak voltage value of the transistor in the inverter. The first sub-circuit and the second sub-circuit are configured to respectively provide the first data and second data as outputs to a controller for analyzing a manner in which a load coupled to the inverter is driven.

Abstract: An electronic assembly comprises a gate drive module comprising multiple circuit board layers sandwiched together, where each layer has a central opening that is aligned with the other layers. A switching circuit chipset is positioned in the central opening. The switching circuit chipset has lead frames for providing electrical connections to the switching circuit chipset. The lead frames are alignable with pockets in two or more of the layers to facilitate alignment of the contact portions of the lead frames with corresponding conductive pads on the circuit board.

Abstract: In an example embodiment, a controller includes a memory having computer-readable instructions stored therein and a processor. The processor is configured to execute the computer-readable instructions to determine a first set of inductance values for at least one load machine and second set of inductance values for a generator machine, determine a first set of gains for the at least one load machine based on the first set of inductance values and a regulator bandwidth, determine a second set of gains for the generator machine based on the second set of inductance values and the regulator bandwidth, and generate voltage commands for driving the at least one load machine and the generator machine based on at least the first and second sets of gains.

Abstract: An electronic assembly comprises a gate drive module comprising multiple circuit board layers sandwiched together, where each layer has a central opening that is aligned with the other layers. A switching circuit chipset is positioned in the central opening The switching circuit chipset has lead frames for providing electrical connections to the switching circuit chipset. The lead frames are alignable with pockets in two or more of the layers to facilitate alignment of the contact portions of the lead frames with corresponding conductive pads on the circuit board.

Abstract: An electronic assembly comprises a heat-generating semiconductor device that has a first side and a second side opposite the first side. An evaporator stack has a floor and a hollow body. The evaporator stack overlies the first side of the semiconductor device. The heated floor can convert a liquid-phase of a coolant (e.g., refrigerant) into a gas-phase of the coolant. A condensation container is in communication with the evaporator stack and is arranged to receive a gas-phase of the coolant. The condensation container is configured to convert the received gas-phase of the coolant into a liquid phase to replenish the liquid-phase coolant for interaction with the floor of the evaporator stack.

Abstract: A detector measures turn-off voltage change with respect to change in time between a collector and emitter of a transistor and peak voltage of the transistor at the collector. An electronic data processor determines intermediate parameters of turn-off current, the turn-on current and on-state voltage drop based on the turn-off voltage change and the peak voltage. The data processor determines the power or energy loss for one switching cycle of the transistor based on the turn-off current, the turn-on current and on-state voltage drop between the collector and emitter of the transistor. The data processor estimates an associated average die temperature for the transistor over the switching cycle.

Abstract: An electrical connector assembly includes a first electrically conductive contact member and a second electrically conductive contact member. Both contact members have non-planar interface surfaces. The second interface surface is complimentary to the first interface surface. Magnetic field concentrators are spaced apart to concentrate a magnetic field in a zone. The magnetic field is associated with electric current carried by the electrical connector assembly. A flexible circuit carrier has openings to receive the magnetic field concentrators. The flexible circuit carrier comprises a flexible dielectric layer and a conductive traces. A magnetic field sensor is mounted on the flexible circuit carrier in the zone.

Abstract: An electronic assembly comprises a heat-generating semiconductor device that has a first side and a second side opposite the first side. An evaporator stack has a floor and a hollow body. The evaporator stack overlies the first side of the semiconductor device. The heated floor can convert a liquid-phase of a coolant (e.g., refrigerant) into a gas-phase of the coolant. A condensation container is in communication with the evaporator stack and is arranged to receive a gas-phase of the coolant. The condensation container is configured to convert the received gas-phase of the coolant into a liquid phase to replenish the liquid-phase coolant for interaction with the floor of the evaporator stack.

Abstract: In accordance with one aspect of the disclosure, an electronic assembly comprises a semiconductor device with a first side and a second side opposite the first side. The first side has a first conductive pad. The second side has a primary metallic surface. A first substrate (e.g. lead frame) is bonded to a first conductive pad via first metallic bonding layer. A second substrate (e.g., heat sinking circuit board) is bonded to a primary metallic surface via a second metallic bonding layer. In one configuration the second metallic bonding layer is composed of solder and copper, for example.

Abstract: A first driver portion comprises a set of first components mounted on or associated with a first circuit board. A second circuit board is spaced apart from the first circuit board. A second driver portion comprises a set of second components mounted on or associated with the second circuit board, where the first driver portion and the second driver portion collectively are adapted to provide input signals to the control terminal of each semiconductor switch of an inverter. A first edge connector is mounted on the first circuit board. A second edge connector is mounted on the second circuit board. An interface board has mating edges that mate with the first edge connector and the second edge connector.

Abstract: A first driver portion comprises a set of first components mounted on or associated with a first circuit board. A second circuit board is spaced apart from the first circuit board. A second driver portion comprises a set of second components mounted on or associated with the second circuit board, where the first driver portion and the second driver portion collectively are adapted to provide input signals to the control terminal of each semiconductor switch of an inverter. A first edge connector is mounted on the first circuit board. A second edge connector is mounted on the second circuit board. An interface board has mating edges that mate with the first edge connector and the second edge connector.

Abstract: In an example embodiment, a controller includes a memory having computer-readable instructions stored therein and a processor. The processor is configured to execute the computer-readable instructions to determine a first set of inductance values for at least one load machine and second set of inductance values for a generator machine, determine a first set of gains for the at least one load machine based on the first set of inductance values and a regulator bandwidth, determine a second set of gains for the generator machine based on the second set of inductance values and the regulator bandwidth, and generate voltage commands for driving the at least one load machine and the generator machine based on at least the first and second sets of gains.