Abstract: Provided is a cervical brace. The cervical brace according to the present invention may include an upper support that supports and covers a jaw of a wearer, a lower support supported by being pressed against shoulders around the neck of the wearer, a rear support that is positioned behind the upper support and the lower support and supports the rear of the wearer's neck, and a height adjuster including a body installed at one side surface of the upper support, a connecting member formed to extend from one surface of the lower support toward the body, and a rotating member that is installed at one side of the body such that the connecting member penetrates and rotates about the connecting member in both directions, wherein the body of the height adjuster moves upward and downward along the connecting member according to a rotating direction of the rotating member and thus the upper support moves upward and downward with respect to the lower support.

Abstract: Proposed is a method for manufacturing a micro-LED display, the method including a transfer step of absorbing, by a transfer head, a micro-LED on a first substrate and transferring, by the transfer head, the absorbed micro-LED to a second substrate.

Abstract: Disclosed are a piezoelectric material-based electronic device having high recognition precision for a three-dimensional shape and improved durability, and a manufacturing method thereof. The electronic device includes an anodic oxide film, a first electrode provided on an upper surface of the anodic oxide film, a second electrode provided on an a lower surface of the anodic oxide film, and a piezoelectric column made of a piezoelectric material and provided between the first electrode and the second electrode.

Abstract: A micro LED vacuum adsorption body configured to vacuum-adsorb micro LEDs is proposed. More particularly, the micro LED adsorption body is capable of preventing micro LED damage when adsorbing the micro LEDs.

Abstract: A micro LED transfer head is proposed. The micro LED transfer head includes: a holding member including a holding region that holds a micro LED by means of vacuum holding force and a non-holding region that does not hold the micro LED; and a porous member provided on top of the holding member and having arbitrary pores, wherein the holding region includes: a first holding region; and a second holding region provided above the first holding region, formed to have a larger opening area than the first holding region, and communicating with the first holding region and the porous member, whereby the micro LED transfer head selectively transfers the micro LED.

Abstract: A system for transferring a micro LED includes a micro LED dropped into a solution. The system further includes a micro LED grip body immersed in the solution, the micro LED grip body including a porous member having pores, and gripping the micro LED with a grip surface where the pores are provided. An upper surface of the porous member is configured with a seating recess having a guide inclined portion on which the micro LED is mounted and a shielding portion provided around the seating recess.

Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same that facilitate realizing of pixels of the micro LED structure.

Abstract: The invention provides a micro LED suction body, and a method of manufacturing a micro LED display using the same. Proposed is a micro LED suction body for transferring micro LEDs from a first substrate to a second substrate and, more particularly, is a micro LED suction body for transferring micro LEDs by a vacuum suction method.

Abstract: Proposed is a part with a corrosion-resistant layer capable of preventing the exposure of pores attributable to corrosion and preventing the discharge of internal moisture and particles through the pores.

Abstract: Proposed are an anodic aluminum oxide mold capable of manufacturing a molded article having at least a portion with a dimensional range of several tens of ?m, and a mold structure including the same. Additionally, proposed are a method of manufacturing a molded article with a dimensional range of several tens of ?m using the anodic aluminum oxide mold, and a molded article manufactured thereby.

Abstract: Provided is a UV sterilizer including an illumination unit, a cover that has an open hole in an upper surface thereof and supports the illumination unit, and a body that is provided underneath the cover and secures an illumination distance between the illumination unit and an illumination target object. The body is composed of a first body and a second body into which the first body is inserted. The first body and the second body are separably combined with each other.

Abstract: Proposed are a probe card for performing a circuit test of a wafer and a manufacturing method therefor. More particularly, proposed are a probe card and a manufacturing method therefor, in which the process of inserting probe pins is eliminated.

Abstract: The present invention relates to a system for transferring a micro LED, the system not only releasing a grip force of a transfer head when transferring a micro LED to a substrate but also applying an additional force to the micro LED from below the substrate to attract the micro LED onto the substrate.

Abstract: Proposed are a micro-LED position error correcting carrier capable of correcting a position error of micro-LEDs, and a micro-LED transfer system using the same. The micro-LED position error correcting carrier includes: a loading recess having a bottom surface and an inclined portion and allowing a micro-LED to be accommodated therein; and a non-loading surface provided around the loading recess.

Abstract: The present invention relates generally to an optical device package on which an optical device is mounted and, more particularly, to an optical device package that is configured such that a unit substrate of the optical device package comes into surface contact with a curved surface of a light transmission member.

Abstract: The present invention provides a guide plate for a probe card. The guide plate for the probe card according to the present invention includes: a first guide plate including a plurality of first pin insertion holes formed therein, and made of an anodic oxide film; and a second guide plate disposed to be spaced apart from the first guide plate by a predetermined distance, and including a plurality of second pin insertion holes through which probe pins passing through the first pin insertion holes pass, wherein a buffer part is provided at least partially on each of an upper portion and a lower portion of the first guide plate.

Abstract: Proposed are a laminated anodic aluminum oxide structure in which a plurality of anodic aluminum oxide films are stacked, a guide plate of a probe card using the same, and a probe card having the same. More particularly, proposed are a laminated anodic aluminum oxide structure with a high degree of surface strength, a guide plate of a probe card using the same, and a probe card having the same.

Abstract: Proposed are an anodic aluminum oxide mold made of an anodic aluminum oxide film, a manufacturing method thereof, a half-finished probe product, a manufacturing method thereof, a probe card, and a manufacturing method thereof.

Abstract: The present invention relates to a transfer head and a method of manufacturing a micro LED display using the same. In particular, the present invention relates to a transfer head and a method of manufacturing a micro LED display using the same, the transfer head mounting normal micro LEDs on a display substrate without performing a complicated process of sorting out defective micro LEDs from the micro LEDs mounted on the display substrate and replacing the defective micro LEDs with normal micro LEDs.

Abstract: The present invention relates generally to a micro LED transfer head transferring a micro light-emitting diode (micro LED) from a first substrate to a second substrate. More particularly, the present invention relates to a micro LED transfer head holding and transferring a micro LED in which holding portions and surrounding areas of the holding portions are configured of different materials.