Abstract: An electrical assembly comprises a dielectric substrate and a metallic conductive trace overlying the substrate. The metallic conductive trace has a hollow cross-section that forms a duct. An annular member protrudes from the metallic conductive trace. The annular member has an opening in communication with the duct, the opening for receiving pressurized air or gas.

Abstract: An electrical connector assembly includes a first electrically conductive contact member and a second electrically conductive contact member. Both contact members have non-planar interface surfaces. The second interface surface is complimentary to the first interface surface. The first interface surface may include a plurality of elongated first ridges and a plurality of elongated first valleys, and the second interface surface may include a plurality of elongated second ridges and a plurality of elongated second valleys. A first ridge is received by a second valley and a second ridge is received by a first valley.

Abstract: An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresponding conductive pads. A first heat sink comprises a first component having a mating side. A portion of the mating side is directly bonded with the metallic region of the semiconductor device. A circuit board has an opening for receiving the semiconductor device. The lead frame extends outward toward the circuit board or a board first side of the circuit board.

Abstract: In accordance with one embodiment, a machine for generating electrical energy comprises a housing and a shaft rotatable with respect to the housing. An impeller has blades for rotation with the shaft in response to receipt of material from a chute. A first generator assembly comprises first stator windings associated with the housing and a first magnet affixed to the shaft, such that if the impeller rotates an electromagnetic signal energizes the first stator windings based on the flow of material through the chute.

Abstract: An electrical connector assembly includes a first electrically conductive contact member and a second electrically conductive contact member. Both contact members have non-planar interface surfaces. The second interface surface is complimentary to the first interface surface. The first interface surface may include a plurality of elongated first ridges and a plurality of elongated first valleys, and the second interface surface may include a plurality of elongated second ridges and a plurality of elongated second valleys. A first ridge is received by a second valley and a second ridge is received by a first valley.

Abstract: An electrical connector assembly includes a first electrically conductive contact member and a second electrically conductive contact member. Both contact members have non-planar interface surfaces. The second interface surface is complimentary to the first interface surface. Magnetic field concentrators are spaced apart to concentrate a magnetic field in a zone. The magnetic field is associated with electric current carried by the electrical connector assembly. A flexible circuit carrier has openings to receive the magnetic field concentrators. The flexible circuit carrier comprises a flexible dielectric layer and a conductive traces. A magnetic field sensor is mounted on the flexible circuit carrier in the zone.

Abstract: A coaxial bus connector has a first end and a second end opposite the first end. The first end has a first positive terminal and a first negative terminal coupled to a primary direct current bus of a primary inverter. The second end has a second positive terminal and a second negative terminal coupled to the secondary direct current bus of a secondary inverter, wherein the coaxial bus connector comprises a dielectric material between a center conductor and a coaxial sleeve to form a snubber capacitor to absorb electrical energy or to absorb voltage spikes.

Abstract: An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresponding conductive pads. A first heat sink comprises a first component having a mating side. A portion of the mating side is directly bonded with the metallic region of the semiconductor device. A circuit board has an opening for receiving the semiconductor device. The lead frame extends outward toward the circuit board or a board first side of the circuit board.

Abstract: In one example embodiment, a circuit includes a first sub-circuit configured to generate first data corresponding to a frequency and a duration of overloading of a transistor in the inverter, and a second sub-circuit configured to generate second data corresponding to a rate of rise of a voltage and a peak voltage value of the transistor in the inverter. The first sub-circuit and the second sub-circuit are configured to respectively provide the first data and second data as outputs to a controller for analyzing a manner in which a load coupled to the inverter is driven.

Abstract: A package for a semiconductor device or circuit comprises a semiconductor switch module having a metallic base on an exterior side and metallic pads. A sealed metallic enclosure holds the semiconductor switch module. The metallic enclosure has a set of dielectric regions with embedded or pass-through electrical terminals that are electrically insulated or isolated from the sealed metallic enclosure. The electrical terminals are electrically connected to the metallic pads. A housing is adapted for housing the semiconductor switch module within the metallic enclosure. The housing comprises chamber for holding or circulating a coolant overlying the metallic base.

Abstract: In one example embodiment, an apparatus includes a power electronics switching circuit having a semiconductor switch and a device in communication with the power electronics switching circuit. The device includes a processor configured to estimate a current through the power electronics switching circuit based on a first voltage across the semiconductor switch, a control signal controlling the semiconductor switch and a first voltage-current characteristic of the semiconductor switch.

