Abstract: A chuck assembly for holding a plate comprises a member configured to hold the plate, the member including a flexible portion configured to have a central opening, and a first cavity formed by the flexible portion, wherein the plate is held by the flexible portion by reducing pressure in the first cavity, a light-transmitting member covering the central opening of the member, and a fluid path in communication with a second cavity defined by the member, the plate held by the member and the light-transmitting member for pressurizing the second cavity.

Abstract: Techniques and mechanisms for cooling a substrate in a processing chamber by a bi-directional cooling process prior to transferring the substrate outside the processing chamber are provided. First cooling gas is introduced into the processing chamber from an upper gas source in a downward direction towards the upward facing surface of the substrate. An apparatus is placed underneath and in proximity to the substrate. Second cooling gas is introduced from the apparatus into the processing chamber in an upward direction towards the downward facing surface of the substrate. One or more gaps are cut out of the body portion of the apparatus, the gaps configured to allow the apparatus to avoid contact with the support structure holding the substrate, as the apparatus is moved in a horizontal direction into position underneath the substrate during placement of the body portion of the apparatus in proximity to the substrate.

Abstract: An antenna structure according to an embodiment of the present invention includes a dielectric layer, a radiator disposed on the dielectric layer, a transmission line branching from the radiator, a signal pad electrically connected to the radiator through the transmission line on the dielectric layer, and an external circuit structure bonded to the signal pad. The signal pad includes a bonding region that is bonded to the external circuit structure and a margin region that is not bonded to the external circuit structure and is adjacent to the bonding region. An area ratio of the margin region relative to the bonding region in the signal pad is 0.05 or more and less than 0.5.

Abstract: An antenna device according to an embodiment of the present invention includes a substrate layer, an antenna unit formed on a top surface of the substrate layer, a circuit wiring disposed on the top surface of the substrate layer and directly connected to the antenna unit, a stress compensation layer covering the circuit wiring on the top surface of the substrate layer and having a thickness greater than a thickness of the substrate layer, a first dielectric layer formed on a bottom surface of the substrate layer to overlap the circuit wiring in a planar view, and a first ground layer overlapping the circuit wiring in the planar view with the first dielectric layer or the stress compensation layer interposed therebetween.

Abstract: An antenna package according to an embodiment includes an antenna device comprising an antenna unit, and a connector electrically connected to the antenna unit. The connector includes an insulator having a dielectric constant from 2 to 3.5 and a loss tangent from 0.0015 to 0.007 measured by a resonance method at 10 GHz, and a conductive connection structure insulated by the insulator and electrically connected to the antenna unit.

Abstract: An antenna package includes a first antenna device including a first antenna unit, a second antenna device disposed at a level different from that of the first antenna device, the second antenna device including a second antenna unit that has a radiation direction different from that of the first antenna unit, a first circuit board electrically connected to the first antenna unit, a second circuit board electrically connected to the second antenna unit, and a third circuit board electrically and independently connected to the first circuit board and the second circuit board, the third circuit board having at least one antenna driving integrated circuit (IC) chip mounted thereon.

Abstract: A circuit board according to an embodiment includes a core layer including a first region and a second region, and antenna power supply wirings disposed on the core layer over the first region and the second region. The antenna power supply wirings may include a first portion extending in a first direction in the first region, a second portion extending in a second direction in the first region, and a third portion extending in the first direction in the second region, and an interval between the neighboring second portions of the antenna power supply wirings is 3 times or less of an interval between the neighboring third portions of the antenna power supply wirings.

Abstract: A circuit board according to an embodiment includes a first substrate including an antenna feeder line formed thereon to connect an antenna driving unit and an antenna, a second substrate including a data line formed thereon to transmit data processed in the antenna driving unit to an electronic component, and a third substrate which is disposed between the first substrate and the second substrate, and includes a power supply line formed thereon to supply a power to the antenna driving unit.

Abstract: An antenna device according to an aspect includes a dielectric layer, a radiator formed on the dielectric layer, and a transmission line connected to the radiator on the dielectric layer and formed in a mesh structure which is a set of unit cells defined by a plurality of conductive lines. A width of the transmission line may be an integer multiple of the width of the unit cell, and may be within an allowable error range.

Abstract: A touch sensor may include a substrate, a sensing pattern, and bridge electrodes. The sensing pattern may include a first pattern along a first direction and a second pattern along a second direction. The second pattern may include unit patterns isolated from each other. The bridge may electrically connect neighboring unit patterns, and the bridge electrodes adjacent in the first direction may be parallel to each other. An angle between an extending direction of the bridge electrode and the first direction may be from 45° to 89°. The substrate, the bridge electrode and the sensing pattern may be bent together to form a bending portion. The bridge electrode may extend in a direction the same as a bending direction. A bending angle between a body of the substrate which is not bent and an end portion of the bending portion may be greater than 0° and less than 180°.

