Abstract: An array of MEMS devices is formed on a planar substrate having in each of a plurality of annular regions or sectors a plurality of MEMS mirrors of substantially identical structure, wherein the MEMS mirrors in each region have an identical pre-tilt. The pre-tilt is achieved by embedding each dual-axis tiltable mirror within a pre-tilted microplatform or gimbal. In a specific embodiment, one microplatform of a preselected pre-tilt is provided for each micromirror and an underlying electrode is provided having a shape conforming with the pre-tilt. In a specific embodiment, the annular regions are contiguous elliptical or ovoidal regions. By pre-tilt, it is meant that the rest state or nonactuated state of the micro-mirror is such that a reflected beam from a fixed source is directed to the center of a target array.

Abstract: One or more cavities are formed in the bonding surfaces of one, all, or some of the elements to be bonded. These cavities serve as receptacles for the bonding material and are where the bonds are localized. The cavities are of sufficient size and shape so that their volume is greater than the volume of bonding material forming the bond. This ensures that when the elements are brought into contact with one another to mate, the bonding material, which can flow prior to solidifying into a bond, will flow into the cavities and will not impede the separation of the parts. This allows the parts to be mated with nominally zero separation. Once solidified, the bonding material forms a localized bond inside each cavity. Different cavity shapes, such as, rectangular, circular, or any other shape that can be injected or filled with adhesive material may be used.

Abstract: A MEMS-based mirror is provided with trenches between adjacent electrodes in order to be able to withstand relatively high applied voltages, and thus has a substantially reduced exposure to uncontrolled surface potentials. The MEMS-based mirror, thus avoids voltage drifts and has an improved mirror position stability. The trench dimensions are selected such that the voltage applied between each adjacent pair of electrodes stays within predefined limits. An insulating layer, such as silicon dioxide, electrically isolates each pair of adjacent electrodes. Each insulting layer extends partially above an associated trench and is characterized by the same height and width dimensions.

Abstract: An array apparatus has a micromachined SOI structure, such as a MEMS array, mounted directly on a class of insulative substrate, such as low temperature co-fired ceramic or a thermal-coefficient of expansion matched glass, in which is embedded electrostatic electrodes disposed in alignment with the individual MEMS elements, where the electrostatic electrodes are configured for substantial fanout. In a specific embodiment in order to compensate for differences in thermal-expansion characteristics between SOI and ceramic, a flexible mounting is effected by means of posts, bridges and/or mechanical elements which allow uneven expansion in x and y while maintaining z-axis stability. Methods according to the invention include fabrication steps wherein electrodes are fabricated to a post-fired ceramic substrate and coupled via traces through the ceramic substrate to driver modules.

Abstract: In a gimbaled micromachined micromirror array optimized for parallel-plate electrostatic operation, longitudinal-type gimbal hinge elements are provided in which a plurality of torsional longitudinal hinge elements are arranged in an array parallel to the axis of rotation and which are linked together by rigid lateral brace sections. In primary embodiment the hinge elements are arranged in a double gimbal configuration. Specific embodiments of the hinge elements are simple longitudinal, compound longitudinal, stacked simple longitudinal, and stacked compound longitudinal. The longitudinal hinges may be used with various types of mirrors including circular or rectilinear, recessed or nonrecessed, where the hinges are connected in either a symmetric or asymmetric configuration relative to one another, as hereinafter illustrated by way of a subset of examples.

Abstract: An optical switch globally minimizes maximum tilt angles used to route optical signals from input to output by disposition of an input array of first tiltable micromirrors within a first boundary typically having top-bottom reflection symmetry and left-right reflection symmetry and by disposition of an output array of second tiltable micromirrors within a second boundary a symmetry which matches the symmetry for the input array, the output array and the input array being disposed opposing one another and normal to parallel central axes and further being offset from one another in the plane of the normals to the arrays, so that a collimated beamlet impinging on the center the input array and reflected off at an equivalent angle intersects the output array at an offset.

