Abstract: A boost converter that provides a wide average current limiting range includes a switch coupled to an inductor output and a power input, a diode coupled to the inductor output and an output terminal load and configured to conduct current in only one direction away from the inductor output and toward the output terminal, a clamp circuit coupled to the diode and the switch, and a minimum time off module coupled to the diode and the switch. The clamp circuit is configured to clamp an inductor output current to a reference current while the converter is operating in a continuous conduction mode (CCM) of operation. The minimum time off module is configured to cause the inductor output current to be zero for at least a time Toff while the converter is operating in a pulse frequency modulation (PFM) mode of operation.

Abstract: A device includes an integrated circuit die attached to a substrate; a lid attached to the integrated circuit die; a sealant on the lid; a spacer structure attached to the substrate adjacent the integrated circuit die; and a cooling cover attached to the spacer structure, wherein the cooling cover extends over the lid, wherein the cooling cover attached to the lid by the sealant. In an embodiment, the device includes a ring structure on the substrate, wherein the ring structure is between the spacer structure and the integrated circuit die.

Abstract: The present invention relates to novel, selective, radiolabelled compound having monoacylglycerol lipase (MGL) affinity which are useful for imaging and quantifying MGL receptor expression, distribution and enzyme occupancy in tissues, using positron-emission tomography (PET). The invention is also directed to compositions comprising such compounds, the use of such compounds and compositions for imaging a tissue, cells or a host, in vitro or in vivo and to precursors of said compounds.

Abstract: In an embodiment, a structure includes: a first integrated circuit die including first die connectors; a first dielectric layer on the first die connectors; first conductive vias extending through the first dielectric layer, the first conductive vias connected to a first subset of the first die connectors; a second integrated circuit die bonded to a second subset of the first die connectors with first reflowable connectors; a first encapsulant surrounding the second integrated circuit die and the first conductive vias, the first encapsulant and the first integrated circuit die being laterally coterminous; second conductive vias adjacent the first integrated circuit die; a second encapsulant surrounding the second conductive vias, the first encapsulant, and the first integrated circuit die; and a first redistribution structure including first redistribution lines, the first redistribution lines connected to the first conductive vias and the second conductive vias.

Abstract: The present disclosure relates to a smart exercise apparatus. The apparatus includes two pull cables each having a free end, and damping mechanisms configured to supply damping forces to the pull cables; and further includes a mount, arms, and a display raisably and lowerably connected to the mount. The arms are detachably connected to the mount, and the height of the arms is adjustable. The free ends of the two pull cables are respectively led out from two ends of the arms.

Abstract: Disclosed is an exercise bench. In the exercise bench, a resistance assembly arranged inside a machine body supplies resistance forces to two pull cables, and the two pull cables are respectively led out from shields on two sides of a deck and change their directions by two pull cable steering mechanisms.

Abstract: Disclosed is a smart exercise apparatus equipped with electronic tags. The apparatus includes an exercise apparatus and an accessory. The exercise apparatus is provided with a reader, and the accessory is provided with an electronic tag, wherein the electronic tag is wirelessly connected to the reader. In the smart exercise apparatus, readers and electronic tags are respectively arranged on the exercise apparatus and the accessories thereof, such that the accessories are automatically identified in response to approaching the exercise apparatus.

Abstract: A bond head is provided. The bond head includes a bond base, a chuck member, and an elastic material. The chuck member protrudes from a surface of the bond base, and has a chuck surface formed with vacuum holes for holding a die using differential air pressure. In the direction parallel to the chuck surface, the width of the chuck surface is less than the width of the bond base and is equal to or greater than the width of the die. The elastic material is disposed over the chuck surface. The elastic material is arranged around the periphery of the chuck surface to cover edges and/or corners of the chuck surface.

Abstract: A rowing machine includes a rowing machine body, and further includes a fixing member, a deck fixedly connected to a lower portion of the rowing machine body, a receiving chamber opened in the fixing member, one end of the deck being rotatably connected to a lower end of the receiving chamber, and a size of the deck being identical to a size of the receiving chamber.

Abstract: A package structure includes a first thermal dissipation structure, a first semiconductor die, a second semiconductor die. The first thermal dissipation structure includes a semiconductor substrate, conductive vias embedded in the semiconductor substrate, first capacitors electrically connected to the conductive vias, and a thermal transmission structure disposed over the semiconductor substrate and the conductive vias. The first semiconductor die is disposed on the first thermal dissipation structure. The second semiconductor die is disposed on the first semiconductor die opposite to the first thermal dissipation structure.

Abstract: A controlling method and apparatus of a cleaning robot, a cleaning method and apparatus, a system, and a storage medium are provided. The method includes: controlling the cleaning robot to mop a preset cleaning region through a mopping member; obtaining a first dirtiness degree corresponding to the preset cleaning region; determining that the preset cleaning region includes a target region according to the first dirtiness degree, the target region being a region that needs to be repeatedly mopped; and controlling the cleaning robot to mop at least part of the target region through the mopping member after mopping of the preset cleaning region has been completed and after maintenance of the mopping member.

