Abstract: There are provided a power factor correction circuit capable of transferring extra power to a ground before performing switching for a power factor correction to thereby reduce a switching loss generated in switching for a power factor correction, and a power supply device and a motor driving device having the same. The power factor correction circuit includes: a main switch switching input power to adjust a phase difference between a current and a voltage of the input power; and an auxiliary switch switched on before the main switch is switched on, to thereby form a transmission path for extra power of the main switch.

Abstract: There is provided a flyback converter, including: a power supply unit supplying input power; a transformer unit including first and second transformers converting first and second primary current from the power supply unit into first and second secondary current, respectively; a main switch unit including first and second main switches respectively intermitting the first and second primary current flowing in respective primary windings of the first and second transformers; an auxiliary switch unit including first and second auxiliary switches forming respective transfer paths for dump power present before the first and second main switches are switched on; and an auxiliary inductor unit including first and second auxiliary inductors respectively adjusting the amount of current flowing in the first and second auxiliary switches during the switching operation thereof, wherein the first and second main switches perform a switching operation while having a predetermined phase difference therebetween.

Abstract: Disclosed herein is a power module package including: a substrate including a metal layer, a first insulation layer formed on the metal layer, a first circuit pattern formed on the first insulation layer and including a first pad and a second pad spaced apart from the first pad, a second insulation layer formed on the first insulation layer to cover the first circuit pattern, and a second circuit pattern formed on the second insulation layer and including a third pad formed on a location corresponding to the first pad and a fourth pad spaced apart from the third pad; a semiconductor chip mounted on the second circuit pattern; one end being electrically connected to the semiconductor chip, and another end protruding from the outside, wherein the first pad and the third pad, and the second pad and the fourth pad have different polarities.

Abstract: There is provided a power semiconductor device including: a body region having a first conductivity; a well formed in an upper portion of the body region and having a second conductivity; and a conductive via formed in the body region while traversing the well.

Abstract: Disclosed herein is a double side cooling power semiconductor module including: a first cooler having a concave part formed in one surface thereof in a thickness direction; a first semiconductor chip mounted on the concave part of the first cooler; a second cooler having one surface and the other surface and formed on one surface of the first cooler so that one surface thereof contacts the first semiconductor chip; a circuit board formed on the other surface of the second cooler; a second semiconductor chip mounted on the circuit board; and a flexible substrate having a circuit layer electrically connecting the first and second semiconductor chips to each other.

Abstract: There is provided a power factor correction circuit including: a main switching unit including a first main switch and a second main switch performing a switching operation to regulate a phase difference between a current and a voltage of input power, respectively; a main inductor unit including a first main inductor and a second main inductor accumulating or discharging energy according to a switching operation of each of the first main switch and the second main switch; a snubber switching unit including a first snubber switch and a second snubber switch providing zero-voltage turn-on conditions to the first main switch and the second main switch, respectively; and a controller controlling a switching operation of the main switching unit and the snubber switching unit.

Abstract: There are provided a power factor correction circuit, and a power supply including the same, the power factor correction circuit including a main switch adjusting a phase difference between a current and a voltage of input power, a main inductor storing or discharging the power according to switching of the main switch, a snubber circuit unit including a snubber switch forming a transfer path for surplus power present before the main switch is turned on and a snubber inductor adjusting an amount of a current applied to the snubber switch, and a reduction circuit unit including an auxiliary inductor inductively coupled to the snubber inductor and an auxiliary resistor consuming power induced from the snubber inductor through the auxiliary inductor.

Abstract: There are provided a power factor correction circuit and a power supply including the same, the power factor correction circuit including a main switch adjusting a phase difference between a current and a voltage of input power, a main inductor storing or discharging the power according to switching of the main switch, a snubber circuit unit including a snubber switch forming a transfer path for surplus power present before the main switch is turned on and a snubber inductor adjusting an amount of a current applied to the snubber switch, and a reduction circuit unit reducing excessive power imposed on the snubber switch by varying inductance of the snubber inductor.

Abstract: There is provided a driver device for a power factor correction circuit including first and second main switches that are switched on and off with a phase difference therebetween, and first and second auxiliary switches that provide conduction paths of surplus voltage in the first and second main switches before the first and second main switches are switched on, the driver device including: an input unit receiving a plurality of input signals; and an output unit outputting a first control signal for the first main switch, a second control signal for the second main switch, a third control signal for the first auxiliary switch, and a fourth control signal for the second auxiliary switch based on a plurality of input signals.

Abstract: There are provided a power factor correction device and a method for controlling power factor correction using the same. The power factor correction device includes a power factor correction circuit and a control circuit. The power factor correction circuit includes first and second inductors connected to an input power source stage and first and second main switches performing a switching operation on the first and second inductors, respectively. The control circuit may provide control signals to the first and second main switches, respectively, and when phase currents flowing in the respective first and second inductors are unbalanced, the control circuit may change a phase of at least one of the first and second main switches to correct an imbalance of the phases.

