Patents by Inventor Cheng-Hsien Lin

Cheng-Hsien Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120211267
    Abstract: A printed circuit board substrate includes a metal-clad substrate and a number of N spaced circuit substrates arranged on the metal-clad substrate along an imaginary circle, and N is a natural number greater than 2. The circuit substrates are equiangularly arranged about the center of the circle, and each of the circuit substrates is oriented 360/N degrees with respect to a neighboring printed circuit board.
    Type: Application
    Filed: May 1, 2012
    Publication date: August 23, 2012
    Applicant: ZHEN DING TECHNOLOGY CO., LTD.
    Inventors: PAI-HUNG HUANG, CHIH-KANG YANG, CHENG-HSIEN LIN
  • Patent number: 8227175
    Abstract: A method for smoothing a printed circuit board (PCB), comprising: providing a PCB having a first smooth outer surface and an opposite second outer surface, the second outer surface including a smooth region and a plurality of dimples; applying a liquid photoresist layer onto the second outer surface of the PCB to fill the dimples; solidifying the liquid photoresist in the dimples to obtain a solidified photoresist layer; polishing the solidified photoresist layer until a surface thereof being coplanar with the smooth region; and polishing the entire second outer surface until the solidified photoresist layer is removed, thereby obtaining a plain outer surface parallel to the first smooth outer surface.
    Type: Grant
    Filed: May 17, 2009
    Date of Patent: July 24, 2012
    Assignee: Zhen Ding Technology Co., Ltd.
    Inventors: Chung-Jen Tsai, Yu-Cheng Huang, Hung-Yi Chang, Cheng-Hsien Lin
  • Patent number: 8211267
    Abstract: An electromagnetic shielding composite includes a polymer and a plurality of carbon nanotubes disposed in the polymer in a form of carbon nanotube film structure. A method for making an electromagnetic shielding composite includes the steps of: (a) providing an array of carbon nanotubes; (b) drawing a carbon nanotube film from the array of carbon nanotubes; (c) providing a substrate, covering at least one carbon nanotube film on the substrate to form a carbon nanotube film structure; and (d) providing a polymer and combining the carbon nanotube film structure with the polymer to form an electromagnetic shielding composite.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: July 3, 2012
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Cheng-Hsien Lin, Yao-Wen Bai, Wen-Chin Lee, Rui Zhang, Kai-Li Jiang, Chen Feng
  • Patent number: 8112880
    Abstract: A method for manufacturing a printed circuit board (PCB) includes: providing a first PCB substrate, a second PCB substrate and an adhesive layer, the first PCB substrate having a first main portion and a first unwanted portion divided by a first imaginary boundary, the second PCB substrate including a second main portion and a second unwanted portion divided by a second imaginary boundary; forming an opening in the adhesive layer; filling an filling mass in the opening; laminating the first PCB substrate, the second PCB substrate and the adhesive layer such that the adhesive layer is sandwiched between the first PCB substrate and the second PCB substrate, and the first, second imaginary boundaries are misaligned, a projection of each of the first and second imaginary boundaries in the adhesive layer being within the opening; and cutting the first and second PCB substrates along the first and second imaginary boundaries respectively.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: February 14, 2012
    Assignees: FuKui Precision Component (Shenzhen) Co., Ltd., Zhen Ding Technology Co., Ltd.
    Inventors: Hu-Hai Zhang, Ying Su, Cheng-Hsien Lin
  • Patent number: 8101266
    Abstract: A multilayer printed circuit board includes a first printed circuit board, a second printed circuit board, an adhesive film, and a function layer. The adhesive film is sandwiched between the first printed circuit board and the second printed circuit board. The function layer is disposed between the first printed circuit board and the second printed circuit board for blocking water from passing therethrough and for screening electromagnetic interference between the first printed circuit board and the second printed circuit board.
    Type: Grant
    Filed: June 9, 2008
    Date of Patent: January 24, 2012
    Assignee: Zhen Ding Technology Co., Ltd.
