Patents by Inventor Chen Ma

Chen Ma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220037238
    Abstract: A layout structure of flexible circuit board includes a flexible substrate, a chip and a circuit layer. A chip mounting area and a circuit area are defined on a top surface of the flexible substrate, the circuit area surrounds the chip mounting area. The chip is mounted on the chip mounting area of the top surface and includes a bump. The circuit layer is disposed on the top surface. A connection portion of the circuit layer extends across a first side of the chip mounting area and into the chip mounting area. A transmission portion of the circuit layer is located on the circuit area and electrically connected to the connection portion. A stress release portion of the circuit layer is located between the transmission portion and a second side of the chip mounting area and is a comb-shaped structure.
    Type: Application
    Filed: April 12, 2021
    Publication date: February 3, 2022
    Inventors: Yu-Chen Ma, Hsin-Hao Huang, Wen-Fu Chou, Gwo-Shyan Sheu
  • Patent number: 11226806
    Abstract: The disclosure provides a projector and a projector firmware updating method therefor. The projector is connected to a cloud server through a network connection. The first processor of the projector executes a first firmware updating process corresponding to a request firmware, including: identifying the first request unique identification code of the projector and the request firmware serial number of the request firmware, and transmitting the first request unique identification code and the request firmware serial number to the cloud server; if the request firmware is not the latest version, receiving the first target firmware from the cloud server and updates the request firmware by using the first target firmware, and completing the first firmware updating process. The projector and projector firmware updating method of the disclosure can efficiently update the firmware to the latest or specific version according to the unique identification code of the projector.
    Type: Grant
    Filed: February 17, 2020
    Date of Patent: January 18, 2022
    Assignee: Coretronic Corporation
    Inventors: Yi-Fa Wang, Shih-Min Wu, Ping-Chen Ma
  • Patent number: 11181266
    Abstract: Disclosed is a method for calculating combustion in the bed of a waste incinerator. The method is based on a model of combustion in a waste incinerator bed and comprises a water evaporation model, a volatile matter analysis model, a volatile matter combustion model, and a fixed carbon combustion model. The volatile matter of the volatile matter combustion model comprises CO, H2, CH4, NH3, and H2S. The volatile matter combustion model comprises a combustion reaction equation for said volatile matter and O2, and respective equations for CO and CH4 reacting with water vapor. Equations governing the model of combustion in the bed of a waste incinerator comprise a continuity equation, an energy equation, a momentum equation, and a component equation. Boundary conditions of said governing equations comprise: equations of heat transfer and mass transfer from an upper boundary layer of the bed to the exterior; and equations of heat transfer and mass transfer from lower boundary layer of the bed to the exterior.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: November 23, 2021
    Assignee: TIANJIN UNIVERSITY
    Inventors: Guanyi Chen, Tianbao Gu, Wenchao Ma, Chen Ma, Li'an Hou, Beibei Yan, Bin Liu
  • Patent number: 11170209
    Abstract: An underwater camera system for monitoring fish in a fish pen is described. A stereoscopic camera may be used to determine dimensions of fish, and the underwater camera system may use the fish dimensions to estimate a biomass value of fish within the fish pen. The biomass value and rates of change of the biomass value may be used to adjust feeding of the fish in the fish pen. Images captured by the stereoscopic camera may be used to focus a variable focal lens camera on a fish to obtain high-resolution images that can be used for diagnosing fish conditions. Images captured by the stereoscopic camera may be used to predict motion of the fish, and the predicted motion may be used to generate various fish monitoring analytic values. The fish monitoring analytic values may be used to automatically control operation of the fish pen.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: November 9, 2021
    Assignee: Innovasea Systems, Inc.
    Inventors: Chen Ma, Srikanth Parupati, Raghunandan Pasula
  • Publication number: 20210321593
    Abstract: In some embodiments, an underwater camera system for monitoring fish in a fish pen is provided. In some embodiments, a stereoscopic camera may be used to determine dimensions of fish, and the underwater camera system may use the fish dimensions to estimate biomass of fish within the fish pen. The biomass value and rates of change of the biomass value may be used to adjust feeding of the fish in the fish pen. In some embodiments, images captured by the stereoscopic camera may be used to focus a variable focal lens camera on a fish to obtain high-resolution images that can be used for diagnosing fish conditions. In some embodiments, images captured by a camera may be used to predict motion of the fish, and the predicted motion may be used to generate various fish monitoring analytic values. The fish monitoring analytic values may be used to automatically control operation of the fish pen.
