Patents by Inventor Cheng-Wei Lee
Cheng-Wei Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11957667Abstract: Methods of treating a disease caused by a positive strand RNA virus. The methods include administering to a subject in need thereof an effective amount of a compound of Formula I or Formula II.Type: GrantFiled: July 7, 2021Date of Patent: April 16, 2024Assignee: National Health Research InstitutesInventors: Shiow-Ju Lee, Cheng-Wei Yang, Yue-Zhi Lee, Hsing-Yu Hsu
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Patent number: 11955154Abstract: A sense amplifier circuit includes a sense amplifier, a switch and a temperature compensation circuit. The temperature compensation circuit provides a control signal having a positive temperature coefficient, based on which the switch provides reference impedance for temperature compensation. The sense amplifier includes a first input end coupled to a target bit and a second input end coupled to the switch. The sense amplifier outputs a sense amplifier signal based on the reference impedance and the impedance of the target bit.Type: GrantFiled: May 16, 2022Date of Patent: April 9, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Cheng-Tung Huang, Jen-Yu Wang, Po-Chun Yang, Yi-Ting Wu, Yung-Ching Hsieh, Jian-Jhong Chen, Chia-Wei Lee
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Publication number: 20240113856Abstract: The present invention provides an encryption determining method. The method includes the following steps: receiving a side channel signal; generating a filtered side channel signal by filtering noise within the side channel signal; generating a phasor signal by utilizing a filter to covert the filtered side channel signal; locating the encrypted segment by calculating a periodicity of the phasor signal utilizing a standard deviation window; extracting at least one encrypted characteristic from the encrypted segment; and generating an encryption analytic result by recognizing the at least one encrypted characteristic according to a characteristic recognition model; wherein the encryption analytic result includes a position of the encrypted segment within the side channel signal, and an encryption type corresponding to the side channel signal. The present invention is able to automatically and efficiently locate the encryption segment and analyze the encryption type corresponding to the side channel signal.Type: ApplicationFiled: October 31, 2022Publication date: April 4, 2024Applicant: INSTITUTE FOR INFORMATION INDUSTRYInventors: Jian-Wei LIAO, Cheng-En LEE, Ting-Yu LIN
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Publication number: 20240105739Abstract: An electronic device includes a substrate, a conductive structure disposed on the substrate, and a first insulating island disposed on the conductive structure. The conductive structure includes a first conductive component, a second conductive component, and a third conductive component. The third conductive component is disposed on the first conductive component and the second conductive component. The third conductive component is electrically connected to the first conductive component and the second conductive component. In a cross-sectional view of the electronic device, the width of the first insulating island is greater than the width of the third conductive component.Type: ApplicationFiled: August 16, 2023Publication date: March 28, 2024Inventors: Wen-Bin HUNG, Cheng-Wei LEE
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Publication number: 20240097011Abstract: A method includes forming a fin structure over a substrate, wherein the fin structure comprises first semiconductor layers and second semiconductor layers alternately stacked over a substrate; forming a dummy gate structure over the fin structure; removing a portion of the fin structure uncovered by the dummy gate structure; performing a selective etching process to laterally recess the first semiconductor layers, including injecting a hydrogen-containing gas from a first gas source of a processing tool to the first semiconductor layers and the second semiconductor layers; and injecting an F2 gas from a second gas source of the processing tool to the first semiconductor layers and the second semiconductor layers; forming inner spacers on opposite end surfaces of the laterally recessed first semiconductor layers of the fin structure; and replacing the dummy gate structure and the first semiconductor layers with a metal gate structure.Type: ApplicationFiled: December 1, 2023Publication date: March 21, 2024Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC NANJING COMPANY LIMITEDInventors: Han-Yu LIN, Fang-Wei LEE, Kai-Tak LAM, Raghunath PUTIKAM, Tzer-Min SHEN, Li-Te LIN, Pinyen LIN, Cheng-Tzu YANG, Tzu-Li LEE, Tze-Chung LIN
