Patents by Inventor Charles T. Carlson
Charles T. Carlson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210210307Abstract: Embodiments herein are directed to a resonator for an ion implanter. In some embodiments, a resonator may include a housing, and a first coil and a second coil partially disposed within the housing. Each of the first and second coils may include a first end including an opening for receiving an ion beam, and a central section extending helically about a central axis, wherein the central axis is parallel to a beamline of the ion beam, and wherein an inner side of the central section has a flattened surface.Type: ApplicationFiled: January 6, 2020Publication date: July 8, 2021Applicant: APPLIED Materials, Inc.Inventors: Costel Biloiu, Michael Honan, Robert B. Vopat, David Blahnik, Charles T. Carlson, Frank Sinclair, Paul Murphy
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Publication number: 20210210308Abstract: A carrier proximity mask and methods of assembling and using the carrier proximity mask may include providing a first carrier body, second carrier body, and set of one or more clamps. The first carrier body may have one or more openings formed as proximity masks to form structures on a first side of a substrate. The first and second carrier bodies may have one or more contact areas to align with one or more contact areas on a first and second sides of the substrate. The set of one or more clamps may clamp the substrate between the first carrier body and the second carrier body at contact areas to suspend work areas of the substrate between the first and second carrier bodies. The openings to define edges to convolve beams to form structures on the substrate.Type: ApplicationFiled: March 25, 2021Publication date: July 8, 2021Applicant: APPLIED Materials, Inc.Inventors: Morgan Evans, Charles T. Carlson, Rutger Meyer Timmerman Thijssen, Ross Bandy, Ryan Magee
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Patent number: 10991547Abstract: A carrier proximity mask and methods of assembling and using the carrier proximity mask may include providing a first carrier body, second carrier body, and set of one or more clamps. The first carrier body may have one or more openings formed as proximity masks to form structures on a first side of a substrate. The first and second carrier bodies may have one or more contact areas to align with one or more contact areas on a first and second sides of the substrate. The set of one or more clamps may clamp the substrate between the first carrier body and the second carrier body at contact areas to suspend work areas of the substrate between the first and second carrier bodies. The openings to define edges to convolve beams to form structures on the substrate.Type: GrantFiled: September 25, 2019Date of Patent: April 27, 2021Assignee: Applied Materials, Inc.Inventors: Morgan Evans, Charles T. Carlson, Rutger Meyer Timmerman Thijssen, Ross Bandy, Ryan Magee
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Patent number: 10969029Abstract: Embodiments of the disclosure generally relate to a flapper valve. The flapper valve may be used with processing chambers, such as semiconductor substrate processing chambers. In one embodiment, a flapper valve includes a housing having a first opening at a first end thereof and a second opening at a second end thereof, a first flapper pivotably disposed in the housing, and a second flapper pivotably disposed in the housing. The first and second flappers are movable to selectively open and close at least one of the first opening and the second opening.Type: GrantFiled: December 1, 2017Date of Patent: April 6, 2021Assignee: Applied Materials, Inc.Inventors: Charles T. Carlson, Tammy Jo Pride, Benjamin B. Riordon, Aaron Webb
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Publication number: 20210090843Abstract: A carrier proximity mask and methods of assembling and using the carrier proximity mask may include providing a first carrier body, second carrier body, and set of one or more clamps. The first carrier body may have one or more openings formed as proximity masks to form structures on a first side of a substrate. The first and second carrier bodies may have one or more contact areas to align with one or more contact areas on a first and second sides of the substrate. The set of one or more clamps may clamp the substrate between the first carrier body and the second carrier body at contact areas to suspend work areas of the substrate between the first and second carrier bodies. The openings to define edges to convolve beams to form structures on the substrate.Type: ApplicationFiled: September 25, 2019Publication date: March 25, 2021Applicant: APPLIED Materials, Inc.Inventors: Morgan Evans, Charles T. Carlson, Rutger Meyer Timmerman Thijssen, Ross Bandy
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Publication number: 20210090858Abstract: A carrier proximity mask and methods of assembling and using the carrier proximity mask may include providing a first carrier body, second carrier body, and set of one or more clamps. The first carrier body may have one or more openings formed as proximity masks to form structures on a first side of a substrate. The first and second carrier bodies may have one or more contact areas to align with one or more contact areas on a first and second sides of the substrate. The set of one or more clamps may clamp the substrate between the first carrier body and the second carrier body at contact areas to suspend work areas of the substrate between the first and second carrier bodies. The openings to define edges to convolve beams to form structures on the substrate.Type: ApplicationFiled: September 25, 2019Publication date: March 25, 2021Applicant: APPLIED Materials, Inc.Inventors: Morgan Evans, Charles T. Carlson, Rutger Meyer Timmerman Thijssen, Ross Bandy, Ryan Magee
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Patent number: 10957512Abstract: A carrier proximity mask and methods of assembling and using the carrier proximity mask may include providing a first carrier body, second carrier body, and set of one or more clamps. The first carrier body may have one or more openings formed as proximity masks to form structures on a first side of a substrate. The first and second carrier bodies may have one or more contact areas to align with one or more contact areas on a first and second sides of the substrate. The set of one or more clamps may clamp the substrate between the first carrier body and the second carrier body at contact areas to suspend work areas of the substrate between the first and second carrier bodies. The openings to define edges to convolve beams to form structures on the substrate.Type: GrantFiled: September 25, 2019Date of Patent: March 23, 2021Assignee: Applied Materials, Inc.Inventors: Morgan Evans, Charles T. Carlson, Rutger Meyer Timmerman Thijssen, Ross Bandy
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Publication number: 20210033197Abstract: Described are isolation valves, and chamber systems incorporating and methods of using the isolation valves. In some embodiments, an isolation valve may include a valve body and a flapper assembly. The valve body may define a first fluid volume, a second fluid volume, and a seating surface. The flapper assembly may include a flapper disposed inside the valve body having a flapper surface complimentary to the seating surface. The flapper may be pivotable within the valve body to a first position such that the flapper surface may be away from the seating surface to allow fluid flow between the first fluid volume and the second fluid volume. The flapper may be pivotable within the valve body to a second position such that the flapper surface may be proximate the seating surface to form a non-contact seal to restrict fluid flow between the first fluid volume and the second fluid volume.Type: ApplicationFiled: July 22, 2020Publication date: February 4, 2021Applicant: Applied Materials, Inc.Inventors: Benjamin Riordon, Anatha K. Subramani, Charles T. Carlson
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Publication number: 20210013084Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft counter-rotatable with the first shaft. The transfer apparatus may include an eccentric hub extending at least partially through the central hub, and which is radially offset from a central axis of the central hub. The transfer apparatus may also include an end effector coupled with the eccentric hub. The end effector may include a plurality of arms having a number of arms equal to the number of substrate supports of the plurality of substrate supports.Type: ApplicationFiled: July 7, 2020Publication date: January 14, 2021Applicant: Applied Materials, Inc.Inventors: Jason M. Schaller, Luke Bonecutter, Charles T. Carlson, Rajkumar Thanu, Karuppasamy Muthukamatchi, Jeff Hudgens, Benjamin Riordon
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Publication number: 20210013067Abstract: Exemplary substrate processing systems may include a transfer region housing defining an internal volume. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft concentric with and counter-rotatable to the first shaft. The transfer apparatus may include a first end effector coupled with the first shaft. The first end effector may include a plurality of first arms. The transfer apparatus may also include a second end effector coupled with the second shaft. The second end effector may include a plurality of second arms having a number of second arms equal to the number of first arms of the first end effector.Type: ApplicationFiled: July 7, 2020Publication date: January 14, 2021Applicant: Applied Materials, Inc.Inventors: Charles T. Carlson, Jason M. Schaller, Luke Bonecutter, David Blahnik