    Inventors: Wen-Chin Lee, Cheng-Hsien Lin
  • Publication number: 20120009669
    Abstract: A bifunctional compound with a monosaccharide and a N2S2 ligand, and more particularly, a bifunctional compound with a N2S2 ligand and aminohexylacetyl galactosamine (ah-GalNAc4) is provided. A method for preparing the bifunctional compound with a monosaccharide and a N2S2 ligand is also provided, including activating a carboxyl group in an organic ligand, reacting the activated carboxyl group with a galactopyranoside through amidation, and then hydrolyzing. The bifunctional compound of the present invention is widely useful in nuclear medicine for preparation of liver imaging agents for assisting in correct diagnosis of diseases.
    Type: Application
    Filed: April 15, 2011
    Publication date: January 12, 2012
    Applicant: Institute of Nuclear Energy Research Atomic Energy Council, Executive Yuan
    Inventors: SHOW-WEN LIU, CHENG-HSIEN LIN, YU CHANG, CHENG-FANG HSU, TSYH-LANG LIN
  • Patent number: 8089003
    Abstract: A printed circuit board substrate includes an insulation matrix and a waterproof layer. The insulation matrix includes a first surface and a second surface at an opposite side thereof to the first surface. The waterproof layer is formed in the insulation matrix and is arranged between the first surface and the second surface for blocking water from passing therethrough in a thicknesswise direction of the insulation matrix.
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: January 3, 2012
    Assignee: Zhen Ding Technology Co., Ltd.
    Inventors: Wen-Chin Lee, Cheng-Hsien Lin
  • Publication number: 20110313183
    Abstract: A method for preparation of N-methyl-3-(2-tributylstannylphenoxy)-3-phenylpropanamine is provided, which includes formation of N-methyl-3-(2-tributylstannylphenoxy)-3-phenylpropanamine, useful as a precursor of a norepinephrine transporter (NET) contrast label [123Iodine](R)—N-methyl-3-(2-iodophenoxy)-3-phenylpropanamine ([123I]MIPP) with a leaving group Bu3Sn.
    Type: Application
    Filed: April 15, 2011
    Publication date: December 22, 2011
    Applicant: Institute of Nuclear Energy Research Atomic Energy Council, Executive Yuan
    Inventors: SHOW-WEN LIU, CHENG-HSIEN LIN, TSYH-LANG LIN, CHENG-FANG HSU, YU CHANG
  • Patent number: 8076499
    Abstract: A method for preparing a precursor of radioactive 3-iodobenzylguanidine- N,N?-bis(tert-butyloxycarbonyl)-3-(tri-n-butyltin)benzylguanidine) (MSnBG) is revealed. The method includes following steps. Firstly, obtain 3-iodobenzylguanidine bicarbonate by an addition reaction between 3-iodobenzylamine hydrochloride and cyanamide. Use di-tert-butyl dicarbonate as a protecting agent for NH group and convert 3-iodobenzylguanidine bicarbonate into N,N?-bis(tert-butyloxycarbonyl)-N-(3-iodobenzyl) guanidine. At last, under catalysis of bis(triphenylphosphine) palladium dichloride, obtain a final product MSnBG by a substitution reaction between N,N?-bis(tert-butyloxycarbonyl)-N-(3-iodobenzyl) guanidine and bis(tri-n-butyltin). MSnBG is used in no-carrier-added synthesis of [*l]MIBG.
    Type: Grant
    Filed: August 13, 2009
    Date of Patent: December 13, 2011
    Assignee: Atomic Energy Council-Institute of Nuclear Energy Research
    Inventors: Show-Wen Liu, Cheng-Hsien Lin, Tsyh-Lang Lin, Cheng-Fang Hsu
  • Patent number: 8071884
    Abstract: A flexible printed circuit board includes a base and a coverlay. The base includes a main portion and a distal portion connecting with the main portion. The distal portion has a first part and a second exposed part. The coverlay is formed on the base and covers the main portion and the first part of the distal portion. The second exposed part of the distal portion is uncovered by the coverlay. The coverlay includes a curved edge serving as an interface between the first part and second part of the distal portion.
    Type: Grant
    Filed: April 21, 2008
    Date of Patent: December 6, 2011
    Assignees: FuKui Precision Component (Shenzhen) Co., Ltd., Zhen Ding Technology Co., Ltd.
    Inventors: Ming Wang, Dong-Qing He, Xiao-Hong Zhang, Cheng-Hsien Lin
  • Patent number: 8071887
    Abstract: A printed circuit board includes a substrate having a surface, a circuit layer having a plurality of electrical traces formed on the surface, and an electrically conductive metal layer formed on the circuit layer. The circuit layer is comprised of a composite of carbon nano-tubes and metallic nano-particles.
