Patents by Inventor Bum Mo Ahn

Bum Mo Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METAL PART FOR PROCESS CHAMBER AND METHOD FOR FORMING LAYER OF METAL PART FOR PROCESS CHAMBER
    Publication number: 20210115584
    Abstract: Proposed are a metal part for a process chamber and a method of forming a thin film layer of the metal part for the process chamber. More particularly, proposed are a metal part for a process chamber and a method of forming a thin film layer of the metal part for the process chamber, wherein the metal part is installed in a process chamber used in a display or semiconductor manufacturing process or constitutes a part of the process chamber, and a large thickness of the thin film layer of the metal part for the process chamber is easily secured, thereby achieving an extended lifespan by preventing cracks of the metal part for the process chamber, while preventing outgassing due to pores.
    Type: Application
    Filed: October 14, 2020
    Publication date: April 22, 2021
    Inventor: Bum Mo AHN
  • MULTILAYER WIRING SUBSTRATE, METHOD OF MANUFACTURING SAME, AND PROBE CARD HAVING SAME
    Publication number: 20210116478
    Abstract: Proposed is a multilayer wiring substrate having excellent joining strength, a method of manufacturing the multilayer wiring substrate, and a probe card having the multilayer wiring substrate.
    Type: Application
    Filed: September 30, 2020
    Publication date: April 22, 2021
    Inventors: Bum Mo AHN, Seung Ho PARK, Sung Hyun BYUN
  • PROBE CARD
    Publication number: 20210102975
    Abstract: Proposed is a probe card for performing a circuit test on a wafer and, more particularly, a probe card capable of realizing a reduction in size and pitch of probe insertion holes.
    Type: Application
    Filed: September 23, 2020
    Publication date: April 8, 2021
    Inventors: Bum Mo AHN, Seung Ho PARK, Sung Hyun BYUN
  • Micro LED structure and method of manufacturing same
    Patent number: 10964871
    Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same. More particularly, the present invention relates to a micro LED structure and a method of manufacturing the same, the micro LED structure including: a micro LED; a circuit board driving the micro LED; and an anisotropic conductive anodic oxide film provided between the micro LED and the circuit board to electrically connect the circuit board and the micro LED. According to the present invention, without applying an external force (thermocompression bonding) to the anisotropic conductive anodic oxide film, it is possible to electrically connect the circuit board and the micro LED. In addition, it is possible to obtain characteristics such as uniform conductivity in a vertical direction and heat dissipation.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: March 30, 2021
    Assignee: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo Ahn, Seung Ho Park, Tae Hwan Song
  • JOINED COMPONENT
    Publication number: 20210048053
    Abstract: A joined component formed by friction stir welding is proposed. More particularly, a joined component formed in a structure in which flow paths formed therein are isolated from each other without interfering with each other is proposed.
    Type: Application
    Filed: August 6, 2020
    Publication date: February 18, 2021
    Inventor: Bum Mo AHN
  • MICRO LED TRANSFER HEAD
    Publication number: 20210050236
    Abstract: A micro LED transfer head is proposed. The micro LED transfer head includes: a holding member including a holding region that holds a micro LED by means of vacuum holding force and a non-holding region that does not hold the micro LED; and a porous member provided on top of the holding member and having arbitrary pores, wherein the holding region includes: a first holding region; and a second holding region provided above the first holding region, formed to have a larger opening area than the first holding region, and communicating with the first holding region and the porous member, whereby the micro LED transfer head selectively transfers the micro LED.
    Type: Application
    Filed: August 10, 2020
    Publication date: February 18, 2021
    Inventors: Bum Mo AHN, Seung Ho PARK, Sung Hyun BYUN
  • TRANSFER HEAD AND METHOD OF MANUFACTURING MICRO LED DISPLAY USING SAME
    Publication number: 20210043797
    Abstract: The present invention relates to a transfer head and a method of manufacturing a micro LED display using the same. In particular, the present invention relates to a transfer head and a method of manufacturing a micro LED display using the same, the transfer head mounting normal micro LEDs on a display substrate without performing a complicated process of sorting out defective micro LEDs from the micro LEDs mounted on the display substrate and replacing the defective micro LEDs with normal micro LEDs.
