Patents by Inventor Chen-Chih Fan
Chen-Chih Fan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240036198Abstract: Embodiments of the present disclosure provide an optical ranging device capable of reducing or eliminating pile up effect in DToF ranging method. The optical ranging device comprises a light source; a sensor module comprising a SPAD array, wherein the SPAD array comprises a first SPAD group without aperture and a second SPAD group with a first aperture, and the sensor module separately outputs a photon detection value corresponding to a number of photons received by each SPAD group; and a processing module for calculating a distance between the object to be measured and the ranging device using the photon detection value based on DToF. In response to light intensity received by the SPAD array in a first pulse window being greater than a first threshold, the distance is calculated using the photon detection value of the second SPAD group in the first pulse window.Type: ApplicationFiled: December 27, 2022Publication date: February 1, 2024Inventors: Wan-Jung Lo, Chen-Chih Fan
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Publication number: 20230261013Abstract: The invention provides a photoelectric sensor including a substrate and multiple pixel structures. The pixel structures are disposed on the substrate and arranged in an array. Each of the pixel structures includes a transistor and a photodiode. The photodiode includes a first electrode, a photosensitive layer, and a second electrode. The first electrode and the transistor are laterally arranged side by side. A first part of the photosensitive layer is disposed on the first electrode, and a second part of the photosensitive layer extends from the first part to above the transistor. The second electrode is disposed on the photosensitive layer, and is located above the first electrode and the transistor.Type: ApplicationFiled: November 27, 2020Publication date: August 17, 2023Applicant: Egis Technology Inc.Inventors: Bruce C. S. Chou, Chen-Chang Huang, Chen-Chih Fan
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Patent number: 11709095Abstract: A light sensing module including a photodiode array substrate, a distance increasing layer, and a light converging element array is provided. The photodiode array substrate includes a plurality of light sensing units arranged in an array and a circuit region. The circuit region is disposed on the periphery of the light sensing units. Each of the light sensing units includes a plurality of adjacent photodiodes arranged in an array. The distance increasing layer is disposed on the photodiode array substrate. The light converging element array is disposed on the distance increasing layer, and includes a plurality of light converging units arranged in an array. Reflected light from an outside is converged by the light converging elements on the light sensing units, respectively.Type: GrantFiled: October 13, 2021Date of Patent: July 25, 2023Assignee: Egis Technology Inc.Inventors: Chen-Chih Fan, Bruce C. S. Chou
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Publication number: 20230181067Abstract: An in-cell optical biometrics sensor includes: a display unit sets each including one or multiple display units; optical sensing cells respectively disposed in gaps between the display unit sets; and optical modules respectively disposed adjacently to the optical sensing cells, wherein each optical module includes a light shielding layer for shielding stray light, and the optical sensing cells sense biometrics characteristics of an object through the optical modules. Thus, the optical biometrics sensor can be integrated in a display panel to provide partial or full-display optical biometrics characteristics sensing functions.Type: ApplicationFiled: September 11, 2020Publication date: June 15, 2023Inventors: CHEN-CHIH FAN, CHENCHANG HUANG, BRUCE C.S. CHOU
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Publication number: 20230132008Abstract: The present disclosure provides an optical sensor, an optical distance sensing module and a fabricating method thereof. According to the embodiments of the present disclosure, the optical sensor includes an optical sensing layer, a light transmitting layer and a light blocking layer. The optical sensing layer includes an array of optical sensing elements, the light transmitting layer is coated on the optical sensing layer, and the light blocking layer includes one or more light incident holes and is coated on the light transmitting layer. The optical sensing layer, the light transmitting layer and the light blocking layer are packaged as a wafer die. Light passes through the light incident holes and transmits through the light transmitting layer to irradiate on the array of optical sensing elements. The optical sensor effectively reduces the thickness, size and weight of the optical sensor, thereby expanding the application range of the optical sensor.Type: ApplicationFiled: August 11, 2022Publication date: April 27, 2023Inventors: Chen-Chih Fan, Bruce C. S. Chou