    Type: Application
    Filed: April 21, 2020
    Publication date: October 21, 2021
    Applicant: InnovaSea Systems, Inc.
    Inventors: Chen Ma, Srikanth Parupati, Raghunandan Pasula
  • Patent number: 11116806
    Abstract: Provided are a composite probiotic lactic acid bacteria powder and a preparation method and use thereof, the composite probiotic lactic acid bacteria powder can be composited from Lactobacillus casei Zhang bacteria powder, Bifidobacterium animalis V9 bacteria powder, Lactobacillus plantarum P8 bacteria powder, Lactobacillus plantarum C2 bacteria powder, with prebiotics and fruit-vegetable powder. The composite probiotic lactic acid bacteria powder has a significantly protective effect against irritable bowel syndrome, oral infection and nasal cavity infection, and can prevent the occurrence of upper respiratory tract infection, at the same time, it can improve gastrointestinal symptoms, regulate gut microbiota and improve the body's immunity.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: September 14, 2021
    Assignee: BEIJING SCITOP BIO-TECH CO., LTD.
    Inventors: Jianjun Zhang, Chen Ma, Jicheng Wang
  • Publication number: 20210278899
    Abstract: A display control method, a display control system, and a wearable device are provided. The display control system includes a display device and a wearable device. The wearable device includes a detector and a microcontroller. The display control method is suitable for the display control system. The method includes: establishing a connection with the display device by the wearable device; in response to the wearable device detecting a display activation operation, enabling a display function of the display device through the connection by the wearable device; and in response to the wearable device detecting a communication activation operation, activating a communication mode between the wearable device and the display device by the wearable device. By using the display control system and method provided by the invention, the user can remotely operate the display device under relatively unrestricted conditions, and that operation is conveniently performed.
    Type: Application
    Filed: March 4, 2021
    Publication date: September 9, 2021
    Applicant: Coretronic Reality Incorporation
    Inventors: Yi-Fa Wang, Ping-Chen Ma, Shih-Min Wu
  • Publication number: 20210268446
    Abstract: A method of forming a molecular separation device is provided. The method comprises growing or depositing a silica MFI zeolite coating on a ceramic support. The method further comprises growing a ZIF-8 coating on the silica MFI zeolite coating. Growing the ZIF-8 coating on the silica MFI zeolite comprises applying a first reactant fluid including a metal salt and a second reactant fluid including an imidazole reactant to the silica MFI zeolite coating. Growing the ZIF-8 coating on the silica MFI zeolite further comprises reacting the first and second reactant fluid with the silica MFI zeolite coating to produce the ZIF-8 coating. In certain implementations, at least a portion of the ZIF-8 coating is interspersed with a portion of the silica MFI coating. A molecular separation device including the ZIF-8 coating and the silica MFI zeolite is also disclosed.
    Type: Application
    Filed: February 27, 2020
    Publication date: September 2, 2021
    Inventors: Kiwon Eum, Shaowei Yang, Byunghyun Min, Chen Ma, Jeffrey H. Drese, Yash Tamhankar, Ryan P. Lively, Sankar Nair
  • Publication number: 20210262658
    Abstract: Disclosed is a method for calculating combustion in the bed of a waste incinerator. The method is based on a model of combustion in a waste incinerator bed and comprises a water evaporation model, a volatile matter analysis model, a volatile matter combustion model, and a fixed carbon combustion model. The volatile matter of the volatile matter combustion model comprises CO, H2, CH4, NH3, and H2S. The volatile matter combustion model comprises a combustion reaction equation for said volatile matter and O2, and respective equations for CO and CH4 reacting with water vapor. Equations governing the model of combustion in the bed of a waste incinerator comprise a continuity equation, an energy equation, a momentum equation, and a component equation. Boundary conditions of said governing equations comprise: equations of heat transfer and mass transfer from an upper boundary layer of the bed to the exterior; and equations of heat transfer and mass transfer from lower boundary layer of the bed to the exterior.
