Patents by Inventor Cheng-Hsien Lee

Cheng-Hsien Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110231175
    Abstract: In an electronic device and a method of generating composite electrical signals, a plurality of post-processing software is installed. An output file, which comprises times and voltages of data points that represent an electrical signal, of an electronic circuit simulation software is loaded, and is read using the installed post-processing software. A time interval of outputs of the electrical signal is obtained by selecting an output type of the electrical signal. The worst bit combination of outputs of the electrical signal is analyzed according to the times, the voltage, and the time interval, and a composite electrical signal is generated according to the worst bit combination.
    Type: Application
    Filed: December 24, 2010
    Publication date: September 22, 2011
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHENG-HSIEN LEE, SHOU-KUO HSU
  • Publication number: 20110168437
    Abstract: A printed circuit board (PCB) includes a positive differential signal line including first and second segments, a negative differential signal line including third and fourth segments, first and second connecting elements soldered on opposite surfaces of the PCB. The first segment and the fourth segment are located in a first straight line which has a first permittivity. The third segment and the second segment are located in a second straight line which has a second permittivity different from the first permittivity. The first connecting element is connected between the first segment and the second segment. The second connecting element is connected between the third segment and the fourth segment.
    Type: Application
    Filed: January 25, 2010
    Publication date: July 14, 2011
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YUNG-CHIEH CHEN, CHENG-HSIEN LEE, SHOU-KUO HSU
  • Publication number: 20110161259
    Abstract: A method for simplification of a matrix based boosting algorithm divides a feature set comprising a plurality of feature data into several subsets, and assigns a number to each subset. The method selects a plurality of number groups including N subsets randomly. The method further computes a value by boosting algorithm according to each of the number groups for obtaining an acceptable false positive value.
    Type: Application
    Filed: December 30, 2009
    Publication date: June 30, 2011
    Applicants: HON HAI PRECISION INDUSTRY CO. LTD., MASSACHUSETTS INSTITUTE OF TECHNOLOGY
    Inventor: CHENG-HSIEN LEE
  • Publication number: 20110158539
    Abstract: A system and method for extracting feature data of dynamic objects selects sequential N frames of a video file up front, where N is a positive integer, and divides each of the N frames into N*N squares. The system and method further selects any n frames from the N frames, selects any n rows and n columns of the n frames to obtain n*n*n squares, where n is a positive integer. The system and method further extracts feature data from the video file by computing averages and differences for pixel values of the n*n*n squares.
    Type: Application
    Filed: December 30, 2009
    Publication date: June 30, 2011
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., MASSACHUSETTS INSTITUTE OF TECHNOLOGY
    Inventor: CHENG-HSIEN LEE
  • Publication number: 20110143922
    Abstract: A composition with catalyst particles for making a circuit pattern is provided. The composition includes an insulation material and a plurality of catalyst particles. The catalyst particles are distributed in the insulation material and not made of metal. When the composition is bathed in a chemical plating solution, a redox reaction takes place between some of the catalyst particles and the chemical plating solution so as to deposit a conductive pattern on the composition.
    Type: Application
    Filed: August 11, 2010
    Publication date: June 16, 2011
    Inventors: Cheng-Hsien Lee, Yi-Chun Liu
  • Publication number: 20110114379
    Abstract: A printed circuit board can support different connectors by selectively setting connection components on the printed circuit board without changing wiring of transmission lines or making new vias in the printed circuit board.
    Type: Application
    Filed: December 8, 2009
    Publication date: May 19, 2011
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YUNG-CHIEH CHEN, CHENG-HSIEN LEE, SHOU-KUO HSU, SHEN-CHUN LI, HSIEN-CHUAN LIANG, SHIN-TING YEN
  • Patent number: 7916494
    Abstract: A printed circuit board includes a high-speed differential signal control chip, first to fourth coupling capacitor pads, first and second connector pads, first and second inductor pads, a number of transmission lines, a power pin, two sharing pads, and two selection pads. Two coupling capacitors can selectively connect the first and second coupling capacitor pads and the two sharing pads or between the third and fourth coupling capacitor pads and the two sharing pads, respectively. Two inductors can connect the first and second inductor pads and the two selection pads respectively, and the first and second inductor pads and the two selection pads can be void.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: March 29, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yung-Chieh Chen, Cheng-Hsien Lee, Shou-Kuo Hsu, Shen-Chun Li, Hsien-Chuan Liang
  • Publication number: 20110066764
    Abstract: A system for selecting high speed serial signals includes a loading module, a layout selecting module, a data processing module, and an output module. The loading module reads a chip package length file; a layout selecting module reads a layout file and selects high speed serial signals preset by a user; the data processing module selects pins information of a start chip and a terminal chip transmit the selected high speed serial signals and finds the chip package length information, and analyzes interrupt points of the layout character from the start chip and outputs the chip package length information of the start chip, the layout length information, and the chip package length information of the terminal chip in sequence to the output module, to convert into a table and displays the table via a display device.
    Type: Application
    Filed: October 26, 2009
    Publication date: March 17, 2011
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: SHOU-KUO HSU, CHENG-HSIEN LEE
  • Publication number: 20110038427
    Abstract: A differential signal transmission device transmits N differential signal pairs from a differential signal generator to a number of receiving terminals. The N differential signal pairs include N positive signals and N negative signals. The N positive signals are clustered at a first positive clustering point. The first positive clustering point is connected to a second positive clustering point via a first matching resistor. The second positive clustering point is grounded via a first grounding resistor, and outputs a number of positive signals to the number of receiving terminals respectively. The N negative signals are clustered at a first negative clustering point. The first negative clustering point is connected to a second negative clustering point via a second matching resistor. The second negative signal clustering point is grounded via a second grounding resistor, and outputs a number of negative signals to the number of receiving terminals respectively.
    Type: Application
    Filed: September 16, 2009
    Publication date: February 17, 2011
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: SHOU-KUO HSU, CHENG-HSIEN LEE, YING-TSO LAI, HSIAO-YUN SU, JIA-CHI CHEN
  • Patent number: D504315
    Type: Grant
    Filed: December 17, 2003
    Date of Patent: April 26, 2005
    Assignee: Dragon Full Developments Limited
    Inventor: Cheng-Hsien Lee