Patents by Inventor Chang Yu

Chang Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11963139
    Abstract: Embodiments of the application provide a sidelink logical channel multiplexing method and apparatus. After determining a first sidelink logical channel (SL LCH) that meets a first preset condition in at least one SL LCH, a terminal allocates a resource to data of the first SL LCH. Then, when a remaining resource of transmission resources is more than zero, the terminal determines, according to a communication range of the first SL LCH, a second SL LCH that meets a second preset condition, and allocates a resource to data of the second SL LCH. The first SL LCH and the second SL LCH are different. In the method, such a parameter as a communication range is considered in a multiplexing process, and data of SL LCHs with same or different communication ranges is multiplexed into a same transport block.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: April 16, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Chang Yu, Xiao Xiao, Junren Chang, Xiangdong Zhang
  • Publication number: 20240121642
    Abstract: Techniques and examples of determination of receiver (RX) beam for radio link monitoring (RLM) based on available spatial quasi-co-location (QCL) information in New Radio (NR) mobile communications are described. An apparatus receives downlink (DL) signaling from a network. The apparatus determines whether to extend an evaluation period of RLM based on a quasi-co-location (QCL) association provided in at least the DL signaling. The apparatus then executes extension of the evaluation period of the RLM, or not, based on a result of the determining.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 11, 2024
    Inventors: Hsuan-Li Lin, Kuhn-Chang Lin, Tsang-Wei Yu
  • Publication number: 20240118528
    Abstract: A microscope device for observing a sample. The microscope device and the sample are located on an optical route. The microscope device includes an objective lens unit and an additional light source set. The light source set includes a circuit substrate, a battery and a light-emitting unit. The circuit substrate has a power source portion and a light source portion electrically connected to the power source portion. A connecting member and the battery are arranged at opposite sides of the power source portion. The light-emitting unit is arranged on the light source portion, and the distance between the light-emitting unit and the center axis of the optical route is greater than the radius of the objective lens unit. The battery activates the light-emitting unit to generate a light beam, and the light beam irradiates toward the center axis of the optical route.
    Type: Application
    Filed: October 6, 2023
    Publication date: April 11, 2024
    Inventors: Chang-Ching YEH, Chang-Yu CHEN, Shu-Sheng LIN
  • Publication number: 20240116040
    Abstract: A submicron-sized Pickering miniemulsion system stabilized by carbon quantum dots solid nanoparticles for biphasic catalysis is disclosed, which breaks the existing limits for homogenization of the immiscible biphasic system and overcomes the issues for big size of solid particles-stabilized emulsion droplets. A method for producing the carbon quantum dot-based catalysts and a process of establishing the Pickering miniemulsion system for biphasic reaction with enhanced catalytic efficiency are also disclosed. The carbon quantum dot-stabilized Pickering miniemulsion features a pH-responsive behavior, with a reversible transition between the emulsification and demulsification, triggering the easy & facile product separation and emulsifier/catalyst recycling in one reaction vessel.
    Type: Application
    Filed: September 30, 2023
    Publication date: April 11, 2024
    Inventors: Jieshan Qiu, Chang Yu, Lin Ni, Ji Wen
  • Patent number: 11950997
    Abstract: An artificial cornea and an associated manufacturing method are disclosed. The artificial cornea has two sides, each of which has an associated microstructure. In an embodiment, microlines can be provided on an anterior side, and a posterior side can have micropores. Both the geometry of the microstructures and their dimensions can be customized for an individual patient. The geometry of the artificial cornea itself and its dimensions can also be customized as such. In addition, the lifetime of the artificial cornea can be significantly enhanced by adding co-polymer(s) into the hydrogel to strengthen its mechanical properties. Patient recovery can be aided by adding peptides into the artificial cornea surfaces to improve cell growth post-operation.
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: April 9, 2024
    Assignee: The Trustees of the Stevens Institute of Technology
    Inventors: Yiwen Xi, Chang-Hwan Choi, Xiaojun Yu, Junfeng Liang
  • Publication number: 20240112465
    Abstract: Various embodiments of the teachings herein include an image processing system comprising: a video stream processing device configured to receive a video stream, segment the video stream into multiple frames of pictures arranged in chronological order, and distribute the multiple frames of pictures to edge computing devices in a connected edge computing device group; and a picture collecting device configured to receive pictures from the edge computing device group. The individual edge computing devices in the edge computing device group are each configured to subject the received pictures to target identification, and send the pictures marked with a region in which an identified target is located. The picture collecting device is further configured to restore in chronological order as a video stream the received pictures marked with target identification results.
