Abstract: A thin cooling fan includes a fan shell, a motor, a plurality of blades, and a PCB. The fan shell comprises a base plate and a shell cover which cover to each other to form an inner space. The base plate has a first surface facing toward the inner space and a second surface having a receiving space and opposite to the first surface. The motor is combined in the inner space. The blades are disposed in the inner space and rotated by the motor. The PCB is disposed in the receiving space and flush with the second surface. Thus, the whole thickness of the cooling fan is reduced and the flow channel design in the inner space is not affected.

Abstract: A thin cooling fan (1) includes a fan shell (10), a motor (20), a plurality of blades (30), and a PCB (40). The fan shell (10) comprises a base plate (11) and a shell cover (12) which cover to each other to form an inner space (100). The base plate (11) has a first surface (111) facing toward the inner space (100) and a second surface (112) having a receiving space (101) and opposite to the first surface (111). The motor (20) is combined in the inner space (100). The blades (30) are disposed in the inner space (100) and rotated by the motor (20). The PCB (40) is disposed in the receiving space (101) and flush with the second surface (112). Thus, the whole thickness of the cooling fan (1) is reduced and the flow channel design in the inner space (100) is not affected.

Abstract: Operations in fabricating a Fin FET include providing a substrate having a fin structure, where an upper portion of the fin structure has a first fin surface profile. An isolation region is formed on the substrate and in contact with the fin structure. A portion of the isolation region is recessed by an etch process to form a recessed portion and to expose the upper portion of the fin structure, where the recessed portion has a first isolation surface profile. A thermal hydrogen treatment is applied to the fin structure and the recessed portion. A gate dielectric layer is formed with a substantially uniform thickness over the fin structure, where the recessed portion is adjusted from the first isolation surface profile to a second isolation surface profile and the fin structure is adjusted from the first fin surface profile to a second fin surface profile by the thermal hydrogen treatment.

Abstract: Operations in fabricating a Fin FET include providing a substrate having a fin structure, where an upper portion of the fin structure has a first fin surface profile. An isolation region is formed on the substrate and in contact with the fin structure. A portion of the isolation region is recessed by an etch process to form a recessed portion and to expose the upper portion of the fin structure, where the recessed portion has a first isolation surface profile. A thermal hydrogen treatment is applied to the fin structure and the recessed portion. A gate dielectric layer is formed with a substantially uniform thickness over the fin structure, where the recessed portion is adjusted from the first isolation surface profile to a second isolation surface profile and the fin structure is adjusted from the first fin surface profile to a second fin surface profile by the thermal hydrogen treatment.

Abstract: A FinFET structure includes a substrate, a plurality of stripes, a metal gate and an oxide material. The stripes are on the substrate. The metal gate is on a sidewall and a top surface of one of the stripes. The oxide material is between the metal gate and the stripes. An average roughness of an interface between the metal gate and the oxide material is in a range of from about 0.1 nm to about 0.2 nm.

Abstract: An antenna system includes a monopole antenna with a first end connected to a feed point on a printed circuit board (PCB) and a second end being electrically floating; and a matching conductive stub with a first end connected to a ground point on the PCB and a second end being electrically floating.

Abstract: A button-type connector module and an electronic device using the button-type connector module are provided. The electronic device is adapted to the pluggable hot plug component. The electronic device includes a main body and a button-type connector module. The main body includes a motherboard. The button-type connector module is disposed in the main body. The button-type connector module includes a push button unit, a connector and a circuit board. The connector includes an accommodation recess. The hot plug component is plugged into or removed from the accommodation recess, when the connector moves relative to the main body to expose the accommodation recess. The circuit board is disposed between the push button unit and the connector. The push button unit and the connector are electrically connected to the motherboard of the main body via the circuit board.

Abstract: Operations in fabricating a Fin FET include providing a substrate having a fin structure, where an upper portion of the fin structure has a first fin surface profile. An isolation region is formed on the substrate and in contact with the fin structure. A portion of the isolation region is recessed by an etch process to form a recessed portion and to expose the upper portion of the fin structure, where the recessed portion has a first isolation surface profile. A thermal hydrogen treatment is applied to the fin structure and the recessed portion. A gate dielectric layer is formed with a substantially uniform thickness over the fin structure, where the recessed portion is adjusted from the first isolation surface profile to a second isolation surface profile and the fin structure is adjusted from the first fin surface profile to a second fin surface profile by the thermal hydrogen treatment.

Abstract: An antenna system includes a monopole antenna with a first end connected to a feed point on a printed circuit board (PCB) and a second end being electrically floating; and a matching conductive stub with a first end connected to a ground point on the PCB and a second end being electrically floating.

Abstract: A FinFET structure includes a substrate, a plurality of stripes, a metal gate and an oxide material. The stripes are on the substrate. The metal gate is on a sidewall and a top surface of one of the stripes. The oxide material is between the metal gate and the stripes. An average roughness of an interface between the metal gate and the oxide material is in a range of from about 0.1 nm to about 0.2 nm.

Abstract: Provided are methods of preparing a biocompatible textured surface on a thermoplastic material comprising treating the material with a plasma and subsequently shrinking the substrate to induce formation of textures. The textured surfaces are useful in one aspect, to align cells such as stem cells.

