Patents by Inventor Charles C Garretson
Charles C Garretson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200282506Abstract: A method is provided to minimize travel distance and time between correction locations on a substrate when polishing a local area of a substrate, such as a semiconductor wafer, using a location specific polishing module. A correction profile is determined and a recipe based on the correction profile is used to polish a substrate. A polishing pad assembly traverses between a first correction location and a second correction location using the combined motion of a substrate support chuck and a support arm coupled at a first end thereof to the polishing pad assembly. The chuck rotates about a center axis thereof. The positioning arm may sweep about a vertical axis disposed through a second end of the support arm. The combined motion of the chuck and the positioning arm causes the polishing pad assembly to form a spiral shaped polishing path on the substrate.Type: ApplicationFiled: May 22, 2020Publication date: September 10, 2020Inventors: Eric LAU, Chih Chung CHOU, Charles C. GARRETSON, Jeonghoon OH, King Yi HEUNG
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Patent number: 10766117Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.Type: GrantFiled: February 28, 2018Date of Patent: September 8, 2020Assignee: Applied Materials, Inc.Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
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Patent number: 10610994Abstract: A polishing module includes a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.Type: GrantFiled: March 10, 2017Date of Patent: April 7, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Eric Lau, Hui Chen, King Yi Heung, Chih Chung Chou, Edwin C. Suarez, Garrett Ho Yee Sin, Charles C. Garretson, Jeonghoon Oh
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Patent number: 10589399Abstract: A chemical mechanical polishing system includes a substrate support configured to hold a substrate, a polishing pad assembly include a membrane and a polishing pad portion having a polishing surface, a polishing pad carrier, and a drive system configured to cause relative motion between the substrate support and the polishing pad carrier. The polishing pad portion is joined to the membrane on a side opposite the polishing surface. The polishing surface has a width parallel to the polishing surface at least four times smaller than a diameter of the substrate. An outer surface of the polishing pad portion includes at least one recess and at least one plateau having a top surface that provides the polishing surface. The polishing surface has a plurality of edges defined by intersections between side walls of the at least one recess and a top surface of the at least one plateau.Type: GrantFiled: March 17, 2017Date of Patent: March 17, 2020Assignee: Applied Materials, Inc.Inventors: Jeonghoon Oh, Edwin C. Suarez, Jason Garcheung Fung, Eric Lau, King Yi Heung, Ashwin Murugappan Chockalingam, Daniel Redfield, Charles C. Garretson, Thomas H. Osterheld
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Patent number: 10434623Abstract: A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in one or more of a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.Type: GrantFiled: March 10, 2017Date of Patent: October 8, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Eric Lau, Hui Chen, King Yi Heung, Wei-Cheng Lee, Chih Chung Chou, Edwin C. Suarez, Garrett Ho Yee Sin, Charles C. Garretson, Jeonghoon Oh
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Publication number: 20190105754Abstract: A retaining ring for a polishing process is disclosed. The retaining ring includes a body comprising an upper portion and a lower portion, and a sacrificial surface disposed on the lower portion, the sacrificial surface comprising a negative tapered surface having a taper height that is about 0.0003 inches to about 0.00015 inches.Type: ApplicationFiled: December 5, 2018Publication date: April 11, 2019Inventors: David Masayuki ISHIKAWA, Jeonghoon OH, Garrett Ho Yee SIN, Charles C. GARRETSON, Huanbo ZHANG, Chia-Ling PAI, Niraj PRASAD, Julio David MUZQUIZ
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Patent number: 10252397Abstract: A retaining ring for a polishing process is disclosed. The retaining ring includes a body comprising an upper portion and a lower portion, and a sacrificial surface disposed on the lower portion, the sacrificial surface comprising a negative tapered surface having a taper height that is about 0.0003 inches to about 0.00015 inches.Type: GrantFiled: October 9, 2015Date of Patent: April 9, 2019Assignee: Applied Materials, Inc.Inventors: David Masayuki Ishikawa, Jeonghoon Oh, Garrett Ho Yee Sin, Charles C. Garretson, Huanbo Zhang, Chia-Ling Pai, Niraj Prasad, Julio David Muzquiz
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Patent number: 10256111Abstract: A method for polishing dies locations on a substrate with a polishing module. A thickness at selected locations on the substrate is premeasured at a metrology station, each location corresponding to a location of a single die. The thickness obtained by the metrology station for the selected locations of the substrate is provided to a controller of a polishing module. The thickness corrections for each selected location on the substrate are determined. A polishing step in a polishing recipe is formed from the thickness correction for each selected location. A polishing parameter for each die location is calculated for the recipe.Type: GrantFiled: June 13, 2017Date of Patent: April 9, 2019Assignee: Applied Materials, Inc.Inventors: Eric Lau, King Yi Heung, Charles C. Garretson, Jun Qian, Thomas H. Osterheld, Shuchivrat Datar, David Chui
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Publication number: 20190099857Abstract: Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a central axis of the retaining ring. The inner surface also includes a plurality of facets. Channels are disposed within the retaining ring to allow passage of a polishing fluid from an inner surface to an outer surface of the retaining ring disposed opposite of the inner surface.Type: ApplicationFiled: October 2, 2018Publication date: April 4, 2019Inventors: Jeonghoon OH, Charles C. GARRETSON, Eric LAU, Andrew NAGENGAST, Steven M. ZUNIGA, Edwin C. SUAREZ, Huanbo ZHANG, Brian J. BROWN