    Type: Application
    Filed: January 18, 2022
    Publication date: April 4, 2024
    Applicant: Siemens Aktiengesellschaft
    Inventors: Yue Yu, Chang Wei Loh, Wei Yu Chen, Tian Hua Pan, Sheng Bo Hu
  • Publication number: 20240112983
    Abstract: A semiconductor device includes a substrate, a semiconductor component and a heat dissipation component. The semiconductor component is disposed on the substrate. The heat dissipation component is disposed on the substrate and having a cavity, an inlet and an outlet, wherein the inlet and the outlet communicate with the cavity.
    Type: Application
    Filed: January 20, 2023
    Publication date: April 4, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Li WANG, Chen-Hua YU, Chuei-Tang WANG, Shih-Chang KU
  • Publication number: 20240113061
    Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.
    Type: Application
    Filed: December 5, 2023
    Publication date: April 4, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Mei-Ju LU, Chi-Han CHEN, Chang-Yu LIN, Jr-Wei LIN, Chih-Pin HUNG
  • Patent number: 11947208
    Abstract: This invention discloses a display panel including a first substrate, light emitting elements, a touch sensing structure and a conductive layer. The light emitting elements are disposed on the first substrate. The touch sensing structure is disposed on the first substrate and on a side away from a light emitting surface of the light emitting elements. The conductive layer is disposed between the light emitting elements and the first substrate and includes contacts or at least a portion of the touch sensing structure, and the light emitting elements and the contacts are electrically connected.
    Type: Grant
    Filed: August 15, 2022
    Date of Patent: April 2, 2024
    Assignee: HANNSTAR DISPLAY CORPORATION
    Inventors: Jing-Xuan Chen, Cheng-Yen Yeh, Mu-Kai Kang, Sz-Kai Huang, Ming-Chang Yu
  • Patent number: 11943939
    Abstract: An integrated circuit (IC) device includes a substrate and a circuit region over the substrate. The circuit region includes at least one active region extending along a first direction, at least one gate region extending across the at least one active region and along a second direction transverse to the first direction, and at least one first input/output (IO) pattern configured to electrically couple the circuit region to external circuitry outside the circuit region. The at least one first IO pattern extends along a third direction oblique to both the first direction and the second direction.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Meng-Kai Hsu, Jerry Chang Jui Kao, Chin-Shen Lin, Ming-Tao Yu, Tzu-Ying Lin, Chung-Hsing Wang
  • Patent number: 11942385
    Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: March 26, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Sheng-Yu Chen, Chang-Lin Yeh, Ming-Hung Chen
  • Patent number: 11942585
    Abstract: An optoelectronic package structure and a method of manufacturing an optoelectronic package structure are provided. The optoelectronic package structure includes a photonic component. The photonic component has an electrical connection region, a blocking region and a region for accommodating a device. The blocking region is located between the electrical connection region and the region for accommodating a device.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: March 26, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Cheng-Hsuan Wu, Chang-Yu Lin, Yu-Sheng Huang
  • Patent number: 11935794
    Abstract: A method of forming a semiconductor transistor device. The method comprises forming a channel structure over a substrate and forming a first source/drain structure and a second source/drain structure on opposite sides of the fin structure. The method further comprises forming a gate structure surrounding the fin structure. The method further comprises flipping and partially removing the substrate to form a back-side capping trench while leaving a lower portion of the substrate along upper sidewalls of the first source/drain structure and the second source/drain structure as a protective spacer. The method further comprises forming a back-side dielectric cap in the back-side capping trench.
    Type: Grant
    Filed: December 12, 2022
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Huan-Chieh Su, Cheng-Chi Chuang, Chih-Hao Wang, Zhi-Chang Lin, Li-Zhen Yu
  • Patent number: 11930995
    Abstract: A method for obtaining and processing image data by using a medical visual aid system including a monitor and an endoscope configured to be inserted into a body cavity and including an image capturing device and a light emitting device, the method including illuminating a field of view of the image capturing device with the light emitting device, capturing the image data using the image capturing device, providing a non-linear scaling model adapted to the body cavity, adjusting the image data by applying the non-linear scaling model such that adjusted image data is formed, and presenting the adjusted image data on the monitor.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: March 19, 2024
    Assignee: AMBU A/S
    Inventors: Finn Sonnenborg, Brian Nielsen, Curt Allan Johansson, Sebastian Ortega Zafra, Qian Yang, Kai-Cheng Chan, Wang Chang-Yu
  • Publication number: 20240087891
    Abstract: A method of patterning a substrate includes forming a first line, a second line, and a third line over the substrate, the first line, the second line, and the third line being parallel in a plan view, and forming a fourth line and a fifth line over the first line, the second line, and the third line, the fourth line and the fifth line being orthogonal to the first line in the plan view. The method further includes etching a hole through the second line using the first line, the third line, the fourth line, and the fifth line as an etching mask, and filling the hole with a dielectric material to form a block.