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Publication number: 20230063838Abstract: A light-receiving cell and an optical biometrics sensor using the same are provided. The light-receiving cell for converting optical energy into electrical energy includes: one or multiple main light-receiving regions; and a connection region directly connected to the one or multiple main light-receiving regions to form an area-reduced light-receiving region, wherein the light-receiving region has one or multiple area reduced parts to decrease junction capacitance and increase a sensing voltage signal.Type: ApplicationFiled: August 12, 2021Publication date: March 2, 2023Inventors: BRUCE C. S. CHOU, CHENCHANG HUANG, CHEN-CHIH FAN
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Publication number: 20220333911Abstract: A distance sensing apparatus including a substrate, a light source, a sensing device and an encapsulation structure is provided. The sensing device includes a sensing element and a light-shielding structure. The light source disposed in a light source region emits a beam for irradiating an object to be sensed. The light-shielding structure is disposed on the sensing element. The light source and the sensing device are disposed in the encapsulation structure. The encapsulation structure has a first opening corresponding to a sensing region. The light-shielding structure is disposed between the sensing element and the first opening, and the sensing element receives a beam to be sensed reflected by the object to be sensed and penetrating the first opening and at least a light-transmitting hole of the light-shielding structure. The light source region and the sensing regions are interconnected in the encapsulation structure.Type: ApplicationFiled: April 8, 2022Publication date: October 20, 2022Applicant: Egis Technology Inc.Inventor: Chen-Chih Fan
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Publication number: 20220301337Abstract: A fingerprint sensing module suitable for receiving a sensing light beam and an electronic device is provided. The fingerprint sensing module includes a sensing element, a light transmitting layer disposed on the sensing element, a micro-lens layer disposed on the light transmitting layer, and a first light shielding layer disposed in the light transmitting layer and including multiple first openings arranged in an array. Positions of the first openings in odd-numbered rows are the same, and those in even-numbered rows are the same. Positions the first openings in the odd-numbered rows are different from those in the even-numbered rows. A sensing light beam includes multiple first light beams incident to a part of a sensing unit in a first transmission direction and multiple second light beams incident to another part of the sensing unit in a second transmission direction. The first transmission direction is different from the second transmission direction.Type: ApplicationFiled: April 29, 2020Publication date: September 22, 2022Applicants: Egis Technology Inc.Inventors: Yu-Hsiang Huang, Chen-Chih Fan, Yu-Kuo Cheng, Bruce C. S. Chou
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Publication number: 20220299361Abstract: A light sensing module including a photodiode array substrate, a distance increasing layer, and a light converging element array is provided. The photodiode array substrate includes a plurality of light sensing units arranged in an array and a circuit region. The circuit region is disposed on the periphery of the light sensing units. Each of the light sensing units includes a plurality of adjacent photodiodes arranged in an array. The distance increasing layer is disposed on the photodiode array substrate. The light converging element array is disposed on the distance increasing layer, and includes a plurality of light converging units arranged in an array. Reflected light from an outside is converged by the light converging elements on the light sensing units, respectively.Type: ApplicationFiled: October 13, 2021Publication date: September 22, 2022Applicant: Egis Technology Inc.Inventors: Chen-Chih Fan, Bruce C. S. Chou
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Publication number: 20220293657Abstract: An integrated optical sensor includes a substrate, an optical module layer and micro lenses. The substrate has sensing pixels. The optical module layer is disposed on the substrate. The micro lenses are disposed on the optical module layer. A thickness of the optical module layer defines a focal length of the micro lenses, and the sensing pixels sense object light of an object, which is focused by the micro lenses and optically processed by the optical module layer. The optical module layer includes a metal light shielding layer and an inter-metal dielectric layer disposed above the metal light shielding layer. The object light reaches the sensing pixels through apertures of the metal light shielding layer. A method of manufacturing the integrated optical sensor is also provided.Type: ApplicationFiled: March 18, 2020Publication date: September 15, 2022Inventors: Bruce C. S. CHOU, Chen-Chih FAN