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Publication number: 20180250788Abstract: A method is provided to minimize travel distance and time between correction locations on a substrate when polishing a local area of a substrate, such as a semiconductor wafer, using a location specific polishing module. A correction profile is determined and a recipe based on the correction profile is used to polish a substrate. A polishing pad assembly traverses between a first correction location and a second correction location using the combined motion of a substrate support chuck and a support arm coupled at a first end thereof to the polishing pad assembly. The chuck rotates about a center axis thereof. The positioning arm may sweep about a vertical axis disposed through a second end of the support arm. The combined motion of the chuck and the positioning arm causes the polishing pad assembly to form a spiral shaped polishing path on the substrate.Type: ApplicationFiled: February 8, 2018Publication date: September 6, 2018Inventors: Eric LAU, Chih Chung CHOU, Charles C. GARRETSON, Jeonghoon OH, King Yi HEUNG
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Publication number: 20180185979Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.Type: ApplicationFiled: February 28, 2018Publication date: July 5, 2018Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
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Patent number: 9937601Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.Type: GrantFiled: October 29, 2015Date of Patent: April 10, 2018Assignee: Applied Materials, Inc.Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
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Publication number: 20180005842Abstract: A method for polishing dies locations on a substrate with a polishing module. A thickness at selected locations on the substrate is premeasured at a metrology station, each location corresponding to a location of a single die. The thickness obtained by the metrology station for the selected locations of the substrate is provided to a controller of a polishing module. The thickness corrections for each selected location on the substrate are determined. A polishing step in a polishing recipe is formed from the thickness correction for each selected location. A polishing parameter for each die location is calculated for the recipe.Type: ApplicationFiled: June 13, 2017Publication date: January 4, 2018Inventors: Eric LAU, King Yi HEUNG, Charles C. GARRETSON, Jun QIAN, Thomas H. OSTERHELD, Shuchivrat DATAR, David CHUI
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Publication number: 20170274498Abstract: A chemical mechanical polishing system includes a substrate support configured to hold a substrate, a polishing pad assembly include a membrane and a polishing pad portion having a polishing surface, a polishing pad carrier, and a drive system configured to cause relative motion between the substrate support and the polishing pad carrier. The polishing pad portion is joined to the membrane on a side opposite the polishing surface. The polishing surface has a width parallel to the polishing surface at least four times smaller than a diameter of the substrate. An outer surface of the polishing pad portion includes at least one recess and at least one plateau having a top surface that provides the polishing surface. The polishing surface has a plurality of edges defined by intersections between side walls of the at least one recess and a top surface of the at least one plateau.Type: ApplicationFiled: March 17, 2017Publication date: September 28, 2017Inventors: Jeonghoon Oh, Edwin C. Suarez, Jason Garcheung Fung, Eric Lau, King Yi Heung, Ashwin Murugappan Chockalingam, Daniel Redfield, Charles C. Garretson, Thomas H. Osterheld
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Publication number: 20170274497Abstract: A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in one or more of a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.Type: ApplicationFiled: March 10, 2017Publication date: September 28, 2017Inventors: Eric LAU, Hui CHEN, King Yi HEUNG, Wei-Cheng LEE, Chih Chung CHOU, Edwin C. SUAREZ, Garrett Ho Yee SIN, Charles C. GARRETSON, Jeonghoon OH
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Publication number: 20170274495Abstract: A polishing module includes a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.Type: ApplicationFiled: March 10, 2017Publication date: September 28, 2017Inventors: Eric LAU, Hui CHEN, King Yi HEUNG, Chih Chung CHOU, Edwin C. SUAREZ, Garrett Ho Yee SIN, Charles C. GARRETSON, Jeonghoon OH
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Publication number: 20160121453Abstract: A retaining ring for a polishing process is disclosed. The retaining ring includes a body comprising an upper portion and a lower portion, and a sacrificial surface disposed on the lower portion, the sacrificial surface comprising a negative tapered surface having a taper height that is about 0.0003 inches to about 0.00015 inches.Type: ApplicationFiled: October 9, 2015Publication date: May 5, 2016Inventors: David Masayuki ISHIKAWA, Jeonghoon OH, Garrett Ho Yee SIN, Charles C. GARRETSON, Huanbo ZHANG, Chia-Ling PAI, Niraj PRASAD, Julio David MUZQUIZ
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Publication number: 20160045997Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.Type: ApplicationFiled: October 29, 2015Publication date: February 18, 2016Applicant: APPLIED MATERIALS, INC.Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
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Patent number: 9242337Abstract: A method for controlling the residue clearing process of a chemical mechanical polishing (“CMP”) process is provided. Dynamic in-situ profile control (“ISPC”) is used to control polishing before residue clearing starts, and then a new polishing recipe is dynamically calculated for the clearing process. Several different methods are disclosed for calculating the clearing recipe. First, in certain implementations when feedback at T0 or T1 methods are used, a post polishing profile and feedback offsets are generated in ISPC software. Based on the polishing profile and feedback generated from ISPC before the start of the clearing process, a flat post profile after clearing is targeted. The estimated time for the clearing step may be based on the previously processed wafers (for example, a moving average of the previous endpoint times). The calculated pressures may be scaled to a lower (or higher) baseline pressure for a more uniform clearing.Type: GrantFiled: February 20, 2014Date of Patent: January 26, 2016Assignee: APPLIED MATERIALS, INC.Inventors: Jun Qian, Sivakumar Dhandapani, Benjamin Cherian, Thomas H. Osterheld, Charles C. Garretson
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Patent number: 9186773Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.Type: GrantFiled: October 31, 2013Date of Patent: November 17, 2015Assignee: Applied Materials, Inc.Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong