Abstract: H3LMN series compounds used as radioactive agents for treatment of liver cancer and a manufacturing method thereof are revealed. 2-thioethylamine hydrochloride is reacted with triphenylmethanol for protection of thiol to obtain 2-[(triphenylmethyl)thio]ethylamine. Then obtain N-[2-((triphenylmethyl)thio)ethyl]chloroacetamide by a transamidation reaction between 2-[(triphenylmethyl)thio]ethylamine and chloroactyl chloride. Next produce a amine-amide-thiol ligand-N-[2-((triphenylmethyl)thio)ethyl][2-((triphenylmethyl)thio)ethylamino]acetamide by a substitution reaction of N-[2-((triphenylmethyl)thio)ethyl]chloroacetamide and 2-[(triphenylmethyl)thio]ethylamine. After respective reaction with 1-bromotetradecane, 1-bromohexadecane and ethyl 16-bromohexadecanoate, H3LMN series compounds are obtained. These amine-amide-dithiols quadridentate ligands can react with MO3+ (M=Tc or Re) to produce electrically neutral complexes.

Abstract: The present inventions relates to a method for manufacturing a multilayer FPCB having different number of layers in different areas. The method includes the steps of: providing a binder layer; removing a portion of the binder layer thereby defining an opening in the binder layer; forming a multilayer FPCB which having a first copper clad laminate structure and a second copper clad laminate structure disposed on two opposite sides of the binder layer respectively using the binder layer; cutting the first copper clad laminate structure; cutting the multilayer FPCB in manner that a portion of first copper clad laminate structure that is exposed to the opening is separated from the first copper clad structure thereby obtain a multilayer FPCB having different number of layers in different areas.

Abstract: A method for preparing a precursor of radioactive 3-iodobenzylguanidine-N,N?-bis(tert-butyloxycarbonyl)-3-(tri-n-butyltin)benzylguanidine) (MSnBG) is revealed. The MSnBG is a precursor of [*I]MIBG that is used as radioactive imaging agents and antineoplastic drugs. The method includes following steps. Firstly, obtain 3-iodobenzylguanidine bicarbonate by an addition reaction between 3-iodobenzylamine hydrochloride and cyanamide. Use di-tert-butyl dicarbonate as a protecting agent for NH group and convert 3-iodobenzylguanidine bicarbonate into N,N?-bis(tert-butyloxycarbonyl)-N-(3-iodobenzyl) guanidine. At last, under catalysis of bis(triphenylphosphine) palladium dichloride, obtain a final product MSnBG by a substitution reaction between N,N?-bis(tert-butyloxycarbonyl)-N-(3-iodobenzyl) guanidine and bis(tri-n-butyltin). MSnBG is used in no-carrier-added synthesis of [*I]MIBG.

Abstract: A bifunctional compound containing an amino group and diaminedithiol ligand and a manufacturing method thereof are revealed, the bifunctional compound includes at least one amino group and a diaminedithiol (N2S2) ligand. The amino groups is for reacting with compounds containing carboxylic acids or halogens while the N2S2 ligand binds with technetium or rhenium so as to form an anion complex. The thiol group in the N2S2 ligand is protected by a protecting group for prevention of oxidation and easy storage. This protecting group is released easily during complex reactions. Due to the bifunctional property, the compound is applied to preparation of radiopharmaceuticals such as imaging agents and targeted agents.

Abstract: A method for manufacturing a hollowed printed circuit board includes steps of: providing an electrically conductive layer; laminating a first dielectric layer having a first through opening defined therein on a first surface of the electrically conductive layer; forming a protecting layer on the first surface of the electrically conductive layer in the first opening; creating an electrically conductive pattern in the conductive layer; removing the protecting layer; and laminating a second dielectric layer having a second through opening defined therein on an opposite second surface of the electrically conductive layer in a manner that the first through opening is aligned with the second through opening, thereby a portion of the electrically conductive layer is exposed to exterior through the first through opening and the second through opening.

Abstract: An insulating film includes a first polymer layer, a second polymer layer and an electromagnetic shielding layer sandwiched between the first polymer layer and the second polymer layer. The electromagnetic shielding layer includes a number of carbon nanotube films that are substantially parallel to the first and second polymer layer. Each of the carbon nanotube films includes a number of carbon nanotubes that are substantially parallel to each other. The insulating film can provide anti-EMI effect in printed circuit boards without employing additional electromagnetic shielding layers.

Abstract: A method for making carbon nanotube precious metal nanoparticles composite includes the following steps. A solution dissolving precious metal ions is provided. A water soluble polymer is provided and dissolved in water to form a solution of the soluble polymer. The solution of the precious metal ions is added into the solution of the soluble polymer to form a first mixture. A solution of carbon nanotubes is provided and added in the first mixture to form a second mixture. The second mixture is irradiated via radiation, the radiation have a wave length less than 450 nm.

Abstract: A method for assembling an electronic component on a printed circuit board includes following steps. Firstly, a printed circuit board substrate including a central main portion and a peripheral unwanted portion is provided. Secondly, electrically conductive patterns and reinforcing patterns are formed on the main portion and the unwanted portion respectively. Thirdly, an electronic component is mounted on the main portion and electrically connected with the electrically conductive patterns. Fifthly, the unwanted portion is removed.

