Abstract: A package substrate is adapted to a ball grid array package. The substrate includes two substrate contacts, two solder ball pads, two via holes and two signal lines. A connection line of the two substrate contacts is substantially perpendicular to a connection line of the two solder ball pads. The two substrate contacts are respectively connected to the two via holes by the two signal lines. Each signal line includes a circuit trace section, an approaching section and a bifurcating section connected in sequence. The two circuit trace sections of each signal line are substantially arranged in parallel. The two approaching sections are substantially arranged in parallel and substantially symmetrical about the connection line of the solder ball pads. The two bifurcating sections are substantially symmetrical about the pad connection line and respectively electrically connected to the two via holes.

Abstract: A driving method includes the following steps: driving a first dummy pixel circuit according to a first test signal, and driving a display pixel circuit according to a driving signal, wherein the first test signal is maintained at a value corresponding to a first gray level; detecting a detection voltage change value cross a light-emitting element in the display pixel circuit is driven for a driving time, and detecting a first test voltage change value cross a light-emitting element in the first dummy pixel circuit is driven for the driving time; and adjusting the driving signal according to the detection voltage change value, the first test voltage change value and a second test voltage change value, wherein the second test voltage change value is obtained by detecting a second dummy pixel circuit or from a memory unit.

Abstract: A method for making a semiconductor device includes forming a first patterned structure over an interlayer dielectric. The interlayer dielectric overlays a first source/drain structure and a second source/drain structure. The first patterned structure extends along a first lateral direction and a vertical projection of the first patterned structure is located between the first and second source/drain structures along a second lateral direction perpendicular to the first lateral direction. The method includes reducing a width of the first patterned structure that extends along the second lateral direction. The method includes forming, based on the first patterned structure having the reduced width, contact holes that expose the first source/drain structure and the second source/drain structure, respectively.

Abstract: A semiconductor device includes a first source/drain structure coupled to an end of a first conduction channel that extends along a first direction. The semiconductor device includes a second source/drain structure coupled to an end of a second conduction channel that extends along the first direction. The semiconductor device includes a first interconnect structure extending through an interlayer dielectric and electrically coupled to the first source/drain structure. The semiconductor device includes a second interconnect structure extending through the interlayer dielectric and electrically coupled to the second source/drain structure. The semiconductor device includes a first isolation structure disposed between the first and second source/drain structures and extending into the interlayer dielectric.

Abstract: Technologies for providing remote out-of-band firmware up-dates include a compute device. The compute device includes an out-of-band remote debug logic unit, a data path management logic unit connected to the out-of-band remote debug logic unit, and a firmware memory connected to the data path management logic unit. The out-of-band remote debug logic unit is configured to receive, from a remote compute device, a request to up-date firmware of the compute device. The request includes updated firmware. The out-of-band remote debug logic unit is also configured to send, in response to receipt of the request and in a first format, a write request to the data path management logic unit. The data path management logic unit is configured to convert the write request from the first format to a second format. The firmware memory is responsive to messages in the second format.

Abstract: A blockchain-based advertisement delivering and evaluation method to be applied to a blockchain-based delivering platform providing a user interface to an audience to allow the audience joining the blockchain-based delivering platform is provided and includes the steps of: receiving an advertisement delivering request output from the user interface; generating a smart contract according to the advertisement delivering request; delivering an advertisement to more than one advertising platforms according to the advertisement delivering request while the smart contract is authenticated and executed; and collecting a delivering result and forming a transaction block to be added to the blockchain of the blockchain-based delivering platform.

Abstract: A 3D printing apparatus including a forming assembly, a scraping tool, a first collection tank, a sweeping tool and a second collection tank is provided. A roller of the forming assembly is adhered with a forming material during a forming process. When the roller is rotated, the scraping tool removes the forming material adhered on the surface of the roller. The scraping tool is disposed between the first collection tank and the roller. The forming material removed from the surface of the roller is guided into the first collection tank. The sweeping tool is configured to sweep the forming material in the first collection tank to a position of the first collection tank. The second collection tank is connected to the position of the first collection tank to receive the forming material swept to the position by the sweeping tool.

Abstract: The present invention provides an expandable interface board. The interface board is an interface board conforming to M.2 interface protocol specification, comprises a plurality of data storage elements, a data transmission interface, a controller, and at least one connection seat. The data transmission interface comprises a plurality of first interface pins and a plurality of second interface pins. The interface board is electrically connected to an external electronic device via the connection seat. Wherein the first interface pins are defined for transmitting data signals of the data storage elements, and the second interface pins are defined for transmitting data signals of the external electronic device. Accordingly, an electronic product applied by the interface board is able to expand it's functions by the external electronic device connected to the connection seat of the interface board.

Abstract: A graphics accelerator device offloads the workload of a graphics processing unit (GPU) by performing image composition and other specialized functions. The graphics accelerator device includes a rasterization module to rasterize a set of primitives to a set of pixels and generate information of the set of pixels. The graphics accelerator device also includes intra-process module to retrieve pixel values from a memory according to the information received from the rasterization module, perform mathematical calculations on the pixel values, and generate one or more processed image layers. The graphics accelerator device further includes an inter-process module to composite the one or more processed image layers received from the intra-process module with other image layers retrieved from the memory, and output a composited image to a display.

Abstract: A fan driving circuit includes a processing module providing a fan phase signal and a speed signal providing module electrically connected to the processing module and including a first switch having a first terminal, a second terminal receiving the fan phase signal and a third terminal electrically connected to a ground voltage, a second switch having a first terminal electrically connected to a speed signal providing terminal of the fan driving circuit and a first terminal of a first impedance, a second terminal electrically connected to a second terminal of the first impedance and a terminal of a diode, and a third terminal electrically connected to the first terminal of the first switch, and a third switch having a terminal electrically connected to a bias voltage.

Abstract: The present invention provides a high-speed transmission connector and application device thereof. The application device comprises an outer shell that is provided at a bottom end thereof with an OcuLink device connector conforming to an OcuLink transmission specification, and provided at an inside thereof with an application module connected to the OcuLink device connector. The OcuLink device connector can be inserted into an OcuLink board connector disposed on a motherboard, a computer system, or a circuit board. The application device further comprises an engagement element capable of engaging with a fixed element of the OcuLink board connector. The application device is directly electrically connected to the motherboard without the use of the transmission line, it will not only improve the heat dissipation of the motherboar, but also increase the stability of the OcuLink device connector in the insertion.

Abstract: The present invention provides an expandable interface board. The interface board is an interface board conforming to M.2 interface protocol specification, comprises a plurality of data storage elements, a data transmission interface, a controller, and at least one connection seat. The data transmission interface comprises a plurality of first interface pins and a plurality of second interface pins. The interface board is electrically connected to an external electronic device via the connection seat. Wherein the first interface pins are defined for transmitting data signals of the data storage elements, and the second interface pins are defined for transmitting data signals of the external electronic device. Accordingly, an electronic product applied by the interface board is able to expand it's functions by the external electronic device connected to the connection seat of the interface board.

Abstract: The fan driving circuit includes a processing module providing a fan phase signal; a speed signal providing module electrically connected to the processing module; a first switch, wherein the third terminal of the first switch is electrically connected to a ground voltage, the second terminal of the first switch receives the fan phase signal; a second switch, wherein the first terminal of the second switch is electrically connected to the third terminal of the fan driving circuit and the first terminal of the first impendence, the second terminal of the second switch is electrically connected to the second terminal of the first impendence and the second terminal of the first diode, the third terminal of the second switch of is electrically connected to the first terminal of the first switch; and a third switch, wherein the second terminal of the third switch is electrically connected to a bias voltage.

Abstract: A 3D printing apparatus including a forming assembly, a scraping tool, a first collection tank, a sweeping tool and a second collection tank is provided. A roller of the forming assembly is adhered with a forming material during a forming process. When the roller is rotated, the scraping tool removes the forming material adhered on the surface of the roller. The scraping tool is disposed between the first collection tank and the roller. The forming material removed from the surface of the roller is guided into the first collection tank. The sweeping tool is configured to sweep the forming material in the first collection tank to a position of the first collection tank. The second collection tank is connected to the position of the first collection tank to receive the forming material swept to the position by the sweeping tool.

Abstract: A 3D printing method adapted to a 3D printing apparatus to print a 3D object is provided. The 3D object includes at least one forming layer. The 3D printing apparatus includes a platform, a nozzle module, a roller and a curing module. The 3D printing method includes: setting an initial height of the roller relative to the platform and setting a moving pitch in height of the roller relative to the platform according to design data of the 3D object; spraying at least one layer of a liquid forming material on the platform by the nozzle module; curing the liquid forming material into a first forming layer by the curing module; spraying the liquid forming material on the first forming layer; and levelling the liquid forming material on the first forming layer by the roller.

Abstract: A method for driving a display device includes steps of providing a data signal in a first scan period and maintaining a level of the data signal until a second scan period, and providing a scan signal in the first scan period and maintaining a level of the scan signal until the second scan period. A display device is also disclosed herein.

Abstract: A semiconductor device package ready for assembly includes: a semiconductor substrate; a first under-bump-metallurgy (UBM) layer disposed on the semiconductor substrate; a first conductive pillar disposed on the first UBM layer; and a second conductive pillar disposed on the first conductive pillar. A material of the first conductive pillar is different from a material of the second conductive pillar, and the material of the second conductive pillar includes an antioxidant.

Abstract: One dynamic task scheduling method includes: receiving a task, wherein the task comprises a kernel and a plurality of data items to be processed by the kernel; dynamically partitioning the task into a plurality of sub-tasks, each having the kernel and a variable-sized portion of the data items; and dispatching the sub-tasks to a plurality of computing devices of a heterogeneous computing system. Another dynamic task scheduling method includes: receiving a task, wherein the task comprises a kernel and a plurality of data items to be processed by the kernel; partitioning the task into a plurality of sub-tasks, each having the kernel and a same fixed-sized portion of the data items; and dynamically dispatching the sub-tasks to a plurality of computing devices of a heterogeneous computing system.

Abstract: A semiconductor device package ready for assembly includes: a semiconductor substrate; a first under-bump-metallurgy (UBM) layer disposed on the semiconductor substrate; a first conductive pillar disposed on the first UBM layer; and a second conductive pillar disposed on the first conductive pillar. A material of the first conductive pillar is different from a material of the second conductive pillar, and the material of the second conductive pillar includes an antioxidant.

Abstract: A graphics accelerator device offloads the workload of a graphics processing unit (GPU) by performing image composition and other specialized functions. The graphics accelerator device includes a rasterization module to rasterize a set of primitives to a set of pixels and generate information of the set of pixels. The graphics accelerator device also includes intra-process module to retrieve pixel values from a memory according to the information received from the rasterization module, perform mathematical calculations on the pixel values, and generate one or more processed image layers. The graphics accelerator device further includes an inter-process module to composite the one or more processed image layers received from the intra-process module with other image layers retrieved from the memory, and output a composited image to a display.