Patents by Inventor Charles Chak Hau Pang
Charles Chak Hau Pang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230120969Abstract: LED packages are disclosed capable of emitting a range of colors including white light, while still emitting that can have a high color rendering index (CRI). The LED packages can have a simplified reflective cup arrangement and improved lead frame design. The LED packages according to the present invention comprise one or more LED WITH PHOSPHORs for high CRI lighting applications, along with multiple narrowband emitters (e.g. RGB LEDs), but do not have a dam or partition to segregate the LED WITH PHOSPHOR from the multiple emitters. This results in a LED package that is less complex and easier to manufacture, while still providing the desired flexibility in LED package emissions.Type: ApplicationFiled: December 16, 2022Publication date: April 20, 2023Inventors: Charles Chak Hau Pang, Victor Yue Kwong Lau, Tiancai Su
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Patent number: 11545471Abstract: LED packages are disclosed capable of emitting a range of colors including white light, while still emitting that can have a high color rendering index (CRI). The LED packages can have a simplified reflective cup arrangement and improved lead frame design. The LED packages according to the present invention comprise one or more LED WITH PHOSPHORs for high CRI lighting applications, along with multiple narrowband emitters (e.g. RGB LEDs), but do not have a dam or partition to segregate the LED WITH PHOSPHOR from the multiple emitters. This results in a LED package that is less complex and easier to manufacture, while still providing the desired flexibility in LED package emissions.Type: GrantFiled: July 7, 2017Date of Patent: January 3, 2023Assignee: CreeLED, Inc.Inventors: Charles Chak Hau Pang, Victor Yue Kwong Lau, Tiancai Su
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Publication number: 20200118983Abstract: LED packages are disclosed capable of emitting a range of colors including white light, while still emitting that can have a high color rendering index (CRI). The LED packages can have a simplified reflective cup arrangement and improved lead frame design. The LED packages according to the present invention comprise one or more LED WITH PHOSPHORs for high CRI lighting applications, along with multiple narrowband emitters (e.g. RGB LEDs), but do not have a dam or partition to segregate the LED WITH PHOSPHOR from the multiple emitters. This results in a LED package that is less complex and easier to manufacture, while still providing the desired flexibility in LED package emissions.Type: ApplicationFiled: July 7, 2017Publication date: April 16, 2020Inventors: Charles Chak Hau PANG, Victor Yue Kwong LAU, Tiancai SU
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Patent number: 10431567Abstract: The present invention is directed to leadless LED packages and LED displays utilizing white ceramic casings and thin/low profile packages with improved color mixing and structural integrity. In some embodiments, the improved color mixing is provided, in part, by the white ceramic package casing, which can help reflect light emitted from each LED in many directions away from the device. The non-linear arrangement of the LEDs can also contribute to improved color-mixing. The improved structural integrity can be provided by various features in the bond pads that cooperate with the casing for a stronger package structure. Moreover, in some embodiments the thinness/low profile of each package is attributed to its leadless structure, with the bond pads and electrodes electrically connected via through-holes.Type: GrantFiled: November 3, 2010Date of Patent: October 1, 2019Assignee: CREE, INC.Inventors: Alex Chi Keung Chan, Charles Chak Hau Pang, Victor Yue Kwong Lau
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Patent number: 9831393Abstract: The present invention is directed to LED packages and LED displays utilizing water resistant packages with improved structural integrity and customizable attributes. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, water resistant package. Moreover, in some embodiments the improved structural integrity and water resistance is further provided by cavity features that improve adhesion between the cavity and a protective encapsulant. Some embodiments also provide for packages with a greater overall height than the length of their side-exposed solder pins, which improves gel coverage of the side-exposed solder pins between adjacent packages.Type: GrantFiled: July 27, 2011Date of Patent: November 28, 2017Assignee: CREE HONG KONG LIMITEDInventors: Alex Chi Keung Chan, Charles Chak Hau Pang
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Patent number: 9240395Abstract: The present invention is directed to LED packages and methods utilizing waterproof and UV resistant packages with improved structural integrity. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, waterproof package. Moreover, in some embodiments the improved structural integrity and waterproofing is further provided by improved adhesion between the encapsulant and the casing. Some embodiments also provide for improved wire bonds, with the length, thickness, and loop height of the wire bonds controlled and optimized for improved adhesion between the wire bonds and the encapsulant as well as improved reliability.Type: GrantFiled: November 30, 2010Date of Patent: January 19, 2016Assignee: CREE HUIZHOU OPTO LIMITEDInventors: Alex Chi Keung Chan, Charles Chak Hau Pang, Li Fei Hong