Abstract: In a folded three-dimensional free-space optical switch including a set of fibers and an optical system for producing collimated beamlets aligned to intersect an array of dual axis micromirrors of coplanar input and output mirror elements, and a folding mirror, the input and output micromirrors are arranged in a pattern wherein either the input or output mirror set is disposed along an annulus and wherein the complementary output or input mirror set is disposed within the annulus in order to globally minimize maximum tilt angles for a two-dimensional locus of tilt angles of the micromirror set. The beamlets are routed from assigned input fibers to corresponding input moveable mirrors to assigned output fibers via the static folding mirror and corresponding output moveable mirrors.

Abstract: A MEMS device having a fixed element and a movable element wherein one or the other of the fixed element and the movable element has at least one radially-extended stop or overdeflection limiter. A fixed overlayer plate forms an aperture. The aperture is sized to minimize vignetting and may be beveled on the margin. Overdeflection limitation occurs during deflection before the movable element can impinge on an underlying electrode. The overdeflection limiter may be conveniently placed adjacent a gimbaled hinge.

Abstract: In an electrostatically controlled deflection apparatus, such as a MEMS array having cavities formed around electrodes and which is mounted directly on a dielectric or controllably resistive substrate in which are embedded electrostatic actuation electrodes disposed in alignment with the individual MEMS elements, a mechanism is provided to mitigate the effects of uncontrolled dielectric surface potentials between the MEMS elements and the electrostatic actuation electrodes, the mechanism being raised electrodes relative to the dielectric or controllably resistive surface of the substrate. The aspect ratio of the gaps between elements (element height to element separation ratio) is at least 0.1 and preferably at least 0.5 and preferably between 0.75 and 2.0 with a typical choice of about 1.0, assuming a surface fill factor of 50% or greater. Higher aspect ratios at these fill factors are believed not to provide more than marginal improvement.

Abstract: An array apparatus has a micromachined SOI structure, such as a MEMS array, mounted directly on a class of insulative substrate, such as low temperature co-fired ceramic or a thermal-coefficient of expansion matched glass, in which is embedded electrostatic electrodes disposed in alignment with the individual MEMS elements, where the electrostatic electrodes are configured for substantial fanout. In a specific embodiment in order to compensate for differences in thermal-expansion characteristics between SOI and ceramic, a flexible mounting is effected by means of posts, bridges and/or mechanical elements which allow uneven expansion in x and y while maintaining z-axis stability. Methods according to the invention include fabrication steps wherein electrodes are fabricated to a post-fired ceramic substrate and coupled via traces through the ceramic substrate to driver modules.

Abstract: In an electrostatically controlled deflection apparatus, such as a MEMS array having cavities formed around electrodes and which is mounted directly on a dielectric or controllably resistive substrate in which are embedded electrostatic actuation electrodes disposed in alignment with the individual MEMS elements, a mechanism is provided to mitigate the effects of uncontrolled dielectric surface potentials between the MEMS elements and the electrostatic actuation electrodes, the mechanism being raised electrodes relative to the dielectric or controllably resistive surface of the substrate. The aspect ratio of the gaps between elements (element height to element separation ratio) is at least 0.1 and preferably at least 0.5 and preferably between 0.75 and 2.0 with a typical choice of about 1.0, assuming a surface fill factor of 50% or greater. Higher aspect ratios at these fill factors are believed not to provide more than marginal improvement.

Abstract: In a folded three-dimensional free-space optical switch including a set of fibers and an optical system for producing collimated beamlets aligned to intersect an array of dual axis micromirrors of coplanar input and output mirror elements, and a folding mirror, the input and output micromirrors are arranged in a pattern wherein either the input or output mirror set is disposed along an annulus and wherein the complementary output or input mirror set is disposed within the annulus in order to globally minimize maximum tilt angles for a two-dimensional locus of tilt angles of the micromirror set. The beamlets are routed from assigned input fibers to corresponding input moveable mirrors to assigned output fibers via the static folding mirror and corresponding output moveable mirrors.

