LED package
Latest CREE, INC. Patents:
- Die-attach method to compensate for thermal expansion
- Group III HEMT and capacitor that share structural features
- Multi-stage decoupling networks integrated with on-package impedance matching networks for RF power amplifiers
- Asymmetric Doherty amplifier circuit with shunt reactances
- Power switching devices with high dV/dt capability and methods of making such devices
The features shown in broken lines in
Claims
The ornamental design for a LED package, as shown and described.
Type: Grant
Filed: Dec 4, 2017
Date of Patent: Jan 26, 2021
Assignee: CREE, INC. (Durham, NC)
Inventors: Charles Chak Hau Pang (Fanling), Victor Yue Kwong Lau (Laguna), Tiancai Su (Huizhou)
Primary Examiner: Marcus A Jackson
Application Number: 29/628,363