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Publication number: 20240088023Abstract: An interconnect structure includes a dielectric layer, a first conductive feature, a hard mask layer, a conductive layer, and a capping layer. The first conductive feature is disposed in the dielectric layer. The hard mask layer is disposed on the first conductive feature. The conductive layer includes a first portion and a second portion, the first portion of the conductive layer is disposed over at least a first portion of the hard mask layer, and the second portion of the conductive layer is disposed over the dielectric layer. The hard mask layer and the conductive layer are formed by different materials. The capping layer is disposed on the dielectric layer and the conductive layer.Type: ApplicationFiled: November 20, 2023Publication date: March 14, 2024Inventors: Shao-Kuan LEE, Kuang-Wei YANG, Cherng-Shiaw TSAI, Cheng-Chin LEE, Ting-Ya LO, Chi-Lin TENG, Hsin-Yen HUANG, Hsiao-Kang CHANG, Shau-Lin SHUE
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Publication number: 20240076422Abstract: A supported metallocene catalyst includes a carrier and a metallocene component. The carrier includes an inorganic oxide particle and an alkyl aluminoxane material. The inorganic oxide particle includes at least one inorganic oxide compound selected from the group consisting of an oxide of Group 3A and an oxide of Group 4A. The alkyl aluminoxane material includes an alkyl aluminoxane compound and an alkyl aluminum compound that is present in amount ranging from greater than 0.01 wt % to less than 14 wt % base on 100 wt % of the alkyl aluminoxane material. The metallocene component is supported on the carrier, and includes one of a metallocene compound containing a metal from Group 3B, a metallocene compound containing a metal from Group 4B, and a combination thereof. A method for preparing the supported metallocene catalyst and a method for preparing polyolefin using the supported metallocene catalyst are also disclosed.Type: ApplicationFiled: September 1, 2023Publication date: March 7, 2024Inventors: Jing-Cherng TSAI, Jen-Long WU, Wen-Hao KANG, Kuei-Pin LIN, Jing-Yu LEE, Jun-Ye HONG, Zih-Yu SHIH, Cheng-Hung CHIANG, Gang-Wei SHEN, Yu-Chuan SUNG, Chung-Hua WENG, Hsing-Ya CHEN
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Publication number: 20240079440Abstract: A multispectral sensing device includes a first die, including silicon, which is patterned to define a first array of sensor elements, which output first electrical signals in response to optical radiation that is incident on the device in a band of wavelengths less than 1000 nm that is incident on the front side of the first die. A second die has its first side bonded to the back side of the first die and includes a photosensitive material and is patterned to define a second array of sensor elements, which output second electrical signals in response to the optical radiation that is incident on the device in a second band of wavelengths greater than 1000 nm that passes through the first die and is incident on the first side of the second die. Readout circuitry reads the first electrical signals and the second electrical signals serially out of the device.Type: ApplicationFiled: September 6, 2022Publication date: March 7, 2024Inventors: Oray O. Cellek, Fei Tan, Gershon Rosenblum, Hong Wei Lee, Cheng-Ying Tsai, Jae Y. Park, Christophe Verove, John L Orlowski, Siddharth Joshi, Xiangli Li, David Coulon, Xiaofeng Fan, Keith Lyon, Nicolas Hotellier, Arnaud Laflaquière
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Publication number: 20240071947Abstract: A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, wherein the first package component may include a first semiconductor die, a ring structure attached to the substrate, wherein the ring structure may encircle the first package component in a top view, and a lid structure attached to the ring structure. The ring structure may include a first segment, extending along a first edge of the substrate, and a second segment, extending along a second edge of the substrate. The first segment and the second segment may meet at a first corner of the ring structure, and a first indent of the ring structure may be disposed at the first corner of the ring structure.Type: ApplicationFiled: August 30, 2022Publication date: February 29, 2024Inventors: Yu-Ling Tsai, Lai Wei Chih, Meng-Tsan Lee, Hung-Pin Chang, Li-Han Hsu, Chien-Chia Chiu, Cheng-Hung Lin