    Type: Application
    Filed: June 21, 2018
    Publication date: August 26, 2021
    Inventors: Guanyi Chen, Tianbao Gu, Wenchao Ma, Chen Ma, Li'an Hou, Beibei Yan, Bin Liu
  • Publication number: 20210265255
    Abstract: A flip chip interconnection including a circuit board is disclosed. The circuit board includes a substrate, inner leads, a T-shaped circuit line and a dummy pattern. The inner leads, the T-shaped circuit line and the dummy pattern are located on an inner bonding area of the substrate. The T-shaped circuit line includes a main segment, a branch segment and a connection segment that is connected to the main segment and the branch segment. The main segment and the branch segment are extended along a lateral direction and a longitudinal direction, respectively. The dummy pattern is located between the connection segment and the inner leads.
    Type: Application
    Filed: September 30, 2020
    Publication date: August 26, 2021
    Inventors: Yu-Chen Ma, Hsin-Hao Huang, Wen-Fu Chou, Gwo-Shyan Sheu
  • Publication number: 20210257287
    Abstract: A chip package includes a circuit board, a chip and an underfill. The circuit board includes a substrate, first circuit lines and second circuit lines. Each of the first circuit lines includes an inner lead and a first line fragment that are disposed on a chip mounting area and an underfill covering area of the substrate, respectively. The second circuit lines are disposed on the chip mounting area and not located between the adjacent inner leads so as to form a wider space between the adjacent first line fragments. The wider space enables the underfill to flow to between the circuit board and the chip and prevents air bubbles from being embedded in the underfill filled between the circuit board and the chip.
    Type: Application
    Filed: August 6, 2020
    Publication date: August 19, 2021
    Inventors: Yu-Chen Ma, Hsin-Hao Huang, Wen-Fu Chou, Gwo-Shyan Sheu
  • Publication number: 20210204401
    Abstract: A flexible circuit board includes a flexible substrate and a stiffening structure, a stiffening area is defined on a bottom surface of the flexible substrate, and the stiffening structure includes a first stiffener and a second stiffener. The first stiffener is disposed on the stiffening area of the bottom surface and the second stiffener is disposed on the first stiffener such that the first stiffener is located between the flexible substrate and the second stiffener. The flexible substrate is protected from punch damage caused by stress concentrations because a cutting line of the flexible substrate only passes through the first stiffener.
    Type: Application
    Filed: June 29, 2020
    Publication date: July 1, 2021
    Inventors: Yu-Chen Ma, Hsin-Hao Huang, Wen-Fu Chou, Gwo-Shyan Sheu
  • Publication number: 20210202422
    Abstract: A flip chip interconnection includes a circuit board, a chip and a solder layer. The chip is mounted on an inner bonding area of the circuit board, the solder layer is located between the circuit board and the chip for bonding bumps to inner leads and a T-shaped circuit unit on the inner bonding area. The T-shaped circuit unit has a main part, a connection part and a branch part, the connection part is connected to the main and branch parts, respectively. The main part extends along a lateral direction and the branch part extends outwardly along a longitudinal direction. The connection part is narrower than the main part in width so as to prevent solder short caused by solder overflow on the branch part.
    Type: Application
    Filed: June 24, 2020
    Publication date: July 1, 2021
    Inventors: Yu-Chen Ma, Hsin-Hao Huang, Wen-Fu Chou, Gwo-Shyan Sheu
  • Patent number: 10999928
    Abstract: A circuit board electrically connected to a chip includes a substrate and a circuit layer. A first conductive line of the circuit layer includes a main line and a branch lead connected with each other. The branch lead provided to increase lead quantity for bonding with the chip includes an extension part and a bonding part which is used for bonding a bump of the chip. During thermal compression, gaps existing between the extension part and the main line and between the bonding part and the main line can prevent solder on the main line from flowing toward the bump and overflowing from the branch lead.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: May 4, 2021
    Assignee: CHIPBOND TECHNOLOGY CORPORATION
    Inventors: Yu-Chen Ma, Hsin-Hao Huang, Wen-Fu Chou, Gwo-Shyan Sheu
  • Patent number: 10993319
    Abstract: A chip package includes a circuit board, a chip and an underfill. A solder resist layer formed on the circuit board is modified in edge profile so as to reduce required amount of the underfill. The fewer underfill is still enough to be filled between the circuit board and the chip, and still can cover circuit lines that are not covered by the solder resist layer to protect the circuit lines from oxidation.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: April 27, 2021
    Assignee: CHIPBOND TECHNOLOGY CORPORATION
    Inventors: Yu-Chen Ma, Hsin-Hao Huang, Wen-Fu Chou, Gwo-Shyan Sheu
  • Publication number: 20210101746
    Abstract: A cabinet for goods storage and access is provided, including: at least one fixed shelf configured to store goods; a moving member located on a side of the fixed shelf; a controller configured to control the moving member to move along the side of the fixed shelf to place goods in the fixed shelf or extract goods from the fixed shelf; a cabinet body surrounding the fixed shelf and the moving member, wherein a first slot is disposed on the cabinet body and adjacent to a moving track of the moving member, wherein the controller is configured to control the first slot to be opened or closed; and a volume recognizer disposed adjacent to the first slot to recognize a volume of goods entering the first slot.
