Patents by Inventor Cai Wang

Cai Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240146735
    Abstract: A method and an apparatus for processing a multi-cloud service, an electronic device, a storage medium and a system are provided. The method includes acquiring a target multi-cloud scheduling instruction, where the target multi-cloud scheduling instruction includes a multi-cloud scheduling demand and description of schedule-required information; transmitting an application for the schedule-required information to a target user in a trusted environment based on the description of the schedule-required information, to obtain the schedule-required information; generating a scheduling strategy in the trusted environment based on the target multi-cloud scheduling instruction and the schedule-required information; and initiating scheduling to a target cloud vendor based on the scheduling strategy to obtain a scheduling result.
    Type: Application
    Filed: October 31, 2023
    Publication date: May 2, 2024
    Inventors: Jiawei LIU, Zhihua CAO, Cai XU, Ziqi YANG, Yisheng JIANG, Jian WANG
  • Publication number: 20240126523
    Abstract: Methods, systems, and computer-readable storage media for retrieving, by a smart setup system, a component configuration metadata file corresponding to an application, the component configuration metadata file including component metadata representing components that the application uses during runtime, parsing, by a parser of the smart setup system, the component configuration metadata file to provide a set of data objects, each corresponding to a respective component in the set of components, providing, by an emitter of the smart setup system, a set of checking scripts and a set of installation scripts by, for each component in the set of components, providing a checking script and an installation script using a respective data object, and executing, by the smart setup system, each checking script in the set of checking scripts, and in response, receiving a set of check results, each check results indicating whether pre-requisites of a respective component are met.
    Type: Application
    Filed: October 13, 2022
    Publication date: April 18, 2024
    Inventors: Jonala Srinivas, Xiang Cai, Qiu Shi Wang
  • Patent number: 11943373
    Abstract: An identity certificate may be issued to a blockchain node. The issuance may include issuing a first identity certificate to a first terminal and receiving a second identity certificate issuance request that is from the first terminal. A second identity certificate may be issued to the first terminal, and a third identity certificate issuance request is received from the second terminal. A third identity certificate is issued to the second terminal, so that the second terminal forwards the third identity certificate to the third terminal.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: March 26, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Mao Cai Li, Zong You Wang, Kai Ban Zhou, Chang Qing Yang, Hu Lan, Li Kong, Jin Song Zhang, Yi Fang Shi, Geng Liang Zhu, Qu Cheng Liu, Qiu Ping Chen
  • Patent number: 11771126
    Abstract: The present invention discloses a multi-station adaptive walnut shell pre-breaking system, comprising a feeding device and a shell pre-breaking device.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: October 3, 2023
    Assignees: QINGDAO UNIVERSITY OF TECHNOLOGY, XINJIANG JIANG NING LIGHT INDUSTRIAL MACHINERY ENGINEERING TECHNOLOGY CO., LTD.
    Inventors: Changhe Li, Mingcun Shi, Yiping Feng, Yitian Feng, Zhenming Jia, Leilei Zhao, Rong Wang, Yucheng Wang, Yanbin Zhang, Ji Che, Runze Li, Cai Wang, Min Yang, Yali Hou
  • Publication number: 20230248046
    Abstract: Disclosed is a continuous feeding mechanism including a transfer mechanism, wherein the transfer mechanism includes a rotatable indent roller circumferentially provided with a plurality of blanking grooves; a post pin is arranged in each blanking groove; the post pin is connected with a spring; the spring is arranged towards the interior of the indent roller; and the post pin can move along the blanking grooves; a feeding box, wherein the bottom of the feeding box is hollow, and the bottom is arranged above the indent roller or the bottom is fixedly connected with the indent roller; the continuous feeding mechanism is arranged above one side of the transfer mechanism; and an electromagnetic heating mechanism which includes a supporting frame, wherein the transfer mechanism is arranged in the supporting frame, and an electromagnetic coil is circumferentially arranged outside the supporting frame.