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Patent number: 11916130Abstract: A lateral bipolar junction transistor including an emitter region, base region and collector region laterally orientated over a type IV semiconductor substrate, each of the emitter region, the base region and the collector region being composed of a type III-V semiconductor material. A buried oxide layer is present between the type IV semiconductor substrate and the emitter region, the base region and the collector region. The buried oxide layer having a pedestal aligned with the base region.Type: GrantFiled: February 26, 2021Date of Patent: February 27, 2024Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Kuen-Ting Shiu, Tak H. Ning, Jeng-Bang Yau, Cheng-Wei Cheng, Ko-Tao Lee
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Patent number: 11794381Abstract: A laser-debondable composition includes an acrylic resin, a light-shielding material, an additive, and a solvent. Wherein, the acrylic resin includes at least one nitrogen-containing organic group selected from a group consisting of tertiary amino groups and secondary amino groups, an organic group having a cyclic ether group, and an organic group having a hydroxyl group, and the additive includes at least one adhesion promoter. The laser-debondable composition has excellent adhesion ability to a substrate, attachability, and solvent resistance.Type: GrantFiled: January 20, 2021Date of Patent: October 24, 2023Assignee: DAXIN MATERIALS CORPORATIONInventors: Shih-Yun Chiu, Cheng-Wei Lee, Chi-Yen Lin
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Patent number: 11239607Abstract: A fastening device for expansion cards that is capable of connecting to a slot on a normal motherboard and fastening an expansion card in the slot is disclosed. The fastening device includes a top pressing unit and two side fastening units, wherein the two side fastening units are connected to two ends of the top pressing unit, respectively, and each side fastening unit is provided with an opening. When two clip units disposed on the two ends of the slot pass through the openings of the two side fixing units respectively, the top pressing unit presses the top edge of the expansion card inserted into the slot and the two side fastening units respectively press and fasten the two clip units so as to restrain the clip units from unlocking and to prevent the expansion card from becoming loose in the slot.Type: GrantFiled: April 17, 2020Date of Patent: February 1, 2022Assignee: Innodisk CorporationInventors: Shuang-Te Chang, Ting-Yun Lin, Cheng-Wei Lee, Rei Yeh, Chung-Yu Chuang
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Publication number: 20210221032Abstract: A laser-debondable composition includes an acrylic resin, a light-shielding material, an additive, and a solvent. Wherein, the acrylic resin includes at least one nitrogen-containing organic group selected from a group consisting of tertiary amino groups and secondary amino groups, an organic group having a cyclic ether group, and an organic group having a hydroxyl group, and the additive includes at least one adhesion promoter. The laser-debondable composition has excellent adhesion ability to a substrate, attachability, and solvent resistance.Type: ApplicationFiled: January 20, 2021Publication date: July 22, 2021Inventors: Shih-Yun CHIU, Cheng-Wei LEE, Chi-Yen LIN
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Publication number: 20210135401Abstract: A fastening device for expansion cards that is capable of connecting to a slot on a normal motherboard and fastening an expansion card in the slot is disclosed. The fastening device includes a top pressing unit and two side fastening units, wherein the two side fastening units are connected to two ends of the top pressing unit, respectively, and each side fastening unit is provided with an opening. When two clip units disposed on the two ends of the slot pass through the openings of the two side fixing units respectively, the top pressing unit presses the top edge of the expansion card inserted into the slot and the two side fastening units respectively press and fasten the two clip units so as to restrain the clip units from unlocking and to prevent the expansion card from becoming loose in the slot.Type: ApplicationFiled: April 17, 2020Publication date: May 6, 2021Inventors: SHUANG-TE CHANG, TING-YUN LIN, CHENG-WEI LEE, REI YEH, CHUNG-YU CHUANG
