Abstract: The present disclosure relates to an anodizing apparatus that may include: a body; a jig tray disposed inside the body and having a plurality of coupling holes formed to pass therethrough in an upward and downward direction thereof; a plurality of jigs detachably coupled correspondingly to the plurality of coupling holes of the jig tray to fix a plurality of objects to be anodized thereto at a time; and an anodizing unit adapted to perform an anodizing process for the plurality of objects to be anodized and having a plurality of accommodation parts for storing electrolytes therein.

Abstract: The present disclosure relates to a thin film manufacturing apparatus including a chamber having an inner process space of a substrate, a substrate support unit connected to the chamber to support the substrate in the chamber, a heat source unit connected to the chamber and disposed opposite to the substrate support unit, a plasma generation unit connected to one side of the chamber to supply radicals between the substrate support unit and the heat source unit, and a baffle connected to the chamber and including a movement passage of the radicals therein and a plurality of first exhaust holes communicating with the movement passage, which are formed in a top surface thereof. The thin film manufacturing apparatus may improve uniformity of the thin film formed on the substrate.

Abstract: A method for manufacturing a vehicle wheel includes: a casting process of manufacturing the wheel in a one-piece body having a forming end and a temporary flange protruding at inner and outer sides of the wheel, respectively, wherein the one-piece body further includes a resonance chamber forming groove; a primary shape machining process of forming a stepped part at an outer circumferential side of the resonance chamber forming groove; a flow forming process of bending the forming end to be seated on the stepped part; a friction stir welding process of integrally bonding a portion where the forming end and the stepped part are in close contact with each other; a fine machining process of removing the temporary flange; and a sound-absorbing hole machining process of forming a sound-absorbing hole for communicating between the resonance chamber and an interior space of a tire in the forming end.

Abstract: A display device includes a display area including pixel areas; a non-display area; and a pixel provided in each pixel area. The pixel may include first to third areas divided from each other in a direction; first and second sub-electrodes provided in each of the first to third areas, and spaced apart from each other; light emitting elements provided in each of the first to third areas, and disposed between the first and second sub-electrodes; a bridge pattern disposed in each of the first to third areas under the first and second sub-electrodes of the corresponding area with an insulating layer disposed therebetween; a first contact electrode provided in each of the first to third areas on the first sub-electrode of the corresponding area; and a second contact electrode provided in each of the first to third areas on the second sub-electrode of the corresponding area.

Abstract: A method for manufacturing a LiDAR device is proposed. The method may include providing a LiDAR module including a laser emitting module and a laser detecting module to a target region. The method may also include adjusting, on the basis of first detecting data obtained from the laser detecting module, a relative position of a detecting optic module with respect to the laser detecting module. The method may further include adjusting, on the basis of image data obtained from at least one image sensor, a relative position of an emitting optic module with respect to the laser emitting module.

Abstract: A three-dimensional semiconductor integrated circuit device including an inter-die interface is provided. The device includes a top die including a plurality of micro cells provided on a top surface of the top die, a plurality of micro bumps provided on a bottom surface of the top die, and wiring patterns connecting the plurality of micro cells to the plurality of micro bumps; and a bottom die including a plurality of macro cells provided on a top surface thereof, wherein the plurality of macro cells are electrically connected to the plurality of micro bumps, respectively, wherein a size of a region in which the plurality of micro cells are provided is smaller than a size of a region in which the plurality of micro bumps are provided.

Abstract: The present invention discloses an encoding apparatus using a Discrete Cosine Transform (DCT) scanning, which includes a mode selection means for selecting an optimal mode for intra prediction; an intra prediction means for performing intra prediction onto video inputted based on the mode selected in the mode selection means; a DCT and quantization means for performing DCT and quantization onto residual coefficients of a block outputted from the intra prediction means; and an entropy encoding means for performing entropy encoding onto DCT coefficients acquired from the DCT and quantization by using a scanning mode decided based on pixel similarity of the residual coefficients.

Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and internal electrodes, and an external electrode disposed on the body and connected to the internal electrodes. The body includes an active portion including the plurality of internal electrodes to form capacitance, and cover portions disposed on the active portion, and the cover portions include an outer cover portion including a carbon compound and an inner cover portion disposed between the active portion and the outer cover portion. An average carbon content (Cc2) of the outer cover portion compared to an average carbon content (Cc1) of the inner cover portion satisfies 100?Cc2/Cc1?10,000.

Abstract: A core-shell copolymer, a method of making the same, and a thermoplastic resin composition including the same are disclosed herein. In some embodiments, a core-shell copolymer includes a core and a shell surrounding the core, the core includes a conjugated diene-based monomer-derived repeating unit and a phosphate-based cross-linking agent-derived cross-linking part represented by Formula 1, and the shell includes a first alkyl (meth)acrylate monomer-derived repeating unit, a second alkyl (meth)acrylate monomer-derived repeating unit, and a sulfonate-based ionic monomer-derived repeating unit represented by Formula 2. The core is 68 parts to 92 parts and the shell is 8 parts to 32 parts, based on 100 parts of the core-shell copolymer, the core has a swell index of 2.7 to 10.9, the shell includes 1 wt % to 16 wt % of the sulfonate-based ionic monomer-derived repeating unit, and the shell has a weight average molecular weight of 105,000 g/mol to 645,000 g/mol.