    Type: Grant
    Filed: October 17, 2008
    Date of Patent: December 6, 2011
    Assignees: FuKui Precision Component (Shenzhen) Co., Ltd., Zhen Ding Technology Co., Ltd.
    Inventors: Shing-Tza Liou, Yao-Wen Bai, Cheng-Hsien Lin
  • Patent number: 8067696
    Abstract: A printed circuit board includes an insulating layer, a copper layer formed on the insulating layer and a reinforcing layer formed on the copper layer at opposite sides of the given portion. The copper layer includes a plurality of electrical traces at a given portion thereof. A thickness of the reinforcing layer increases in a direction away from the given portion. A method for manufacturing the printed circuit board is also provided in this disclosure.
    Type: Grant
    Filed: February 20, 2009
    Date of Patent: November 29, 2011
    Assignee: Zhen Ding Technology Co., Ltd.
    Inventors: Chung-Jen Tsai, Chia-Cheng Chen, Hung-Yi Chang, Tung-Yao Kuo, Cheng-Hsien Lin
  • Patent number: 8061959
    Abstract: The present invention relates to a board inverter and a boarding inverting system. The board inverter includes a support, a first board picking device, an second board picking device and a controller. Each of the first board picking device and the second board picking device includes a driving mechanism and a first board picking device. The driving mechanism comprises a first linear driving means mounted on the support, a second linear driving means mechanically coupled to the first linear driving means, and a rotary driving means attached to the second linear driving means. The controller is connected to all the power supply members. The controller controls the motion of the first board picking device and the second board picking device such that the first board picking device and the second board picking device cooperatively inverting workpieces transmitted on a production line. The board inverter can be installed on a production line without altering the arrangement of existing production line.
    Type: Grant
    Filed: September 2, 2008
    Date of Patent: November 22, 2011
    Assignees: FuKui Precision Component (Shenzhen) Co., Ltd., Zhen Ding Technology Co., Ltd.
    Inventors: Ya-Ling Fan, Ching-Hung Pi, Cheng-Ta Tu, Chih-Yi Tu, Cheng-Hsien Lin
  • Patent number: 8062580
    Abstract: An apparatus for recycling metals from metal ions containing waste solution includes a conveying device, a reducing agent supplier and a solution supplier. The conveying device includes a first ferromagnetic conveyor belt, a first roller, and a second roller. The first and second rollers are substantially horizontally arranged, and the second roller is arranged at a lower position relative to the first roller and spaced from the first roller. The ferromagnetic conveyor belt is wrapped around the first and second rollers. The reducing agent supplier is used for supplying a reducing agent onto the first conveyor belt, the ferromagnetic conveyor belt is capable of conveying the reducing agent from the second roller to the first roller. The solution supplier is configured for supplying the waste solution onto the first conveyor belt.
    Type: Grant
    Filed: August 5, 2009
    Date of Patent: November 22, 2011
    Assignee: Zhen Ding Technology Co., Ltd.
    Inventors: Wen-Tsun Chen, Shin-Chih Liaw, Tao-Ming Liao, Chia-Hung Shen, Cheng-Hsien Lin
  • Publication number: 20110274866
    Abstract: An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line of weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other. Each of the folding portions defines at least one groove in at least one side thereof along the at least one line of weakness.
    Type: Application
    Filed: July 20, 2011
    Publication date: November 10, 2011
    Applicant: FOXCONN ADVANCED TECHNOLOGY INC.
    Inventors: CHIH-KANG YANG, CHENG-HSIEN LIN
  • Patent number: 8049113
    Abstract: The present invention relates to a printed circuit board. In one embodiment, a printed circuit board includes a dielectric layer and a conductive trace formed on the dielectric layer. The conductive layer includes a first conductive portion, a connecting portion and a second conductive portion. The connecting portion includes a first end and a second end. The first end is connected to the first conductive portion; the second end is connected to the second conductive portion. A width of the connecting portion gradually decreases from the first end to the second end. Reflection and cross talk of signals transmitted in the presented printed circuit board can be reduced.
    Type: Grant
    Filed: March 12, 2008
    Date of Patent: November 1, 2011
    Assignees: FuKui Precision Component (Shenzhen) Co., Ltd., Zhen Ding Technology Co., Ltd.