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Publication number: 20210008727Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a transfer apparatus having a central hub including a shaft extending at a distal end through the transfer region housing into the transfer region. The transfer apparatus may include a lateral translation apparatus coupled with an exterior surface of the transfer region housing, and configured to provide at least one direction of lateral movement of the shaft. The systems may also include an end effector coupled with the shaft within the transfer region. The end effector may include a plurality of arms having a number of arms equal to a number of substrate supports of the plurality of substrate supports in the transfer region.Type: ApplicationFiled: July 7, 2020Publication date: January 14, 2021Applicant: Applied Materials, Inc.Inventors: Paul Z. Wirth, Charles T. Carlson, Jason M. Schaller
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Publication number: 20210013068Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region, and including substrate supports and a transfer apparatus. The transfer apparatus may include a central hub having a housing, and including a first shaft and a second shaft. The housing may be coupled with the second shaft, and may define an internal housing volume. The transfer apparatus may include a plurality of arms equal to a number of substrate supports of the plurality of substrate supports. Each arm of the plurality of arms may be coupled about an exterior of the housing. The transfer apparatus may include a plurality of arm hubs disposed within the internal housing volume. Each arm hub of the plurality of arm hubs may be coupled with an arm of the plurality of arms through the housing. The arm hubs may be coupled with the first shaft of the central hub.Type: ApplicationFiled: July 7, 2020Publication date: January 14, 2021Applicant: Applied Materials, Inc.Inventors: Jason M. Schaller, Charles T. Carlson, Luke Bonecutter, David Blahnik, Karuppasamy Muthukamatchi, Jeff Hudgens, Benjamin Riordon
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Publication number: 20210013055Abstract: Exemplary substrate processing systems may include a factory interface and a load lock coupled with the factory interface. The systems may include a transfer chamber coupled with the load lock. The transfer chamber may include a robot configured to retrieve substrates from the load lock. The systems may include a chamber system positioned adjacent and coupled with the transfer chamber. The chamber system may include a transfer region laterally accessible to the robot. The transfer region may include a plurality of substrate supports disposed about the transfer region. Each substrate support of the plurality of substrate supports may be vertically translatable. The transfer region may also include a transfer apparatus rotatable about a central axis and configured to engage substrates and transfer substrates among the plurality of substrate supports. The chamber system may also include a plurality of processing regions vertically offset and axially aligned with an associated substrate support.Type: ApplicationFiled: July 7, 2020Publication date: January 14, 2021Applicant: Applied Materials, Inc.Inventors: Jason M. Schaller, Steve Hongkham, Charles T. Carlson, Tuan A. Nguyen, Swaminathan T. Srinivasan, Khokan Chandra Paul
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Patent number: 10854483Abstract: Apparatuses for annealing semiconductor substrates, such as a batch processing chamber, are provided herein. The batch processing chamber includes a chamber body enclosing an internal volume, a cassette moveably disposed within the internal volume and a plug coupled to a bottom wall of the cassette. The chamber body has a hole through a bottom wall of the chamber body and is interfaced with one or more heaters operable to maintain the chamber body at a temperature of greater than 290° C. The cassette is configured to be raised to load a plurality of substrates thereon and lowered to seal the internal volume. The plug is configured to move up and down within the internal volume. The plug includes a downward-facing seal configured to engage with a top surface of the bottom wall of the chamber body and close the hole through the bottom wall of the chamber body.Type: GrantFiled: October 11, 2018Date of Patent: December 1, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Jason M. Schaller, Robert Brent Vopat, Charles T. Carlson, Jeffrey Charles Blahnik, Timothy J. Franklin, David Blahnik, Aaron Webb
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Publication number: 20200217423Abstract: The present disclosure generally relates to an isolation device for use in processing systems. The isolation device has a body with an inlet opening disposed at a first end coupled to a processing system component such as a remote plasma source and outlet openings, for example two, disposed at a second end which are coupled to a processing system component such as a process chamber. Flaps disposed within the body are actuatable to an open position from a closed position or to a closed position from an open position, to selectively allow or prevent passage of a fluid from the processing system component coupled to the isolation device to the other processing system component coupled thereto.Type: ApplicationFiled: September 28, 2018Publication date: July 9, 2020Inventors: Benjamin B. RIORDON, Charles T. CARLSON, Aaron WEBB, Gary WYKA