Abstract: A button-type connector module and an electronic device using the button-type connector module are provided. The electronic device is adapted to the pluggable hot plug component. The electronic device includes a main body and a button-type connector module. The main body includes a motherboard. The button-type connector module is disposed in the main body. The button-type connector module includes a push button unit, a connector and a circuit board. The connector includes an accommodation recess. The hot plug component is plugged into or removed from the accommodation recess, when the connector moves relative to the main body to expose the accommodation recess. The circuit board is disposed between the push button unit and the connector. The push button unit and the connector are electrically connected to the motherboard of the main body via the circuit board.

Abstract: A semiconductor structure and a method for forming the same are provided. The method includes providing a substrate, forming a fin structure extruding from the substrate, forming shallow trench isolations over the substrate, and forming an oxide material over the fin structure. The method further includes forming a carbon-doped amorphous silicon layer or a carbon-doped poly silicon layer over the oxide material, wherein the forming a carbon-doped amorphous silicon layer or a carbon-doped poly silicon layer includes doping carbon in a range of from about 5E19/cm3 to about 1E22/cm3.

Abstract: A thin cooling fan (1) includes a fan shell (10), a motor (20), a plurality of blades (30), and a PCB (40). The fan shell (10) comprises a base plate (11) and a shell cover (12) which cover to each other to form an inner space (100). The base plate (11) has a first surface (111) facing toward the inner space (100) and a second surface (112) having a receiving space (101) and opposite to the first surface (111). The motor (20) is combined in the inner space (100). The blades (30) are disposed in the inner space (100) and rotated by the motor (20). The PCB (40) is disposed in the receiving space (101) and flush with the second surface (112). Thus, the whole thickness of the cooling fan (1) is reduced and the flow channel design in the inner space (100) is not affected.

Abstract: A device for enhancing electromagnetic susceptibility comprises a first bridge. The first bridge is near to a first trace of a differential pair routing and electrically connects an RF grounding with an analog grounding. The RF grounding and the analog grounding are separated. The differential pair routing transmits signals between an RF circuit and an analog circuit. The first trace of the differential pair routing is closer to an antenna coupled to the RF grounding than a second trace of the differential pair routing. The RF circuit is coupled to the RF grounding, and the analog circuit is coupled to the analog grounding.

Abstract: A wireless security device includes a nonconductive housing, a mother circuit board, a wireless expansion card, and a metal reflector. The mother circuit board and the wireless expansion card are disposed in the nonconductive housing. The mother circuit board includes a processor. The wireless expansion card includes a dielectric substrate, a ground plane, an inverted-F antenna, and an RF (radio frequency) module. The metal reflector is positioned between the mother circuit board and the wireless expansion card, and is close to the inverted-F antenna. The metal reflector is configured to reduce EMI (Electromagnetic Interference) from the mother circuit board so as to maintain performance of the inverted-F antenna.

Abstract: The present invention relates to an artificial leather and method for making the same. The artificial leather includes a polyester fiber substrate and a thermoplastic polyester elastomer (TPEE) resin layer. The polyester fiber substrate has a plurality of polyester fibers. The thermoplastic polyester elastomer (TPEE) resin layer is disposed adjacent to the polyester fiber substrate, and the material thereof is thermoplastic polyester elastomer (TPEE). Whereby, the material of the all layers of the artificial leather is polyester types, therefore, the whole artificial leather can be melted to recycle and reuse when disposing the artificial leather, so as to achieve the effect of environmental protection.

Abstract: A wireless security device includes a nonconductive housing, a mother circuit board, a wireless expansion card, and a metal reflector. The mother circuit board and the wireless expansion card are disposed in the nonconductive housing. The mother circuit board includes a processor. The wireless expansion card includes a dielectric substrate, a ground plane, an inverted-F antenna, and an RF (radio frequency) module. The metal reflector is positioned between the mother circuit board and the wireless expansion card, and is close to the inverted-F antenna. The metal reflector is configured to reduce EMI (Electromagnetic Interference) from the mother circuit board so as to maintain performance of the inverted-F antenna.

Abstract: A device for enhancing electromagnetic susceptibility comprises a first bridge. The first bridge is near to a first trace of a differential pair routing and electrically connects an RF grounding with an analog grounding. The RF grounding and the analog grounding are separated. The differential pair routing transmits signals between an RF circuit and an analog circuit. The first trace of the differential pair routing is closer to an antenna coupled to the RF grounding than a second trace of the differential pair routing. The RF circuit is coupled to the RF grounding, and the analog circuit is coupled to the analog grounding.

Abstract: A method of automatic task execution is adapted to be performed by an electronic apparatus that includes an image-capturing module and a processing module. The method includes the steps of: a) recording in the processing module a relationship between a visible physical attribute of an object and a corresponding task to be executed by the processing module; b) configuring the electronic apparatus for capturing an image containing a target using the image-capturing module; c) configuring the processing module to determine if the visible physical attribute of the object is found in the image captured by the image-capturing module; and d) when the visible physical attribute of the object is found in the image, configuring the processing module to execute the corresponding task automatically.