Abstract: An embodiment of the present disclosure may provide a method of detecting a fault location using an acoustic emission signal, including a measuring step of measuring, by a signal measuring unit including at least three sensors disposed in a diagnosed subject and isolated from one another, an acoustic emission signal generated from a faulty part of the diagnosed subject, a signal pre-processing step of filtering and amplifying, by the signal pre-processing unit, the acoustic emission signal, an extraction step of extracting, by a data operation unit, a measuring time, that is, the time when the acoustic emission signal reaches each of the at least three sensors of the signal measuring unit, and a first analysis step of analyzing, by a data analysis unit, a location and occurrence time of the faulty part by using the measuring time and location information of the signal measuring unit.

Abstract: A data processing device includes a controller. The controller includes a compression circuit configured to compare a plurality of data groups, each of which has a first burst length and is transmitted in units of an input/output width, with a predetermined pattern, and perform data compression on the data groups based on a result of comparison. The controller further includes a compression data restructuring circuit configured to generate a transmission data group by restructuring the compressed data group to have a second burst length.

Abstract: Disclosed is a backlight unit and LCD device having a fixing device attached to a bottom cover and a guide panel to prevent the guide panel from shifting and detaching from the bottom cover. The backlight unit comprises a bottom cover having a bottom portion including a first hole, and a side portion having a second hole; a light guide plate on the bottom portion of the bottom cover; at least one optical sheet on the light guide plate; a guide panel adjacent the guide plate and the optical sheet; and a fixing device. The fixing device includes a horizontal portion; and a side portion extending perpendicularly from the horizontal portion. The side portion includes second protrusion portions extending inward from an edge of the side portion and parallel to the horizontal portion, and supporting portions extending vertically from the side portion at distal ends of the side portion.

Abstract: A data processing device includes a compression circuit and a padding circuit. The compression circuit is configured to compare pairs of two contiguous bits within data composed of 2n bits (where n is a natural number), and compress the data based on a result of the comparison. The padding circuit is configured to generate transmission data of 2n bits by padding the compressed data with a dummy pad.

Abstract: Disclosed is a method and a system for realizing a Pay Per View (PPV) purchasing mechanism.

Abstract: Disclosed is a backlight unit and LCD device having a fixing device attached to a bottom cover and a guide panel to prevent the guide panel from shifting and detaching from the bottom cover. The backlight unit comprises a bottom cover having a bottom portion including a first hole, and a side portion having a second hole; a light guide plate on the bottom portion of the bottom cover; at least one optical sheet on the light guide plate; a guide panel adjacent the guide plate and the optical sheet; and a fixing device. The fixing device includes a horizontal portion; and a side portion extending perpendicularly from the horizontal portion. The side portion includes second protrusion portions extending inward from an edge of the side portion and parallel to the horizontal portion, and supporting portions extending vertically from the side portion at distal ends of the side portion.

Abstract: A stacked package including: a semiconductor substrate, a circuit layer formed over the semiconductor substrate, a bump formed over the circuit layer, a spare bump formed correspondingly to the bump and over the circuit layer, and configured for replacing the bump with the spare bump, a through electrode configuring to pass through the semiconductor substrate on a same line as the bump and electrically coupled the bump or the spare bump in response to a selection signal, and a spare through electrode configured to pass through the semiconductor substrate on a same line as the spare bump and electrically coupled with the bump or the spare bump in response to a selection signal. When a bump has failed, a vertical input/output line of the semiconductor chips is established by a spare bump corresponding to the failed bump through the selective signal routing.

Abstract: A semiconductor package includes a first substrate, a plurality of memory chips horizontally disposed on the first substrate, and having one surfaces which face the first substrate, other surfaces which face away from the one surfaces, and first bumps formed on the other surfaces, a second substrate disposed on the plurality of memory chips and electrically connected, a sub-substrate horizontally disposed on the first substrate together with the plurality of memory chips and electrically connecting the first substrate and the second substrate, and a driving chip having second bumps on one surface thereof and mounted to the second substrate such that the second bumps are electrically connected with the second substrate.

Abstract: A data processing device includes a compression circuit and a padding circuit. The compression circuit is configured to compare pairs of two contiguous bits within data composed of 2n bits (where n is a natural number), and compress the data based on a result of the comparison. The padding circuit is configured to generate transmission data of 2n bits by padding the compressed data with a dummy pad.

Abstract: A data processing device includes a controller. The controller includes a compression circuit configured to compare a plurality of data groups, each of which has a first burst length and is transmitted in units of an input/output width, with a predetermined pattern, and perform data compression on the data groups based on a result of comparison. The controller further includes a compression data restructuring circuit configured to generate a transmission data group by restructuring the compressed data group to have a second burst length.

Abstract: A semiconductor device including a chip stack structure having a plurality of semiconductor chips, the semiconductor chips being stacked such that they are electrically connected using through-electrodes, and a support frame attached to a side surface of the chip stack structure.