    Inventors: Dong-Qing He, Ming Wang, Chih-Yi Tu, Cheng-Hsien Lin
  • Patent number: 8048405
    Abstract: A radioactive mixture and a manufacturing method thereof are disclosed. The radioactive mixture (188Re-MN/Lipiodol mixture) is formed by chelating reaction of MN series compounds that are amine-amide-disulfide amine quadric-dentate chelate ligands with TcO4?/or ReO4?, and then dissolved in Lipiodol. Moreover, the 99mTc/or 188Re of the TcO4?/or ReO4? avoids bone marrow injuries caused by free 90Y. By the feature of the Lipiodol that stays in liver tumors for a long period, the radioactive mixture is applied to treat liver cancers by injection so that injuries caused by surgical operations can be prevented. 188Re-MN/Lipiodol is used for liver cancer, breast cancer or other solid tumors treatment. Re-188 MN or Re-188 MN/Lipiodol can be mixed with anticancer drugs, hydrogel, liposome, micelle or other nano-particles to form the multifunctional therapeutic modality.
    Type: Grant
    Filed: January 16, 2009
    Date of Patent: November 1, 2011
    Assignee: Atomic Energy Council-Institute of Nuclear Energy Research
    Inventors: Tsai-Yueh Luo, I-Chung Tang, Show-Wen Liu, Yu-Lung Wu, Cheng-Hsien Lin, Cheng-Fang Hsu, Kwei-Luen Hsu, Chang-Mau Sheng, Ching-Jun Liou, Te-Sheng Liang
  • Patent number: 8001684
    Abstract: An exemplary method for manufacturing flexible printed circuit board is provided. A metal foil is supplied from a first feeding roller. The metal foil has a first surface and a second surface on two opposite sides of the metal foil. A first coverlay having a number of first openings defined therein is supplied from a second feeding roller and laminated on the first surface of the metal foil. Electrical traces are formed with the metal foil. A second coverlay having a number of second openings defined therein is supplied from a third feeding roller and laminated on the second surface of the metal foil. Each of the second openings registers with the respective first opening so that the electrical traces are exposed from the corresponding first and second openings. The method can improve quality and efficiency of manufacturing flexible printed circuit boards in a hollowed out form.
    Type: Grant
    Filed: December 18, 2007
    Date of Patent: August 23, 2011
    Assignee: Foxconn Advanced Technology Inc.
    Inventors: Chia-Cheng Chen, Chao-Ching Wang, Chiang-Hua Huang, Cheng-Hsien Lin
  • Publication number: 20110161084
    Abstract: Apparatus, method and system for generating a threshold for utterance verification are introduced herein. When a processing object is determined, a recommendation threshold is generated according to an expected utterance verification result. In addition, extra collection of corpuses or training models is not necessary for the utterance verification introduced here. The processing unit can be a recognition object or an utterance verification object. In the apparatus, method and system for generating a threshold for utterance verification, at least one of the processing objects is received and then a speech unit sequence is generated therefrom. One or more values corresponding to each of the speech unit of the speech unit sequence are obtained accordingly, and then a recommendation threshold is generated based on an expected utterance verification result.
    Type: Application
    Filed: June 24, 2010
    Publication date: June 30, 2011
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Cheng-Hsien Lin, Sen-Chia Chang, Chi-Tien Chiu
  • Patent number: 7964752
    Abstract: A bifunctional compound containing an amino group and diaminedithiol ligand and a manufacturing method thereof are revealed, the bifunctional compound includes at least one amino group and a diaminedithiol (N2S2) ligand. The amino groups is for reacting with compounds containing carboxylic acids or halogens while the N2S2 ligand binds with technetium or rhenium so as to form an anion complex. The thiol group in the N2S2 ligand is protected by a protecting group for prevention of oxidation and easy storage. This protecting group is released easily during complex reactions. Due to the bifunctional property, the compound is applied to preparation of radiopharmaceuticals such as imaging agents and targeted agents.
    Type: Grant
    Filed: August 13, 2009
    Date of Patent: June 21, 2011
    Assignee: Atomic Energy Council—Institute of Nuclear Energy Research
    Inventors: Show-Wen Liu, Cheng-Hsien Lin, Tsyh-Lang Lin, Cheng-Fang Hsu