Abstract: An antenna-inserted electrode structure according to an embodiment includes a substrate layer having a touch sensing region and an antenna-touch sensing region, first sensing electrodes arranged on the touch sensing region of the substrate layer, second sensing electrodes arranged on the antenna-touch sensing region of the substrate layer, and an antenna unit spaced apart from the second sensing electrodes on the antenna-touch sensing region of the substrate layer. The antenna unit and the second sensing electrodes include a conductive material having a lower resistance than that of the first sensing electrodes.

Abstract: A template for imprint lithography can include a body. The body can include a base surface and have a recession extending from the base surface lying along a base plane, the recession including a main portion having a tapered sidewall. In a particular embodiment, the recession includes an intermediate portion having an intermediate sidewall. The intermediate sidewall is rounded or at least part of the intermediate sidewall lies at a different angle as compared to an average tapered angle of the main portion. In another aspect, a method of fabricating a semiconductor device can include forming a patterned resist layer having a tapered sidewall over a substrate having device layers; patterning the device layers using the patterned resist layer; and etching portions of at least some of device layers to expose lateral portions of the at least some device layers. The template is well suited for forming 3D memory arrays.

Abstract: Some devices and systems comprise one or more walls of a reaction chamber; an adjustable gap in the one or more walls, wherein the adjustable gap is formed between a first gap surface and a second gap surface facing the first gap surface, and wherein a distance between the first gap surface and the second gap surface is adjustable; a plurality of stops, wherein each stop of the plurality of stops is positioned on either the first gap surface or the second gap surface, wherein the plurality of stops ensure a minimum distance of the adjustable gap, wherein a total length of the plurality of stops is less than 1% of a length of the first gap surface; and one or more vacuum ports in the first gap surface or the second gap surface.

Abstract: A method of deposition is disclosed. The method can include dispensing a formable material over a substrate, where the substrate includes a non-uniform surface topography, and where the substrate includes an active zone and an exclusion zone. The method can also include curing the formable material in the exclusion zone to form a circular edge between the exclusion zone and the active zone, contacting the formable material with a superstrate, and curing the formable material in the active zone to form a layer over the substrate, wherein curing is performed while the superstrate is contacting the formable material.

Abstract: An antenna stack structure according to an embodiment includes an antenna substrate layer, an antenna unit disposed on a top surface of the antenna substrate layer, the antenna unit including a radiator and an antenna pad, and a display panel including a grounding element disposed on a bottom surface of the antenna substrate layer. The antenna pad is superimposed over the grounding element in a planar view. Signaling and radiation properties can be improved utilizing the antenna pad.

Abstract: A system for forming a layer on a substrate, the system comprising a dispensing station configured to dispense formable material on the substrate, a shaping station configured to contact the dispensed formable material on the substrate with a plate, and a positioning system. The positioning system includes a hand configured to hold the substrate, a cover having an underside surface facing the hand and a topside surface opposite the underside surface, the cover being configured such that the underside surface covers the substrate and the dispensed formable material when the cover is positioned over the hand, and a plurality of support pads positioned on the topside surface of the cover, the plurality of support pads being configured to support the plate.

Abstract: Techniques and mechanisms for cooling a substrate in a processing chamber by a bi-directional cooling process prior to transferring the substrate outside the processing chamber are provided. First cooling gas is introduced into the processing chamber from an upper gas source in a downward direction towards the upward facing surface of the substrate. An apparatus is placed underneath and in proximity to the substrate. Second cooling gas is introduced from the apparatus into the processing chamber in an upward direction towards the downward facing surface of the substrate. One or more gaps are cut out of the body portion of the apparatus, the gaps configured to allow the apparatus to avoid contact with the support structure holding the substrate, as the apparatus is moved in a horizontal direction into position underneath the substrate during placement of the body portion of the apparatus in proximity to the substrate.

Abstract: A method of shaping a surface comprises dispensing formable material onto a substrate held by a substrate chuck, contacting a plate held by a plate chuck assembly with the formable material to form a film, curing the film to form a cured layer, initiating a separation front between the cured layer and the plate, tilting the plate chuck assembly and/or the substrate chuck in a direction away from the initial separation point, thereby propagating the separation front, applying a force to the plate chuck assembly and/or the substrate chuck away from the other while maintaining or increasing the tilt, until the separation front completely propagates around the cured layer, and continuing to apply the force, until the plate does not contact the cured layer. The plate chuck assembly includes a flexible portion with a central opening, and a cavity formed by the flexible portion. The plate is held by the flexible portion.

Abstract: An antenna device according to an embodiment includes a dielectric layer, a first radiator disposed on the dielectric layer in a first direction, a second radiator disposed on the dielectric layer in a second direction, a first transmission line which extends in the first direction to be connected to the first radiator, and a second transmission line which extends in the second direction to be connected to the second radiator, and intersects the first transmission line with being physically or electrically spaced apart therefrom.

Abstract: An antenna package according to an embodiment includes an antenna unit and a circuit board bonded to the antenna unit. The circuit board includes a core layer comprising a plurality of portions having different widths from each other in a planar view, the core layer having a first surface and a second surface opposing each other, and a circuit wiring disposed on the first surface of the core layer and electrically connected to the antenna unit.