Abstract: A coaxial bus connector has a first end and a second end opposite the first end. The first end has a first positive terminal and a first negative terminal coupled to a primary direct current bus of a primary inverter. The second end has a second positive terminal and a second negative terminal coupled to the secondary direct current bus of a secondary inverter, wherein the coaxial bus connector comprises a dielectric material between a center conductor and a coaxial sleeve to form a snubber capacitor to absorb electrical energy or to absorb voltage spikes.

Abstract: An electronic assembly for an inverter comprises a substrate having a dielectric layer and metallic circuit traces. A plurality of terminals are arranged for connection to a direct current source. A first semiconductor and a second semiconductor are coupled together between the terminals of the direct current source. A primary metallic island (e.g., strip) is located in a primary zone between the first semiconductor and the second semiconductor. The primary metallic island has a greater height or thickness than the metallic circuit traces. The primary metallic island provides a heat sink to radiate heat.

Abstract: A package for a semiconductor device or circuit comprises a semiconductor switch module having a metallic base on an exterior side and metallic pads. A sealed metallic enclosure holds the semiconductor switch module. The metallic enclosure has a set of dielectric regions with embedded or pass-through electrical terminals that are electrically insulated or isolated from the sealed metallic enclosure. The electrical terminals are electrically connected to the metallic pads. A housing is adapted for housing the semiconductor switch module within the metallic enclosure. The housing comprises chamber for holding or circulating a coolant overlying the metallic base.

Abstract: A capacitor comprises a first winding member, where the first winding member comprises a first dielectric layer and a first conductive layer. A second winding member comprises a second dielectric layer and second conductive layer. The first winding member is interleaved, partially or entirely, with the second winding layer. A dielectric shell or shell is adapted to at least radially contain or border the first winding member and the second winding member. The first winding member is electrically connected to a first conductive end. A second winding member is electrically connected to a second conductive end. The second conductive end is opposite the first conductive end. The first conductive end forms a first lead; the second conductive end forms a second lead.

Abstract: A detector measures turn-off voltage change with respect to change in time between a collector and emitter of a transistor and peak voltage of the transistor at the collector. An electronic data processor determines intermediate parameters of turn-off current, the turn-on current and on-state voltage drop based on the turn-off voltage change and the peak voltage. The data processor determines the power or energy loss for one switching cycle of the transistor based on the turn-off current, the turn-on current and on-state voltage drop between the collector and emitter of the transistor. The data processor estimates an associated average die temperature for the transistor over the switching cycle.

Abstract: An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresponding conductive pads. A first heat sink comprises a first component having a mating side. A portion of the mating side is directly bonded with the metallic region of the semiconductor device. A circuit board has an opening for receiving the semiconductor device. The lead frame extends outward toward the circuit board or a board first side of the circuit board.

Abstract: An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresponding conductive pads. A first heat sink comprises a first component having a mating side. A portion of the mating side is directly bonded with the metallic region of the semiconductor device. A circuit board has an opening for receiving the semiconductor device. The lead frame extends outward toward the circuit board or a board first side of the circuit board.

Abstract: A sensor comprises an inductor for sensing an alternating current signal component of an observed signal. The inductor comprises a substrate, conductive traces associated with different layers of the substrate, and one or more conductive vias for interconnecting the plurality of conductive traces. A magnetic field sensor senses a direct current signal component of the observed signal. A first filtering circuit has a high-pass filter response. The first filtering circuit is coupled to the inductor to provide a filtered alternating current signal component. A second filtering circuit has a low-pass filter response. The second filtering circuit coupled to the magnetic field sensor to provide a filtered direct current signal component. A sensor fusion circuit determines an aggregate sensed current based on the filtered alternating current signal component and the filtered direct current signal component.

Abstract: A capacitor comprises a first winding member, where the first winding member comprises a first dielectric layer and a first conductive layer. A second winding member comprises a second dielectric layer and second conductive layer. The first winding member is interleaved, partially or entirely, with the second winding layer. A dielectric shell or shell is adapted to at least radially contain or border the first winding member and the second winding member. The first winding member is electrically connected to a first conductive end. A second winding member is electrically connected to a second conductive end. The second conductive end is opposite the first conductive end. The first conductive end forms a first lead; the second conductive end forms a second lead.