Abstract: A processor device has a CPU cooperating with an input device and an output device, under control of stored instructions, and is arranged to receive service requests at the input device, assign service requests received in successive time periods to respective batches of requests; access stored service provider data to identify available service providers from among a pool of service providers; after completing the assignment of service requests to a batch, perform a matching process to endeavour to match each service request of the batch of requests to a service provider; and for each service provider to whom a match is made, output a notification of the respective potential match from the output device.

Abstract: A fluid-driven actuator 100 includes a bending actuator 200 including a first wall portion 201, a second wall portion 203 cooperating with the first wall portion 201 to define an undulating actuator profile. The bending actuator 200 also includes an inner fluid bladder 202 disposed between the first and second wall portions 201,203 and following the undulating actuator profile. The fluid-driven actuator 100 further includes a restraint member 300 arranged to cooperate with the bending actuator 200 to produce a plurality of motions in response to fluid supplied to the inner fluid bladder 202.

Abstract: A package includes a first package component including a semiconductor die, wherein the semiconductor die includes conductive pads, wherein the semiconductor die is surrounded by an encapsulant; an adaptive interconnect structure on the semiconductor die, wherein the adaptive interconnect structure includes conductive lines, wherein each conductive line physically and electrically contacts a respective conductive pad; and first bond pads, wherein each first bond pad physically and electrically contacts a respective conductive line; and a second package component including an interconnect structure, wherein the interconnect structure includes second bond pads, wherein each second bond pad is directly bonded to a respective first bond pad, wherein each second bond pad is laterally offset from a corresponding conductive pad which is electrically coupled to that second bond pad.

Abstract: Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device comprises a source region and a drain region in a substrate and laterally spaced. A gate stack is over the substrate and between the source region and the drain region. The drain region includes two or more first doped regions having a first doping type in the substrate. The drain region further includes one or more second doped regions in the substrate. The first doped regions have a greater concentration of first doping type dopants than the second doped regions, and each of the second doped regions is disposed laterally between two neighboring first doped regions.

Abstract: A method of removing a sacrificial substructure from a support structure is disclosed. The method includes receiving the support structure, where the support structure has the sacrificial substructure connected thereto, the sacrificial substructure having functioning electrical devices removed therefrom. The method also includes applying a barrier to the sacrificial substructure, puncturing the sacrificial substructure with a puncture plate to secure the sacrificial substructure to the puncture plate, and detaching the sacrificial substructure from the support structure by moving the puncture plate with respect to the support structure.

Abstract: A method for semiconductor manufacturing is disclosed. The method includes receiving a device having a first surface through which a first metal or an oxide of the first metal is exposed. The method further includes depositing a dielectric film having Si, N, C, and O over the first surface such that the dielectric film has a higher concentration of N and C in a first portion of the dielectric film near the first surface than in a second portion of the dielectric film further away from the first surface than the first portion. The method further includes forming a conductive feature over the dielectric film. The dielectric film electrically insulates the conductive feature from the first metal or the oxide of the first metal.

Abstract: A wafer alignment assembly is provided. The wafer alignment assembly includes: a first tapered wall extending in a first horizontal direction; a first spring wall attached to an inner surface of the first tapered wall; a first set of conveyor rollers configured to rotate; a second tapered wall extending in the first horizontal direction, wherein the first tapered wall and the second tapered wall are characterized by a tapered shape that facilitates entry of a wafer assembly; a second spring wall attached to an inner surface of the first tapered wall; and a second set of conveyor rollers configured to rotate.

Abstract: At least one embodiment, a vacuum chuck includes a moisture gate structure that allows for moisture to escape to reduce an amount of warpage in a workpiece when present on the vacuum chuck. The moisture gate structure includes a base portion that extends laterally outward from a central vacuum portion of the vacuum chuck, and a plurality of protrusions are spaced apart from the central vacuum portion and extend outward from the base portion. End surfaces of the plurality of protrusions contact a backside surface of the workpiece (e.g., a wafer on a carrier) when the workpiece is present on the vacuum chuck. The vacuum chuck may further include one or more guide portions that act as guides such that the workpiece remains properly aligned and within position when present on the vacuum chuck.

Abstract: A system for bipartite matching may: receive a first set of first objects and a second set of second objects; create a minimum priority queue for each unmatched first object of the first set of first objects, wherein the minimum priority queue for each unmatched first object of the first set of first objects comprises unmatched second objects of the second set of second objects; determine a first set of edge data in which lower-bound reduced costs for matching each unmatched first object with the unmatched second objects is less than or equal to zero; determine an exact cost of each edge data in the first set of edge data; and match each unmatched first object of the first set of first objects with an unmatched second object based on the exact cost of each edge data in the first set of edge data.