    Type: Application
    Filed: August 7, 2019
    Publication date: February 11, 2021
    Inventors: Bum Mo AHN, Seung Ho PARK, Tae Hwan SONG
  • MICRO LED GROUP SUBSTRATE, METHOD OF MANUFACTURING SAME, MICRO LED DISPLAY PANEL, AND METHOD OF MANUFACTURING SAME
    Publication number: 20210013259
    Abstract: Disclosed are a micro LED group substrate provided with a plurality of micro LEDs, a method of manufacturing the same, a micro LED display panel, and a method of manufacturing the same. More particularly, disclosed are a micro LED group substrate provided with a plurality of micro LEDs, a method of manufacturing the same, a micro LED display panel, and a method of manufacturing the same, wherein the need for a micro LED replacement process is eliminated.
    Type: Application
    Filed: July 6, 2020
    Publication date: January 14, 2021
    Inventors: Bum Mo AHN, Seung Ho PARK, Sung Hyun BYUN
  • Transfer head
    Patent number: 10889009
    Abstract: The present invention relates to a transfer head gripping and transferring micro LEDs from a first substrate to a second substrate. More particularly, the present invention relates to a transfer head gripping and transferring micro LEDs in a batch manner without any error even when there is a height difference of the micro LEDs.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: January 12, 2021
    Assignee: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo Ahn, Seung Ho Park, Sung Hyun Byun
  • Micro LED structure and method of manufacturing same
    Patent number: 10886446
    Abstract: The present invention relates generally to a micro LED structure and a method of manufacturing the same, and more particularly to a micro LED structure having an anisotropic conductive film between a micro LED and a target substrate to which the micro LED is bonded for electrically connect the micro LED and the target substrate together, and a method of manufacturing the same.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: January 5, 2021
    Assignee: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo Ahn, Seung Ho Park, Sung Hyun Byun
  • Micro LED transfer head and system using same for transferring micro LED
    Patent number: 10879105
    Abstract: The present invention relates to a micro LED transfer head and a system using the same for transferring a micro LED, the micro LED transfer head and the system being capable of increasing the efficiency of transferring micro LEDs with vacuum-suction by the micro LED transfer head, removing a factor that interferes with a grip force of the micro LED transfer head gripping the micro LEDs to improve the transfer efficiency of the micro LED transfer head, and preventing foreign substances from entering into a space where the micro LED transfer head is cleaned while cleaning a grip surface of the micro LED transfer head to improve the efficiency of cleaning the grip surface of the micro LED transfer head.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: December 29, 2020
    Assignee: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo Ahn, Seung Ho Park, Sung Hyun Byun
  • Inspection and replacement method for micro LED
    Patent number: 10872828
    Abstract: The present invention relates to an inspection and replacement method for a micro LED, the method being configured to inspect whether the micro LED is defective and replace a defective micro LED with a normal micro LED. More particularly, the present invention relates to an inspection and replacement method for a micro LED in which when micro LEDs are transferred to a display substrate, the micro LEDs are inspected so as to detect and remove a defective micro LED, and a normal micro LED is placed at a position where the defective micro LED is removed so as to be replaced with the defective micro LED.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: December 22, 2020
    Assignee: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo Ahn, Seung Ho Park
  • Method for manufacturing chip-mounting substrate, and chip-mounting substrate
    Patent number: 10868221
    Abstract: A method for manufacturing a chip-mounting substrate includes a pre-coating step of forming a precoat on a substrate including a plurality of conductive portions and an insulating portion interposed between the conductive portions, an etching step of etching at least a portion of the precoat through a laser to form a pattern, and a step of forming a metal layer on the substrate. The pattern is disposed on at least one of the conductive portions, and the metal layer is formed in the pattern.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: December 15, 2020
    Assignee: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo Ahn, Seung Ho Park, Tae Hwan Song
  • ANODIC OXIDE FILM FOR ELECTRIC CONTACT, OPTOELECTRONIC DISPLAY, AND METHOD OF MANUFACTURING OPTOELECTRONIC DISPLAY
    Publication number: 20200388737
    Abstract: The present invention relates generally to an anodic oxide film for electric contact, to an optoelectronic display, and to a method of manufacturing the optoelectronic display. More particularly, the present invention relates to an anodic oxide film for electric contact to electrically connect an optical element and a substrate in a position therebetween, to an optoelectronic display, and to a method of manufacturing the optoelectronic display.