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Patent number: 8901583Abstract: The present invention is directed to LED packages and LED displays utilizing thin/low profile LED packages with improved structural integrity, emission characteristics, and customizable attributes. In some embodiments the improved structural integrity is provided by various features in the lead frame that cooperate with the casing for a stronger package. Moreover, in some embodiments the improved emission characteristics are provided by cavity features such as shape and depth, which provide for increased surface bonding area for multiple LED chips and increased viewing angle, respectively. Some embodiments also provide for gradated packages having customizable top portions for applications using smaller packages, with bottom portions comprising dimensions compatible with customary mechanical/electrical supports.Type: GrantFiled: April 12, 2010Date of Patent: December 2, 2014Assignee: Cree Huizhou Opto LimitedInventors: Alex Chi Keung Chan, Charles Chak Hau Pang, Ruan Fei Fei
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Publication number: 20120132937Abstract: The present invention is directed to LED packages and methods utilizing waterproof and UV resistant packages with improved structural integrity. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, waterproof package. Moreover, in some embodiments the improved structural integrity and waterproofing is further provided by improved adhesion between the encapsulant and the casing. Some embodiments also provide for improved wire bonds, with the length, thickness, and loop height of the wire bonds controlled and optimized for improved adhesion between the wire bonds and the encapsulant as well as improved reliability.Type: ApplicationFiled: November 30, 2010Publication date: May 31, 2012Inventors: ALEX CHI KEUNG CHAN, Charles Chak Hau Pang, Li Fei Hong
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Publication number: 20120104426Abstract: The present invention is directed to leadless LED packages and LED displays utilizing white ceramic casings and thin/low profile packages with improved color mixing and structural integrity. In some embodiments, the improved color mixing is provided, in part, by the white ceramic package casing, which can help reflect light emitted from each LED in many directions away from the device. The non-linear arrangement of the LEDs can also contribute to improved color-mixing. The improved structural integrity can be provided by various features in the bond pads that cooperate with the casing for a stronger package structure. Moreover, in some embodiments the thinness/low profile of each package is attributed to its leadless structure, with the bond pads and electrodes electrically connected via through-holes.Type: ApplicationFiled: November 3, 2010Publication date: May 3, 2012Inventors: Alex Chi Keung Chan, Charles Chak Hau Pang, Victor Yue Kwong Lau
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Publication number: 20120025227Abstract: The present invention is directed to LED packages and LED displays utilizing water resistant packages with improved structural integrity and customizable attributes. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, water resistant package. Moreover, in some embodiments the improved structural integrity and water resistance is further provided by cavity features that improve adhesion between the cavity and a protective encapsulant. Some embodiments also provide for packages with a greater overall height than the length of their side-exposed solder pins, which improves gel coverage of the side-exposed solder pins between adjacent packages.Type: ApplicationFiled: July 27, 2011Publication date: February 2, 2012Inventors: ALEX CHI KEUNG CHAN, Charles Chak Hau Pang
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Publication number: 20110248293Abstract: The present invention is directed to LED packages and LED displays utilizing thin/low profile LED packages with improved structural integrity, emission characteristics, and customizable attributes. In some embodiments the improved structural integrity is provided by various features in the lead frame that cooperate with the casing for a stronger package. Moreover, in some embodiments the improved emission characteristics are provided by cavity features such as shape and depth, which provide for increased surface bonding area for multiple LED chips and increased viewing angle, respectively. Some embodiments also provide for gradated packages having customizable top portions for applications using smaller packages, with bottom portions comprising dimensions compatible with customary mechanical/electrical supports.Type: ApplicationFiled: April 12, 2010Publication date: October 13, 2011Inventors: Alex Chi Keung Chan, Charles Chak Hau Pang, Ruan Fei Fei
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Patent number: D908929Type: GrantFiled: December 4, 2017Date of Patent: January 26, 2021Assignee: CREE, INC.Inventors: Charles Chak Hau Pang, Victor Yue Kwong Lau, Tiancai Su