    Type: Application
    Filed: October 28, 2022
    Publication date: August 10, 2023
    Applicants: QINGDAO UNIVERSITY OF TECHNOLOGY, XINJIANG JIANGNING LIGHT INDUSTRY MACHINERY ENGINEERING TECHNOLOGY CO., LTD
    Inventors: Changhe LI, Mingzheng LIU, Ji CHE, Sanqiang ZHANG, Yanbin ZHANG, Dongzhou JIA, Cai WANG, Weidong XIE, Qianqian ZHAO, Mingchuang KANG, Enhao LIU, Zhaohua LI, Yali HOU
  • Publication number: 20230015074
    Abstract: A method of fabricating an optical lens disclosed herein includes forming a layer of a flat lens structure on a front surface of a substrate, depositing a protective metal layer on the layer of the flat lens structure and on a back surface of the substrate, wherein the protective layer includes chromium, gold, titanium, or nickel, wherein the back surface is located opposite to and away from the front surface having the layer of the flat lens structure, irradiating the protective metal layer at the front surface with a laser to form a channel (i) through the protective metal layer, (ii) through the layer of the flat lens structure and (iii) in the substrate, removing the protective metal layer at the front surface and the back surface of the substrate, and separating the layer of the flat lens structure from the substrate to obtain the optical lens, wherein the channel has a depth defined by a thickness of the substrate remaining at the channel after irradiating the protective metal layer at the front surface
    Type: Application
    Filed: November 20, 2020
    Publication date: January 19, 2023
    Inventors: Jinghua Teng, Xin Cai Wang, Xiaosong Eric Tang, Guang Hui Paul Lim, Jie Deng, Kai Dong Ye, Soo Seng Norman Ang
  • Patent number: 11517037
    Abstract: Disclosed is a continuous feeding mechanism including a transfer mechanism, wherein the transfer mechanism includes a rotatable indent roller circumferentially provided with a plurality of blanking grooves; a post pin is arranged in each blanking groove; the post pin is connected with a spring; the spring is arranged towards the interior of the indent roller; and the post pin can move along the blanking grooves; a feeding box, wherein the bottom of the feeding box is hollow, and the bottom is arranged above the indent roller or the bottom is fixedly connected with the indent roller; the continuous feeding mechanism is arranged above one side of the transfer mechanism; and an electromagnetic heating mechanism which includes a supporting frame, wherein the transfer mechanism is arranged in the supporting frame, and an electromagnetic coil is circumferentially arranged outside the supporting frame.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: December 6, 2022
    Assignees: QINGDAO UNIVERSITY OF TECHNOLOGY, XINJIANG JIANGNING LIGHT INDUSTRY MACHINERY ENGINEERING TECHNOLOGY CO., LTD
    Inventors: Changhe Li, Mingzheng Liu, Ji Che, Sanqiang Zhang, Yanbin Zhang, Dongzhou Jia, Cai Wang, Weidong Xie, Qianqian Zhao, Mingchuang Kang, Enhao Liu, Zhaohua Li, Yali Hou
  • Publication number: 20220227917
    Abstract: Described herein is a polyurethane foam produced in a “one shot process” that has low density, is semi-hard, and displays a high rebound value all while providing superior split tear performance. The polyurethane foam can be used in a “one shot process” to produce a shoe sole, a mid-sole or an insole for a shoe. The shoe sole may be used for forming an outer sole of a sandal type shoe, a midsole of an athletic type shoe, or an insole for insertion into any type of shoe.
    Type: Application
    Filed: April 29, 2020
    Publication date: July 21, 2022
    Inventors: Cai An Wang, Chang Xi Li, Ren Zheng Zhang
  • Publication number: 20220032376
    Abstract: A metals-based additive manufacturing machine and method are disclosed. The machine and method include a hybrid temperature monitoring system. The hybrid temperature monitoring system includes a Raman spectrometer, a single-element ultrasound transducer, and a phased-array ultrasound pair. The hybrid temperature monitoring system can generate a real-time three-dimensional temperature map of the melt pool and optionally a portion of the metal powder base and/or a formed portion of a desired artifact. The real-time three-dimensional temperature map can be used for optimizing the metals-based additive manufacturing process in real-time or during subsequent process runs.
    Type: Application
    Filed: July 29, 2021
    Publication date: February 3, 2022
    Inventors: Michael Cai Wang, Rasim Guldiken
  • Publication number: 20210401025
    Abstract: A multi-station adaptive walnut shell pre-breaking system, including a feeding device and a shell pre-breaking device. The feeding device includes a feeding box, a single-helix twister and a double-helix twister are disposed in the feeding box, the single-helix twister and the double-helix twister rotate in opposite directions, and an adjustable spring partition is disposed below the single-helix twister and the double-helix twister; the shell pre-breaking device includes a shell pre-breaking box, a plurality of squeezing stations are provided in the shell pre-breaking box, each of the squeezing stations is provided with a shell pre-breaking assembly, the shell pre-breaking assembly includes a falling U-shaped plate and a squeezing U-shaped plate.