    Type: Application
    Filed: June 1, 2020
    Publication date: December 10, 2020
    Inventors: Bum Mo AHN, Seung Ho PARK, Dong Hyeok SEO
  • ULTRAVIOLET STERILIZER
    Publication number: 20200384139
    Abstract: Provided is a UV sterilizer including an illumination unit, a cover that has an open hole in an upper surface thereof and supports the illumination unit, and a body that is provided underneath the cover and secures an illumination distance between the illumination unit and an illumination target object. The body is composed of a first body and a second body into which the first body is inserted. The first body and the second body are separably combined with each other.
    Type: Application
    Filed: June 2, 2020
    Publication date: December 10, 2020
    Inventors: Bum Mo AHN, Seung Ho PARK, Moon Hyun KIM
  • OPTICAL COMPONENT PACKAGE AND DEVICE USING SAME
    Publication number: 20200365770
    Abstract: Disclosed is an optical component package. The optical component package according to the present invention includes: a main substrate including a plurality of metal bodies, and a vertical insulation part provided between the metal bodies; a sub-substrate provided in a cavity of the main substrate, and electrically connected to each of the metal bodies with the vertical insulation part interposed therebetween; an optical component mounted on the sub-substrate; and a light transmitting member provided above the optical component, wherein the sub-substrate includes: an insulating body; a via hole vertically passing through the insulating body, and filled with a metal material; and a metal pad connected to the optical component.
    Type: Application
    Filed: January 9, 2020
    Publication date: November 19, 2020
    Inventors: Bum Mo AHN, Seung Ho PARK, Moon Hyun KIM
  • Micro LED transfer head
    Patent number: 10840115
    Abstract: The present invention relates to a micro LED transfer head improving efficiency of transferring micro LEDs.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: November 17, 2020
    Assignee: POINT ENGINEERING CO., LTD
    Inventors: Bum Mo Ahn, Seung Ho Park, Sung Hyun Byun
  • MICRO LED STRUCTURE AND METHOD OF MANUFACTURING SAME
    Publication number: 20200335680
    Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same. More particularly, the present invention relates to a micro LED structure and a method of manufacturing the same, the micro LED structure including: a micro LED; a circuit board driving the micro LED; and an anisotropic conductive anodic oxide film provided between the micro LED and the circuit board to electrically connect the circuit board and the micro LED. According to the present invention, without applying an external force (thermocompression bonding) to the anisotropic conductive anodic oxide film, it is possible to electrically connect the circuit board and the micro LED. In addition, it is possible to obtain characteristics such as uniform conductivity in a vertical direction and heat dissipation.
    Type: Application
    Filed: June 17, 2020
    Publication date: October 22, 2020
    Inventors: Bum Mo AHN, Seung Ho PARK, Tae Hwan SONG
  • JOINED COMPONENT AND METHOD OF MANUFACTURING SAME
    Publication number: 20200290150
    Abstract: The present invention relates to a joined component formed by friction stir welding and, more particularly, to a joined component formed in a structure in which no interface exists between flow paths formed therein.
    Type: Application
    Filed: March 10, 2020
    Publication date: September 17, 2020
    Inventor: Bum Mo AHN
  • GUIDE PLATE FOR PROBE CARD AND PROBE CARD HAVING SAME
    Publication number: 20200271693
    Abstract: The present invention provides a guide plate for a probe card. The guide plate for the probe card according to the present invention includes: a first guide plate including a plurality of first pin insertion holes formed therein, and made of an anodic oxide film; and a second guide plate disposed to be spaced apart from the first guide plate by a predetermined distance, and including a plurality of second pin insertion holes through which probe pins passing through the first pin insertion holes pass, wherein a buffer part is provided at least partially on each of an upper portion and a lower portion of the first guide plate.
    Type: Application
    Filed: February 18, 2020
    Publication date: August 27, 2020
    Inventors: Bum Mo AHN, Seung Ho PARK, Sung Hyun BYUN