Abstract: A data access system includes a host and a storage device. The host has a security setup function and includes a first identity code storage block to store a first identity code. The storage device has a security check function and includes a second identity code storage block. The host executes the security setup function to set a second identity code according to the first identity code, and the second identity code is stored into the second identity code storage block. The storage device executes the security check function to determine if the host is allowed to access the storage device according to the first and second identity codes.

Abstract: A data accessing system includes a host and a storage device. The host has a security setup function and includes a first identity code storage block. The host executes the security setup function to set a first identity code according to a second identity code, and the second identity code is stored into the first identity code storage block. The storage device has a security check function and includes a second identity code storage block to store the second identity code, and the storage device executes the security check function to determine if the host is allowed to access the storage device according to the first identity code.

Abstract: A memory structure includes a first memory cell and a second memory cell located at an identical bit line and adjacent to the first memory cell. Each memory cell includes a substrate, a source, a drain, a charge storage device, and a gate. A method for programming the memory structure includes respectively providing a first gate biasing voltage and a second gate biasing voltage to the first memory cell and the second memory cell, boosting the absolute value of a channel voltage of the first memory cell to generate electron and hole pairs at the drain of the second memory cell through gate-induced drain leakage or band-to-band tunneling, and injecting the electron of the generated electron and hole pairs into the charge storage device of the first memory cell to program the first memory cell.

Abstract: A sector erase method for use in a non-volatile memory, such as a FLASH memory, including a plurality of memory cells in rows and columns, the memory cells being divided into a plurality of sectors. The sector erase method includes erasing the memory cells of a first sector by applying successive erase pulses that increase in voltage magnitude or pulse width, until erasure of the first sector is verified. Erase condition information corresponding to the first sector, is recorded, this information including a number of times successive erase pulses are needed to be applied in order to erase the memory cells of the first sector. Memory cells of a next sector are erased by applying a first erase pulse having a voltage magnitude or pulse width determined from the recorded erase condition information. The first erase pulse may be incremented if the first erase pulse fails to erase that next sector.

Abstract: A read operation method is provided for a flash memory array having a plurality of memory cells, wordlines, even bitlines, odd bitlines and a plurality of bitline transistors. The method includes pre-charging the plurality of even bitlines to about Vcc/n and pre-charging the plurality of odd bitlines to ground. The current flowing to/from a first bit location in each of the memory cells is selectively sensed. A logical state is determined from the sensed current for the first bit location in each of the memory cells. The method also includes pre-charging the plurality of odd bitlines to about Vcc/n and pre-charging the plurality of even bitlines to ground. The current flowing to/from a second bit location in each of the memory cells is selectively sensed. A logical state is determined from the sensed current for the second bit location in each of the memory cells.

Abstract: A layout structure for non-volatile memory is described, including a substrate, bit lines in a column direction, transistors as memory cells, word lines in a row direction, bit line contacts and at least two dummy word lines. The substrate has therein an isolation structure that defines an active area. The bit lines are disposed in the substrate in the active area. The transistors are disposed on the substrate between the bit lines and arranged in rows and columns. Each word line is coupled to the transistors in one row. The bit line contacts are disposed on the bit lines. The dummy word lines are disposed on the isolation structure, respectively at two sides of the active area and parallel with the word lines.

Abstract: A memory device including a substrate, a plurality of conductive layers, a composite dielectric layer and a plurality of gates are provided. Wherein, the conductive layers are disposed on the substrate. The composite dielectric layer is disposed on the substrate and covers the conductive layers. The composite dielectric layer includes a charge trapping layer. The gates are disposed on the composite dielectric layer and across the conductive layers. Wherein, the conductive layers can be used as local bit lines to reduce the resistance values and improve the performance of the memory device.

Abstract: A sector erase method for use in a non-volatile memory, such as a FLASH memory, including a plurality of memory cells in rows and columns, the memory cells being divided into a plurality of sectors. The sector erase method includes erasing the memory cells of a first sector by applying successive erase pulses that increase in voltage magnitude or pulse width, until erasure of the first sector is verified. Erase condition information corresponding to the first sector, is recorded, this information including a number of times successive erase pulses are needed to be applied in order to erase the memory cells of the first sector. Memory cells of a next sector are erased by applying a first erase pulse having a voltage magnitude or pulse width determined from the recorded erase condition information. The first erase pulse may be incremented if the first erase pulse fails to erase that next sector.

Abstract: A method for dynamically adjusting the operation of a memory chip is disclosed. First, a memory chip is provided. The memory chip comprises an ONO layer. Then, the thickness of the ONO layer in the memory chip is measured, and a read word line voltage of the memory chip is then adjusted based on the measured thickness of the ONO layer. Since the operation window of memory chip is dynamically adjusted, a more reliable product operation and a sufficient mass production window are obtained.

Abstract: A method for forming a memory cell and periphery circuit includes providing a substrate with a peripheral circuit region and a memory cell region. A mask layer is formed on the substrate to define multiple active regions in the peripheral circuit region and to define multiple channel regions in the memory cell region. Multiple field oxide layers are formed between the active areas, and Dopants are implanted in the substrate between the channel regions. Multiple inter-cell isolation layers are formed between the channel regions and the dopants are driven in the substrate to form buried diffusion regions. The mask layer is removed. A layer of electricity-storage material and multiple word lines are formed on the substrate in the memory cell region.