    Type: Application
    Filed: October 29, 2019
    Publication date: December 30, 2021
    Applicants: QINGDAO UNIVERSITY OF TECHNOLOGY, XINJIANG JIANG NING LIGHT INDUSTRIAL MACHINERY ENGINEERING TECHNOLOGY CO., LTD.
    Inventors: Changhe LI, Mingcun SHI, Yiping FENG, Yitian FENG, Zhenming JIA, Leilei ZHAO, Rong WANG, Yucheng WANG, Yanbin ZHANG, Ji CHE, Runze LI, Cai WANG, Min YANG, Yali HOU
  • Publication number: 20210245395
    Abstract: A method of forming a layered material including arranging a 2DLM on a base material comprising one or more Moiré interferences, and adding material or removing material at a location of the one or more Moiré interferences.
    Type: Application
    Filed: February 8, 2021
    Publication date: August 12, 2021
    Inventors: Michael Cai Wang, YunJo Jeong
  • Publication number: 20200335272
    Abstract: A transmitter coil includes a winding part. The winding part is a circular-shaped spirally-wound coil with a hollow portion. The outer diameter of the winding part is in the range between 56 mm and 66 mm. The inner diameter of the winding part is in the range between 30 mm and 40 mm. The turn number of the winding part is in the range between 7 and 13. A transmitting module with the transmitter coil and a wireless charging device with the transmitter coil are also provided.
    Type: Application
    Filed: July 25, 2019
    Publication date: October 22, 2020
    Inventor: Sheng-Cai Wang
  • Publication number: 20200335273
    Abstract: A transmitter coil includes a winding part. The winding part is an elliptic-shaped spirally-wound coil with a hollow portion. The outer major axis length of the winding part is in the range between 78 mm and 82 mm. The outer minor axis length of the winding part is in the range between 44 mm and 48 mm. The inner major axis length of the winding part is in the range between 54 mm and 58 mm. The inner minor axis length of the winding part is in the range between 19 mm and 23 mm. The turn number of the winding part is in the range between 8 and 12. A transmitting module with the transmitter coil and a wireless charging device with the transmitter coil are also provided.
    Type: Application
    Filed: July 25, 2019
    Publication date: October 22, 2020
    Inventor: Sheng-Cai Wang
  • Publication number: 20200231740
    Abstract: Described herein is a composition which can produce elastomeric microcellular foam having improved and well-balanced mechanical properties, including a polyisocyanate, a polyol, a lactam, a surfactant and a blowing agent. Also described herein is a process to produce elastomeric microcellular polyurethane foam, and the use of the elastomeric microcellular polyurethane foam in footwear foam.
    Type: Application
    Filed: September 12, 2018
    Publication date: July 23, 2020
    Inventors: Li Zhang, Markus Schuette, Xiaojun WU, Cai An WANG, Ren Zheng ZHANG
  • Publication number: 20200138083
    Abstract: The disclosure discloses an automated production system for efficient walnut shell-breaking, kernel-taking and shell-kernel separation, solving the problem that the existing walnut shell breaking device cannot adapt to walnuts having different sizes and shell breaking rate and shell breaking efficiency cannot be ensured. The system can realize efficient shell-breaking, kernel-taking and shell-kernel separation on different varieties of walnuts, is quick in production speed and high in automation degree, and meanwhile is capable of improving entire kernel rate and kernel obtaining rate, reducing the damage rate of the walnut kernel and ensuring the high shell-breaking efficiency and thoroughness of shell and kernel separation.