    Type: Application
    Filed: September 13, 2022
    Publication date: March 14, 2024
    Inventors: Eric Chih-Fang Liu, Shihsheng Chang, Kai-Hung Yu, Yun Han
  • Publication number: 20240088145
    Abstract: Examples of an integrated circuit with gate cut features and a method for forming the integrated circuit are provided herein. In some examples, a workpiece is received that includes a substrate and a plurality of fins extending from the substrate. A first layer is formed on a side surface of each of the plurality of fins such that a trench bounded by the first layer extends between the plurality of fins. A cut feature is formed in the trench. A first gate structure is formed on a first fin of the plurality of fins, and a second gate structure is formed on a second fin of the plurality of fins such that the cut feature is disposed between the first gate structure and the second gate structure.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 14, 2024
    Inventors: Zhi-Chang Lin, Wei-Hao Wu, Jia-Ni Yu, Chih-Hao Wang, Kuo-Cheng Ching
  • Publication number: 20240088119
    Abstract: Provided are a package structure and a method of forming the same. The method includes providing a first package having a plurality of first dies and a plurality of second dies therein; performing a first sawing process to cut the first package into a plurality of second packages, wherein one of the plurality of second packages comprises three first dies and one second die; and performing a second sawing process to remove the second die of the one of the plurality of second packages, so that a cut second package is formed into a polygonal structure with the number of nodes greater than or equal to 5.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Hung Lin, Hui-Min Huang, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng, Mirng-Ji Lii
  • Patent number: 11929319
    Abstract: Integrated fan-out packages and methods of forming the same are disclosed. An integrated fan-out package includes two dies, an encapsulant, a first metal line and a plurality of dummy vias. The encapsulant is disposed between the two dies. The first metal line is disposed over the two dies and the encapsulant, and electrically connected to the two dies. The plurality of dummy vias is disposed over the encapsulant and aside the first metal line.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh
  • Patent number: 11919932
    Abstract: Disclosed are a novel therapeutic means effective and practical against cancer, and a novel substance useful as such a therapeutic means. Provided are novel peptides derived from a partial region of HMGN1, HMGN2, HMGN4 or HMGN5, and anti-cancer agents and anti-cancer effect enhancers containing the peptide as an active ingredient. The peptide of the present invention has an anti-tumor effect even independently, and exerts a remarkably excellent anti-tumor effect particularly when used in combination with an immune checkpoint regulator, or an anti-CD4 antibody or antigen-binding fragment thereof.
    Type: Grant
    Filed: January 3, 2023
    Date of Patent: March 5, 2024
    Assignees: THE UNIVERSITY OF TOKYO, ONO PHARMACEUTICAL CO., LTD., TOKYO UNIVERSITY OF SCIENCE FOUNDATION
    Inventors: Kouji Matsushima, Satoshi Ueha, Shungo Deshimaru, Chang-Yu Chen, Shoji Yokochi, Yoshiro Ishiwata, Shiro Shibayama
  • Publication number: 20240072685
    Abstract: A power converter to supply power to each phase of a three-phase motor includes a booster circuit connected to a DC power supply to boost an input voltage input from the DC power supply in response to a pulse width modulation boosting signal, an inverter connected to the booster circuit and including a three-phase switching circuit including switches, and an output connected to the three-phase switching circuit to supply power to each phase of the three-phase motor, and a controller to output the pulse width modulation boosting signal to the booster circuit and output the pulse width modulation boosting signal to the booster circuit when detecting that the booster circuit is in a boosted state.
    Type: Application
    Filed: September 30, 2020
    Publication date: February 29, 2024
    Inventors: Ming Tsan LIN, Yi-Shiang OUYANG, Hsin-Chang YU