Abstract: There is provided a power factor correction device including: a main switching unit including a first main switch and a second main switch performing a switching operation with predetermined phase differences; an auxiliary switching unit including a first auxiliary switch and a second auxiliary switch forming a transmission path for surplus power existing before the first main switch and the second main switch are turned on, respectively; an inductor unit positioned between a power input unit to which AC power is applied and the main switching unit and accumulating or discharging energy according to a switching operation of the main switching unit; and an auxiliary inductor unit regulating an amount of current flowing in the auxiliary switching unit in the event of a switching operation of the auxiliary switching unit.

Abstract: There is provided a power factor correction device including, a first switch switching input power to adjust a phase difference between a current and a voltage of the input power, a second switch switched on before the first switch is switched on to form a transfer path for residual power in the first switch, a first inductor charging and discharging energy according to switching of the first switch, and a second inductor adjusting an amount of current flowing through the second switch according to switching of the second switch, wherein the first inductor and the second inductor are inductively coupled.

Abstract: Disclosed herein are a semiconductor device, and a method for manufacturing the semiconductor device. The semiconductor device includes a semiconductor substrate, a base region formed on an upper region of an inside of the semiconductor substrate, at least one gate electrode that penetrates through the base region and has an inverted triangular shape, a gate insulating film formed to enclose an upper portion of the semiconductor substrate and the gate electrode, an inter-layer insulating film formed on an upper portion of the gate electrode and the gate insulating film, an emitter region formed inside the base region and on both sides of the gate electrode, an emitter metal layer formed on an upper portion of the base region and inter-layer insulating film, and a buffer region formed to enclose a lower portion of the gate electrode and to be spaced apart from the base region.

Abstract: There are provided an interleaved power factor correction circuit and a power supply device including the same, the power factor correction circuit including: a main switching unit including a first main switch and a second main switch; an auxiliary switching unit including a first auxiliary switch and a second auxiliary switch; an inductor unit positioned between an input power terminal to which the input power is applied and the main switching unit and storing or discharging power according to the switching operations of the main switching unit; and an auxiliary inductor adjusting an amount of current flowing in the auxiliary switching unit when the auxiliary switching unit performs switching operations.

Abstract: Disclosed herein is a power module package including: a base substrate; a post having one end and the other end, the one end being formed on the base substrate; and a case formed on the base substrate such that it covers a lateral surface and an upper surface of the base substrate, and spaced apart from the upper surface of the base substrate.

Abstract: Disclosed herein is a unit power module including: a first semiconductor chip having one surface on which a 1-1-th electrode and a 1-2-th electrode spaced apart from the 1-1-th electrode are formed and the other surface on which a 1-3-th electrode is formed, a second semiconductor chip having one surface on which a 2-1-th electrode is formed and the other surface on which a 2-2-th electrode is formed, a first metal plate contacting the 1-1-th electrode of the first semiconductor chip and the 2-1-th electrode of the second semiconductor chip, a second metal plate contacting the 1-2-th electrode of the first semiconductor chip and spaced apart from the first metal plate, a third metal plate contacting the 1-3-th electrode of the first semiconductor chip and the 2-2-th electrode of the second semiconductor chip, and a sealing member formed to surround the first metal plate, the second metal plate, and the third metal plate.

Abstract: Disclosed herein is a power factor correction circuit, including: a boost converter circuit in which a plurality of boost circuits including a boost inductor, a rectifying diode, and a boost switch are connected with each other; and a snubber circuit including a snubber inductor and a snubber switch so as to snubber the boost converter circuit. The snubber inductor is controlled so as to be turned on before the boost inductor is turned on to apply zero voltage to the boost inductor. It is possible to reduce switching loss occurring when the boost switch is turned on and increase efficiency of an AC-DC power supply apparatus.

Abstract: There are provided a power semiconductor module and a manufacturing method thereof, the power semiconductor module including: a lead frame; a base substrate including a circuit wiring formed on an insulating layer thereof; a plurality of power semiconductor devices disposed to contact the circuit wiring; and a multilayer substrate formed by stacking a plurality of substrates and electrically connecting the power semiconductor devices and the lead frame to one another using a connection line formed therein and having conductivity.

Abstract: There is provided a power supply device including an alternating current (AC) power supply unit supplying a first primary current in a positive half cycle and supplying a second primary current in a negative half cycle; a transformer unit including a first transformer and a second transformer; a main switch unit including a first main switch and a second main switch; an auxiliary switch unit including a first auxiliary switch and a second auxiliary switch; an auxiliary inductor unit including a first auxiliary inductor and a second auxiliary inductor; and a path providing unit providing a conduction path based on power supplied from the AC power supply unit.