    Type: Application
    Filed: December 11, 2020
    Publication date: April 8, 2021
    Inventors: Yung-Chen MA, Hongliang ZHOU, Wei LYU
  • Patent number: 10930281
    Abstract: Embodiments of the present disclosure disclose a method, apparatus and system for testing an intelligent voice device. A specific implementation of the method includes: acquiring test data, the test data comprising: to-be-executed field control data and to-be-played voice data; sending, based on the to-be-executed field control data, a first motion instruction to the omnidirectional mobile mechanism connected to the intelligent voice device and/or the voice playing device; sending a playing instruction, in response to determining that a relative pose of the intelligent voice device and the voice playing device is the target relative pose; receiving predefined device information, associated with the voice recognition, of the intelligent voice device; and generating a test result based on the device information.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: February 23, 2021
    Assignee: Beijing Baidu Netcom Science and Technology Co., Ltd.
    Inventor: Chen Ma
  • Publication number: 20200272449
    Abstract: The disclosure provides a projector and a projector firmware updating method therefor. The projector is connected to a cloud server through a network connection. The first processor of the projector executes a first firmware updating process corresponding to a request firmware, including: identifying the first request unique identification code of the projector and the request firmware serial number of the request firmware, and transmitting the first request unique identification code and the request firmware serial number to the cloud server; if the request firmware is not the latest version, receiving the first target firmware from the cloud server and updates the request firmware by using the first target firmware, and completing the first firmware updating process. The projector and projector firmware updating method of the disclosure can efficiently update the firmware to the latest or specific version according to the unique identification code of the projector.
    Type: Application
    Filed: February 17, 2020
    Publication date: August 27, 2020
    Applicant: Coretronic Corporation
    Inventors: Yi-Fa Wang, Shih-Min Wu, Ping-Chen Ma
  • Publication number: 20190371322
    Abstract: Embodiments of the present disclosure disclose a method, apparatus and system for testing an intelligent voice device. A specific implementation of the method includes: acquiring test data, the test data comprising: to-be-executed field control data and to-be-played voice data; sending, based on the to-be-executed field control data, a first motion instruction to the omnidirectional mobile mechanism connected to the intelligent voice device and/or the voice playing device; sending a playing instruction, in response to determining that a relative pose of the intelligent voice device and the voice playing device is the target relative pose; receiving predefined device information, associated with the voice recognition, of the intelligent voice device; and generating a test result based on the device information.
    Type: Application
    Filed: March 15, 2019
    Publication date: December 5, 2019
    Inventor: Chen Ma
  • Publication number: 20190216866
    Abstract: Provided are a composite probiotic lactic acid bacteria powder and a preparation method and use thereof, the composite probiotic lactic acid bacteria powder can be composited from Lactobacillus casei Zhang bacteria powder, Bifidobacterium animalis V9 bacteria powder, Lactobacillus plantarum P8 bacteria powder, Lactobacillus plantarum C2 bacteria powder, with prebiotics and fruit-vegetable powder. The composite probiotic lactic acid bacteria powder has a significantly protective effect against irritable bowel syndrome, oral infection and nasal cavity infection, and can prevent the occurrence of upper respiratory tract infection, at the same time, it can improve gastrointestinal symptoms, regulate gut microbiota and improve the body's immunity.
    Type: Application
    Filed: January 16, 2019
    Publication date: July 18, 2019
    Inventors: Jianjun ZHANG, Chen MA, Jicheng WANG