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Publication number: 20220082672Abstract: A TOF optical sensing module to be disposed below a protection cover plate includes: a substrate; a cap having a cap body, and a receiving window, a transmitting window and a stray-light guide-away structure, which are connected to the cap body, wherein the cap and the substrate commonly define a chamber body; and a transceiving unit, which is disposed on the substrate, in the chamber body, outputs detection light through the transmitting window, and receives sensing light through the receiving window. The stray-light guide-away structure is disposed between an outer side between the protection cover plate and the cap body and between the transmitting window and the receiving window, and stops stray light from entering the transceiving unit through the receiving window.Type: ApplicationFiled: June 25, 2021Publication date: March 17, 2022Inventors: BRUCE C.S. CHOU, CHEN-CHIH FAN
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Publication number: 20220082663Abstract: A TOF optical sensing module includes: a substrate; a cap including a body and a receiving window, a transmitting window and a stopper structure all connected to the body defining a chamber with the body; and a transceiving unit being disposed in the chamber, outputting detection light and receiving sensing light through the receiving window, wherein the stopper structure divides the chamber into a receiving chamber and an emitting chamber, which are respectively disposed beneath the receiving window and the transmitting window and dis-communicated from each other, in conjunction with the transceiving unit. The transceiving unit includes a light reference region including: at least a reference pixel disposed beneath the stopper structure; and a light-guiding structure optically coupled to the reference pixel and the emitting chamber, so that the reference pixel receives reference light through the emitting chamber and the light-guiding structure to generate an electric reference signal.Type: ApplicationFiled: August 27, 2021Publication date: March 17, 2022Inventors: BRUCE C. S. CHOU, CHEN-CHIH FAN
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Publication number: 20220082670Abstract: A TOF optical sensing module includes: a substrate; a cap having a body and a receiving window and a transmitting window both connected to the body, wherein the body and the substrate commonly define a chamber; and a transceiving unit being disposed in the chamber and including: a light sensing region being disposed beneath the receiving window and including an angular sensing-end light-guiding structure and at least a sensing pixel, wherein the angular sensing-end light-guiding structure is configured to stop reference light, coming from the chamber and a location below the transmitting window, from entering the sensing pixel, but allow sensing light to be received by the sensing pixel through the receiving window to generate an electric sensing signal.Type: ApplicationFiled: August 27, 2021Publication date: March 17, 2022Inventors: Bruce C.S. CHOU, CHEN-CHIH FAN
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Publication number: 20220019753Abstract: A fingerprint sensing apparatus is provided. A driving circuit drives a capacitive micromachined ultrasonic transducer (CMUT) array to emit a planar ultrasonic wave to a finger during a transmission period to generate reflected ultrasonic signals. CMUTs receive the reflected ultrasonic signals during a receiving period to generate sensing current signals. A sensing circuit senses the sensing current signals output by the CMUTs to generate fingerprint sensing signals.Type: ApplicationFiled: June 10, 2021Publication date: January 20, 2022Applicant: Egis Technology Inc.Inventors: Di Bao Wang, Chen-Chih Fan
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Publication number: 20210271841Abstract: The present invention relates to an electronic device with a lens supporting element. The electronic device includes a display screen, an intermediate frame, a lens supporting element, an interface structure and a base structure. The intermediate frame has a frame hollow region. A fingerprint sensing unit is installed on the lens supporting element. The fingerprint sensing unit is located near the frame hollow region through the lens supporting element. The interface structure is arranged between the intermediate frame and the lens supporting element, and/or arranged between the lens supporting element and the base frame. Consequently, the lens supporting element is positioned in or clamped between the intermediate frame and the base structure through the interface structure.Type: ApplicationFiled: October 18, 2019Publication date: September 2, 2021Inventors: PIN-YU CHEN, TONG-LONG FU, CHEN-CHIH FAN