    Type: Application
    Filed: December 12, 2019
    Publication date: May 7, 2020
    Inventors: Changhe LI, Mingzheng LIU, Ji CHE, Yali HOU, Yanbin ZHANG, Dongzhou JIA, Cai WANG, Pengfei YUAN, Yuan HONG
  • Publication number: 20200128866
    Abstract: Disclosed is a continuous feeding mechanism including a transfer mechanism, wherein the transfer mechanism includes a rotatable indent roller circumferentially provided with a plurality of blanking grooves; a post pin is arranged in each blanking groove; the post pin is connected with a spring; the spring is arranged towards the interior of the indent roller; and the post pin can move along the blanking grooves; a feeding box, wherein the bottom of the feeding box is hollow, and the bottom is arranged above the indent roller or the bottom is fixedly connected with the indent roller; the continuous feeding mechanism is arranged above one side of the transfer mechanism; and an electromagnetic heating mechanism which includes a supporting frame, wherein the transfer mechanism is arranged in the supporting frame, and an electromagnetic coil is circumferentially arranged outside the supporting frame.
    Type: Application
    Filed: December 23, 2019
    Publication date: April 30, 2020
    Inventors: Changhe LI, Mingzheng LIU, Ji CHE, Sanqiang ZHANG, Yanbin ZHANG, Dongzhou JIA, Cai WANG, Weidong XIE, Qianqian ZHAO, Mingchuang KANG, Enhao LIU, Zhaohua LI, Yali HOU
  • Patent number: 10541140
    Abstract: A process for metalizing a through silicon via feature in a semiconductor integrated circuit device, the process including, during the filling cycle, reversing the polarity of circuit for an interval to generate an anodic potential at said metalizing substrate and desorb leveler from the copper surface within the via, followed by resuming copper deposition by re-establishing the surface of the copper within the via as the cathode in the circuit, thereby yielding a copper filled via feature.
    Type: Grant
    Filed: January 26, 2012
    Date of Patent: January 21, 2020
    Assignee: MACDERMID ENTHONE INC.
    Inventors: Thomas B. Richardson, Joseph A. Abys, Wenbo Shao, Chen Wang, Vincent Paneccasio, Jr., Cai Wang, Xuan Lin, Theodore Antonellis
  • Patent number: 10221496
    Abstract: A method for metallizing a through silicon via feature in a semiconductor integrated circuit device substrate. The method comprises immersing the semiconductor integrated circuit device substrate into an electrolytic copper deposition composition, wherein the through silicon via feature has an entry dimension between 1 micrometers and 100 micrometers, a depth dimension between 20 micrometers and 750 micrometers, and an aspect ratio greater than about 2:1; and supplying electrical current to the electrolytic deposition composition to deposit copper metal onto the bottom and sidewall for bottom-up filling to thereby yield a copper filled via feature.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: March 5, 2019
    Assignee: MacDermid Enthone Inc.
    Inventors: Thomas B. Richardson, Wenbo Shao, Xuan Lin, Cai Wang, Vincent Paneccasio, Jr., Joseph A. Abys, Yun Zhang, Richard Hurtubise, Chen Wang
  • Publication number: 20190003068
    Abstract: A method for metallizing a through silicon via feature in a semiconductor integrated circuit device substrate. The method comprises immersing the semiconductor integrated circuit device substrate into an electrolytic copper deposition composition, wherein the through silicon via feature has an entry dimension between 1 micrometers and 100 micrometers, a depth dimension between 20 micrometers and 750 micrometers, and an aspect ratio greater than about 2:1; and supplying electrical current to the electrolytic deposition composition to deposit copper metal onto the bottom and sidewall for bottom-up filling to thereby yield a copper filled via feature.
    Type: Application
    Filed: May 24, 2011
    Publication date: January 3, 2019
    Applicant: ENTHONE INC.
    Inventors: Thomas B. Richardson, Wenbo Shao, Xuan Lin, Cai Wang, Vincent Paneccasio, JR., Joseph A. Abys, Yun Zhang, Richard Hurtubise, Chen Wang
  • Patent number: 10103029
    Abstract: A process for metalizing a through silicon via feature in a semiconductor integrated circuit device, the process including, during the filling cycle, reversing the polarity of circuit for an interval to generate an anodic potential at said metalizing substrate and desorb leveler from the copper surface within the via, followed by resuming copper deposition by re-establishing the surface of the copper within the via as the cathode in the circuit, thereby yielding a copper filled via feature.
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: October 16, 2018
    Assignee: MacDermid Enthone Inc.
    Inventors: Thomas B. Richardson, Joseph A. Abys, Wenbo Shao, Chen Wang, Vincent Paneccasio, Cai Wang, Sean Xuan Lin, Theodore Antonellis