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Publication number: 20210040365Abstract: A temporary bonding composition is provided. The temporary bonding composition includes a polyfunctional crosslinker, a polymer and a solvent. The polyfunctional crosslinker includes a compound containing at least two functional groups selected from the group of blocked isocyanate groups, alkenyl ether groups, and alkoxyhydrocarbyl groups. Each of the blocked isocyanate groups is an isocyanate group protected by a blocking agent. The polymer has a functional group reacting to the polyfunctional crosslinker.Type: ApplicationFiled: December 29, 2019Publication date: February 11, 2021Inventors: Cheng-Wei LEE, Pei-Ci CHO, Chun-Hung HUANG, Min-Chi YANG, Chi-Yen LIN, Yuan-Li LIAO
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Patent number: 10703945Abstract: A method for temporary bonding workpiece includes steps as follows. A combining step is performed, wherein an adhesive layer is formed on a surface of at least one substrate and/or at least one workpiece. A bonding step is performed, wherein the substrate and the workpiece are bonded by the adhesive layer. A processing step is performed, wherein the workpiece is processed. A debonding step is performed, wherein the adhesive layer is irradiated with a laser so as to separate the workpiece from the substrate. The adhesive layer is formed by an adhesive, the adhesive includes a polymer and a light absorbing material, a content of the polymer in a solid content of the adhesive is in a range of 50 wt % to 98 wt %, a content of the light absorbing material in the solid content of the adhesive is in a range of 2 wt % to 50 wt %.Type: GrantFiled: April 24, 2019Date of Patent: July 7, 2020Assignee: Daxin Materials CorporationInventors: Chi-Yen Lin, Cheng-Wei Lee, Chun-Hung Huang, Hou-Te Lu, Yuan-Li Liao
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Patent number: 10606345Abstract: A reality interactive responding system, comprising a first server configured to receive first input data from a user and to determine whether the first input data conform to any one of a plurality of variation conditions or not; and a second server coupled to the first server and configured to receive second input data from the first server when the first input data conform to any one of the plurality of variation conditions and to determine a plurality of interactions in response to the first input data from the user; wherein the first input data from the user are related to an action, a facial expression, a gaze, a text, a speech, a gesture, an emotion or a movement generated by the user.Type: GrantFiled: September 25, 2018Date of Patent: March 31, 2020Assignee: XRSpace CO., LTD.Inventors: Peter Chou, Feng-Seng Chu, Cheng-Wei Lee, Yu-Chen Lai, Chuan-Chang Wang
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Publication number: 20200097067Abstract: A reality interactive responding system, comprising a first server configured to receive first input data from a user and to determine whether the first input data conform to any one of a plurality of variation conditions or not; and a second server coupled to the first server and configured to receive second input data from the first server when the first input data conform to any one of the plurality of variation conditions and to determine a plurality of interactions in response to the first input data from the user; wherein the first input data from the user are related to an action, a facial expression, a gaze, a text, a speech, a gesture, an emotion or a movement generated by the userType: ApplicationFiled: September 25, 2018Publication date: March 26, 2020Inventors: Peter Chou, Feng-Seng Chu, Cheng-Wei Lee, Yu-Chen Lai, Chuan-Chang Wang
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Publication number: 20200099634Abstract: An interactive responding method comprises receiving an input data from a user; generating an output data according to the input data retrieving a plurality of attributes from the output data; determining a plurality of interactions corresponding to the plurality of attributes of the output data; and displaying the plurality of interactions via a non-player character; wherein the input data and the output data are related to a text.Type: ApplicationFiled: September 20, 2018Publication date: March 26, 2020Inventors: Peter Chou, Feng-Seng Chu, Cheng-Wei Lee
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Patent number: D897405Type: GrantFiled: January 12, 2018Date of Patent: September 29, 2020Assignee: TDK Taiwan Corp.Inventor: Cheng-Wei Lee