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Patent number: 11101390Abstract: A manufacturing method of a sensing module for an optical fingerprint sensor is provided. A plurality of photo detectors are formed in a light sensing layer. The photo detectors are arranged in a sensing array. A plurality of collimators are formed in a light filter layer. The collimators are divided into a plurality of collimator groups corresponding to the photo detectors. The collimator groups are arranged in a collimator group array. The light sensing layer is attached to the light filter layer so that the light filter layer is disposed on the light sensing layer and the collimator group array of the light filter layer is aligned with the sensing array of the light sensing layer. Each of the collimator groups corresponds to one of the photo detectors, and aligned with and disposed above the corresponding photo detector. Each of the collimator groups comprises the same number of collimators arranged in a specific pattern.Type: GrantFiled: April 28, 2020Date of Patent: August 24, 2021Assignee: EGIS TECHNOLOGY INC.Inventors: Yu-Hsiang Huang, Tong-Long Fu, Chen-Chih Fan
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Patent number: 11100891Abstract: An electronic device using an under-display fingerprint identification technology and a waking method of the electronic device are provided. The electronic device includes a display panel, a central processing unit and a fingerprint sensing module. The electronic device executes an operating system. When the central processing unit and the operating system are in a power-saving mode, the fingerprint sensing module enters a default operation mode and the display panel enters an always-on display mode. Then, the fingerprint sensing module senses a specified region of the display panel to acquire a first image. If the content of the first image contains an image of a finger, the fingerprint sensing module issues an interrupt signal to the central processing unit. Consequently, the central processing unit is woken up from the power-saving mode and the operating system is woken up.Type: GrantFiled: October 15, 2019Date of Patent: August 24, 2021Assignee: Egis Technology Inc.Inventors: Tong-Long Fu, Chen-Chih Fan, Chun-Ching Tseng, Wei-Jung Wang, Chun-Feng Kao, Yung-Fu Chen
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Publication number: 20210248339Abstract: An ultrasonic fingerprint sensing architecture is provided. The ultrasonic fingerprint sensing architecture includes a substrate, a plurality of ultrasonic transceivers, and a waveguide layer. The plurality of ultrasonic transceivers are disposed on the substrate. The waveguide layer is formed on the substrate. The waveguide layer includes a plurality of waveguides. The inside of the plurality of waveguides is filled with a first material and the outside of the plurality of waveguides is filled with a second material. An acoustic impedance of the first material is greater than an acoustic impedance of the second material. The plurality of waveguides are configured to align with the corresponded ultrasonic transceivers respectively in an acoustic wave transmission direction.Type: ApplicationFiled: August 26, 2020Publication date: August 12, 2021Applicant: Egis Technology Inc.Inventors: Di Bao Wang, Chen-Chih Fan
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Publication number: 20210160414Abstract: A display includes: a display panel having display pixels and providing visible light to display information; an optical sensor sensing an object disposed above the display panel; and an infrared (IR) source providing initial IR light penetrating through the display panel to illuminate the object, which generates to-be-sensed IR light penetrating through the display panel and received by the optical sensor, which obtains an image signal, wherein the IR source is disabled in a first period when the display pixels are enabled, and is enabled in a second period of a disable period when the display pixels are disabled. The second period lags behind the first period by a third period. An optical sensing module is also provided.Type: ApplicationFiled: September 8, 2020Publication date: May 27, 2021Inventors: TONG-LONG FU, CHEN-CHIH FAN, WEI JUNG WANG
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Patent number: 10885303Abstract: An optical fingerprint sensing module for sensing a fingerprint pattern of a finger placed on an upper surface of a display panel module is provided, wherein light is generated by the display panel module and reflected by the finger. The optical fingerprint sensing module includes a substrate, an image sensor disposed above the substrate, a collimating layer disposed above the image sensor, a light permeable layer disposed above the collimating layer, and a pinhole layer disposed above the light permeable layer. The collimating layer has a plurality of collimating holes, and the pinhole layer has a plurality of pinholes, wherein the number of collimating holes is greater than the number of pinholes. Light is reflected by the finger and then sequentially propagates through the pinholes, the light permeable layer, and the collimating holes to reach the image sensor.Type: GrantFiled: July 11, 2019Date of Patent: January 5, 2021Assignee: EGIS TECHNOLOGY INC.Inventors: Chen-Chih Fan, Tong-Long Fu, Yu-Hsiang Huang