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Patent number: 10643867Abstract: A system for annealing substrates is provided. The system includes a first boiler having an input coupled to a water source; a second boiler having an input connected to an output of the first boiler; and a batch processing chamber coupled to the output of the second boiler, wherein the batch processing chamber is configured to anneal a plurality of substrates using steam from the second boiler.Type: GrantFiled: October 25, 2018Date of Patent: May 5, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Jean Delmas, Charles T. Carlson, Robert Brent Vopat
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Patent number: 10446710Abstract: An ion implanter and method for facilitating expeditious performance of maintenance on a component of the ion implanter in a manner that reduces downtime while increasing throughput of the ion implanter. The ion implanter includes a process chamber, a transfer chamber connected to the process chamber, a first isolation gate configured to controllably seal the transfer chamber from the process chamber, and a second isolation gate configured to controllably seal the transfer chamber from an atmospheric environment, wherein a component of the ion implanter can be transferred between the process chamber and the transfer chamber for performing maintenance on the component outside of the process chamber. Performing maintenance on a component of the ion implanter includes the steps of transferring the component from the process chamber to the transfer chamber, sealing the transfer chamber, venting the transfer chamber to atmospheric pressure, an opening the transfer chamber to an atmospheric environment.Type: GrantFiled: December 10, 2013Date of Patent: October 15, 2019Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: Aaron P. Webb, Charles T. Carlson, Paul Forderhase, William T. Weaver, Robert Brent Vopat
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Publication number: 20190293199Abstract: Embodiments of the disclosure generally relate to a flapper valve. The flapper valve may be used with processing chambers, such as semiconductor substrate processing chambers. In one embodiment, a flapper valve includes a housing having a first opening at a first end thereof and a second opening at a second end thereof, a first flapper pivotably disposed in the housing, and a second flapper pivotably disposed in the housing. The first and second flappers are movable to selectively open and close at least one of the first opening and the second opening.Type: ApplicationFiled: December 1, 2017Publication date: September 26, 2019Inventors: Charles T. CARLSON, Tammy Jo PRIDE, Benjamin B. RIORDON, Aaron WEBB
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Publication number: 20190148186Abstract: Apparatuses for annealing semiconductor substrates, such as a batch processing chamber, are provided herein. The batch processing chamber includes a chamber body enclosing an internal volume, a cassette moveably disposed within the internal volume and a plug coupled to a bottom wall of the cassette. The chamber body has a hole through a bottom wall of the chamber body and is interfaced with one or more heaters operable to maintain the chamber body at a temperature of greater than 290° C. The cassette is configured to be raised to load a plurality of substrates thereon and lowered to seal the internal volume. The plug is configured to move up and down within the internal volume. The plug includes a downward-facing seal configured to engage with a top surface of the bottom wall of the chamber body and close the hole through the bottom wall of the chamber body.Type: ApplicationFiled: October 11, 2018Publication date: May 16, 2019Inventors: Jason M. SCHALLER, Robert Brent VOPAT, Charles T. CARLSON, Jeffrey Charles BLAHNIK, Timothy J. FRANKLIN, David BLAHNIK, Aaron WEBB
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Publication number: 20190139793Abstract: A system for annealing substrates is provided. The system includes a first boiler having an input coupled to a water source; a second boiler having an input connected to an output of the first boiler; and a batch processing chamber coupled to the output of the second boiler, wherein the batch processing chamber is configured to anneal a plurality of substrates using steam from the second boiler.Type: ApplicationFiled: October 25, 2018Publication date: May 9, 2019Inventors: Jean DELMAS, Charles T. CARLSON, Robert Brent VOPAT