Abstract: In an electrostatically controlled apparatus, such as a MEMS array having cavities formed around electrodes and which is mounted directly on a dielectric substrate in which are embedded electrostatic actuation electrodes disposed in alignment with the individual MEMS elements, a mechanism is provided to controllably neutralize excess charge and establish a controlled potential between the MEMS elements and the electrostatic actuation electrodes.

Abstract: A MEMS device having a fixed element and a movable element wherein one or the other of the fixed element and the movable element has at least one radially-extended stop or overdeflection limiter. A fixed overlayer plate forms an aperture. The aperture is sized to minimize vignetting and may be beveled on the margin. Overdeflection limitation occurs during deflection before the movable element can impinge on an underlying electrode. The overdeflection limiter may be conveniently placed adjacent a gimbaled hinge.

Abstract: A structure of a hybrid MEMS structure is provided wherein a plate comprises a thin actuatable layer of conductive silicon, such as a MEMS actuatable element, and a thicker handle layer of conductive silicon to provide structural integrity which are separated by a thin oxide, together forming an SOI wafer. This plate is mounted to a substrate, typically ceramic, with the thin actuatable layer facing the substrate and separated by an air gap that is formed by creating, on the substrate, insulator standoffs which come in contact with the plate. A suitable dielectric material useful as a standoff on the substrate is a footrest that permits high aspect ratios.

Abstract: A MEMS device having a fixed element and a movable element wherein one or the other of the fixed element and the movable element has at least one radially-extended stop or overdeflection limiter. A fixed overlayer plate forms an aperture. The aperture is sized to minimize vignetting and may be beveled on the margin. Overdeflection limitation occurs during deflection before the movable element can impinge on an underlying electrode. The overdeflection limiter may be conveniently placed adjacent a gimbaled hinge.

Abstract: In an array apparatus, each MEMS element, comprising an actuatable element and a supportive handle, is mounted over a plurality of electrodes wherein the air gap is controlled by the thickness of the electrodes and not primarily by the structure of the handle. The structure of electrostatic actuation electrodes in specific embodiments is disclosed. While the invention is primarily a technique for reducing the air gap without unduly limiting the thickness of the handle, the invention may also be used to establish an air gap greater than the thickness of the handle.

Abstract: An array apparatus has a micromachined SOI structure, such as a MEMS array, mounted directly on a class of substrate, such as low temperature co-fired ceramic, in which is embedded electrostatic actuation electrodes disposed in substantial alignment with the individual MEMS elements, where the electrostatic electrodes are configured for substantial fanout and the electrodes are oversized such that in combination with the ceramic assembly are configured to allow for placement of the vias within a tolerance of position relative to electrodes such that contact is not lost therebetween at the time of manufacturing.

Abstract: An array apparatus has a micromachined SOI structure, such as a MEMS array, mounted directly on a class of insulative substrate, such as low temperature co-fired ceramic or a thermal-coefficient of expansion matched glass, in which is embedded electrostatic electrodes disposed in alignment with the individual MEMS elements, where the electrostatic electrodes are configured for substantial fanout. In a specific embodiment in order to compensate for differences in thermal-expansion characteristics between SOI and ceramic, a flexible mounting is effected by means of posts, bridges and/or mechanical elements which allow uneven expansion in x and y while maintaining z-axis stability. Methods according to the invention include fabrication steps wherein electrodes are fabricated to a post-fired ceramic substrate and coupled via traces through the ceramic substrate to driver modules.

Abstract: An array apparatus has a micromachined SOI structure, such as a MEMS array, mounted directly on a class of insulative substrate, such as low temperature co-fired ceramic or a thermal-coefficient of expansion matched glass, in which is embedded electrostatic electrodes disposed in alignment with the individual MEMS elements, where the electrostatic electrodes are configured for substantial fanout. In a specific embodiment in order to compensate for differences in thermal-expansion characteristics between SOI and ceramic, a flexible mounting is effected by means of posts, bridges and/or mechanical elements which allow uneven expansion in x and y while maintaining z-axis stability. Methods according to the invention include fabrication steps wherein electrodes are fabricated to a post-fired ceramic substrate and coupled via traces through the ceramic substrate to driver modules.