Abstract: A method for manufacturing a rigid-flexible printed circuit boards includes following steps. Firstly, a flexible substrate is provided. Secondly, at least one slit is defined in the flexible substrate. Thirdly, a rigid substrate having a structure corresponding to the flexible substrate is provided. Fourthly, the flexible substrate is laminated to the rigid substrate to obtain a laminated substrate. Fifthly, part of the rigid substrate is removed. Sixthly, the laminated substrate is cut along an imaginary boundary line to remove waste portion of the laminated substrate. Thus, a rigid-flexible printed circuit board is obtained.

Abstract: A radioactive mixture and a manufacturing method thereof are disclosed. The radioactive mixture (188Re-MN/Lipiodol mixture) is formed by chelating reaction of MN series compounds that are amine-amide-disulfide amine quadric-dentate chelate ligands with TcO4?/or ReO4?, and then dissolved in Lipiodol. Moreover, the 99mTc/or 188Re of the TcO4?/or ReO4? avoids bone marrow injuries caused by free 90Y. By the feature of the Lipiodol that stays in liver tumors for a long period, the radioactive mixture is applied to treat liver cancers by injection so that injuries caused by surgical operations can be prevented. 188Re-MN/Lipiodol is used for liver cancer, breast cancer or other solid tumors treatment. Re-188 MN or Re-188 MN/Lipiodol can be mixed with anticancer drugs, hydrogel, liposome, micelle or other nano-particles to form the multifunctional therapeutic modality.

Abstract: An apparatus (100) for spraying an etchant solution on a preformed printed circuit board (30) includes a number of feed pipes (40) for supplying the etchant solution and a number of nozzles (45) mounted on the feed pipes. Each of the feed pipes has a middle portion (402) and two end portions (401). The middle portions of the feed pipes are located on a first plane and the end portions of the feed pipes are located on a second plane parallel to the first plane. The number of nozzles are mounted on the middle portion and the two end portions of each feed pipe. The number of nozzles are in fluid communication with the feed pipes.

Abstract: An inkjet ink includes a solvent, precious metal ions, a number of carbon nanotubes, and a binder. The carbon nanotubes are disposed in the solvent, and the precious metal ions are adhered to a surface of each of the carbon nanotubes via the binder. A method for making conductive wires is provided.

Abstract: A method for making conductive wires is provided. Firstly, an ink having carbon nanotubes is provided. Secondly, a baseline is formed using the ink on a substrate. Thirdly, the baseline is electroless plated.

Abstract: An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line of weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other.

Abstract: A method for forming electrical traces on a substrate includes the steps of: providing a substrate; printing an ink pattern using an ink on the substrate, the ink including a aqueous medium containing silver ions and a heat sensitive reducing agent; heating the ink pattern to reduce silver ions into silver particles thereby forming an semi-finished traces; and forming a metal overcoat on the semi-finished traces by electroless plating thereby obtaining patterned electrical traces.

Abstract: An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other. An exemplary method for manufacturing multilayer printed circuit boards using the inner substrate is also provided. The method can improve efficiency of manufacturing multilayer printed circuit boards.

Abstract: An apparatus for recycling metals from metal ions containing waste solution includes a conveying device, a reducing agent supplier and a solution supplier. The conveying device includes a first ferromagnetic conveyor belt, a first roller, and a second roller. The first and second rollers are substantially horizontally arranged, and the second roller is arranged at a lower position relative to the first roller and spaced from the first roller. The ferromagnetic conveyor belt is wrapped around the first and second rollers. The reducing agent supplier is used for supplying a reducing agent onto the first conveyor belt, the ferromagnetic conveyor belt is capable of conveying the reducing agent from the second roller to the first roller. The solution supplier is configured for supplying the waste solution onto the first conveyor belt.

Abstract: A compound containing carboxylate ester and N2S2 ligand bi-functional groups and a manufacturing method thereof are disclosed. The S in the N2S2 ligand of the compound containing carboxylate ester and N2S2 ligand bi-functional groups includes a protective group so as to avoid to be oxidized and easy storage. In a complex reaction, the protective group is automatically released As to the active carboxylate ester, it is for reacting with compounds having amino groups such as amines, amino acids, peptides, or protein etc while the N2S2 ligand is for bonding with technetium or rhenium so as to form neutral complex. The compound containing carboxylate ester and N2S2 ligand bi-functional groups is applied to radiopharmaceuticals such as contrast agents for tissues and target agents.

Abstract: A circuit substrate includes an electrically conductive layer having electrically conductive patterns formed therein, an insulating layer having a through hole, and a composite layer positioned between the electrically conductive layer and the insulating layer. The through hole is configured for having an electronic component mounted thereon. The composite layer includes a polymer matrix and at least one carbon nanotube bundle embedded in the polymer matrix. One end of the at least one carbon nanotube bundle contacts the electrically conductive patterns, and the other is exposed in the through hole of the insulation layer.

Abstract: A circuit substrate for mounting electronic components includes a metal base layer, an electrically conductive layer having electrically conductive traces, and a composite layer disposed between the metal base layer and the electrically conductive layer. The composite layer includes a polymer matrix and a number of carbon nanotubes embedded in the polymer matrix. The composite layer has a first surface in contact with the metal substrate and an opposite second surface. Each of the carbon nanotubes extends from the first surface to the second surface inclined at an angle of from 80° to 100° relative to the first surface.