Abstract: A semiconductor memory device structure includes an isolation region formed along an edge of a memory cell portion adjacent to a dummy cell portion to isolate the memory cell portion from leakage current generated in the dummy cell portion.

Abstract: A method for dynamically adjusting the operation of a memory chip is disclosed. First, a memory chip is provided. The memory chip comprises an ONO layer. Then, the thickness of the ONO layer in the memory chip is measured, and a read word line voltage of the memory chip is then adjusted based on the measured thickness of the ONO layer. Since the operation window of memory chip is dynamically adjusted, a more reliable product operation and a sufficient mass production window are obtained.

Abstract: A method for fabricating a nitride read-only memory is described. An ONO stacked layer and a protective layer are sequentially formed on a substrate. A patterning/etching process is performed to pattern the protective layer and the ONO stacked layer to expose a portion of the substrate. Thereafter, the protective layer is removed by using wet etching. An ion implantation is performed to form buried bit lines in the exposed substrate, and then an insulator is formed on each buried bit line. A plurality of word lines are formed on the substrate crossing over the buried bit lines.

Abstract: A coding method of a multi-level cell, applied to a programming operation of a multi-level memory cell. The multi-level memory cell can store n bits and has 2n levels with respect to 2n codes. Each code is constructed with n bits. In the coding method, a code to be stored is provided. According to a relationship between the code and level, the multi-level memory cell has a specified level for corresponding code to be stored. The relationship is a correspondence between the 2n codes and the 2n levels. Two codes corresponding to any neighboring two levels has only a one-bit difference.

Abstract: A method for fabricating a nitride read-only memory is described. An ONO stacked layer and a protective layer are sequentially formed on a substrate. A patterning/etching process is performed to pattern the protective layer and the ONO stacked layer to expose a portion of the substrate. Thereafter, the protective layer is removed by using wet etching. An ion implantation is performed to form buried bit lines in the exposed substrate, and then an insulator is formed on each buried bit line. A plurality of word lines are formed on the substrate crossing over the buried bit lines.

Abstract: The present invention provides a method for operating a NROM device, where the source and drain are surrounded by a heavy doping. When programming the NROM device, a more positive source bias and a more negative substrate bias is used to increase the body effect of the substrate for reducing the current require for Channel Hot Electron Injection (CHEI) programming. Furthermore, before erasing the NROM array, a pre-programming operation is performed to program every single memory cell of the NROM array to the written state for preventing over-erasing of the memory cells.

Abstract: A method for compensating a threshold voltage of a neighbor bit, are provided. The method includes the first step of arbitrating the word line voltages applied to bits demanded to be programmed, wherein the the word line voltages are arbitrated according to the threshold voltages of the neighbor bits adjacent to the bits. Next, the bits, to which a same word line voltage should be applied, in the memory cells are distributed to a group of bits with the same word line voltage. Then, the same word line voltage is applied to the bits of the group of bits with the same word line voltage.

Abstract: A silicon nitride read only memory and associated method of data programming and erasing. The read only memory includes a first type ion-doped semiconductor substrate, an oxide-nitride-oxide (ONO) composite layer over the semiconductor substrate, a first type ion-doped gate conductive layer over the ONO layer and a second type ion doped source/drain region in the substrate on each side of the ONO layer, wherein the second type ions have an electrical polarity opposite to the first type ions. Data is programmed into the silicon nitride read only memory by channel hot electron injection and data is erased from the silicon nitride read only memory by negative gate channel erase method. Since the gate conductive layer and the channel layer are identically doped, the energy gap between the two layers reduced. Hence, operating voltage of the gate terminal is lowered and damage to the tunnel oxide layer by hot holes is reduced.

Abstract: A method for compensating a threshold voltage of a neighbor bit, are provided. The method includes the first step of arbitrating the word line voltages applied to bits demanded to be programmed, wherein the the word line voltages are arbitrated according to the threshold voltages of the neighbor bits adjacent to the bits. Next, the bits, to which a same word line voltage should be applied, in the memory cells are distributed to a group of bits with the same word line voltage. Then, the same word line voltage is applied to the bits of the group of bits with the same word line voltage.

Abstract: A silicon nitride read only memory and associated method of data programming and erasing. The read only memory includes a first type ion-doped semiconductor substrate, an oxide-nitride-oxide (ONO) composite layer over the semiconductor substrate, a first type ion-doped gate conductive layer over the ONO layer and a second type ion doped source/drain region in the substrate on each side of the ONO layer, wherein the second type ions have an electrical polarity opposite to the first type ions. Data is programmed into the silicon nitride read only memory by channel hot electron injection and data is erased from the silicon nitride read only memory by negative gate channel erase method. Since the gate conductive layer and the channel layer are identically doped, the energy gap between the two layers reduced. Hence, operating voltage of the gate terminal is lowered and damage to the tunnel oxide layer by hot holes is reduced.