Abstract: An interactive responding method comprises receiving an input data from a user; generating an output data according to the input data retrieving a plurality of attributes from the output data; determining a plurality of interactions corresponding to the plurality of attributes of the output data; and displaying the plurality of interactions via a non-player character; wherein the input data and the output data are related to a text.

Abstract: A method for temporary bonding workpiece includes steps as follows. A combining step is performed, wherein an adhesive layer is formed on a surface of at least one substrate and/or at least one workpiece. A bonding step is performed, wherein the substrate and the workpiece are bonded by the adhesive layer. A processing step is performed, wherein the workpiece is processed. A debonding step is performed, wherein the adhesive layer is irradiated with a laser so as to separate the workpiece from the substrate. The adhesive layer is formed by an adhesive, the adhesive includes a polymer and a light absorbing material, a content of the polymer in a solid content of the adhesive is in a range of 50 wt % to 98 wt %, a content of the light absorbing material in the solid content of the adhesive is in a range of 2 wt % to 50 wt %.

Abstract: A method to enhance collaboration by enabling users of a content-sharing platform to identify media items to credit the entities that contributed to the media item. Such a method includes receiving a request for a media item and obtaining credit data associated with the media item. The method further includes providing for presentation the media item and a list of entities contributing to the media item as defined by the credit data and when receiving the request pertaining to an entity from the list, providing for presentation a list of media items that the entity has contributed to.

Abstract: A backlight module for an LCD device includes a front module and a rear module. The front module includes a middle frame and a plurality of optical films coupled to the middle frame. The rear module includes a rear shell, an optical plate and a light emitting source. The rear module is connected to the front module by having the middle frame and the rear shell mechanically connected together. The backlight module can be a vertical type or an edge type backlight module by having the front module coupled with the rear module having a required structure.

Abstract: A display device includes a housing, a backlight module and a heat dissipation assembly. A first hole is defined in the housing. A hook formed on the housing. The backlight module includes a light bar. The heat dissipation assembly includes a main body and a heat dissipation column. The main body is fixed on the housing via the hook. The heat dissipation column is formed on the main body and exposed through the first hole. The heat dissipation assembly configured to absorb heat generated by the backlight module and dissipate the heat external to the housing.

Abstract: A backlight module includes a substrate, at least one light bar coupled to the substrate, and at least one locating mechanism. The at least one locating mechanism is located on the substrate for locking the at least light bar to the substrate. The locating mechanism includes two first limiting portions, a plurality of second limiting portions, and a plurality of positioning poles. The second limiting portions and the positioning pole are alternately disposed between the opposite first limiting portions. The first limiting portion, the second limiting portion, and the positioning pole respectively limit the light bar in different directions.

Abstract: A display device includes a housing, a backlight module and a heat dissipation assembly. A first hole is defined in the housing. A hook formed on the housing. The backlight module includes a light bar. The heat dissipation assembly includes a main body and a heat dissipation column. The main body is fixed on the housing via the hook. The heat dissipation column is formed on the main body and exposed through the first hole. The heat dissipation assembly configured to absorb heat generated by the backlight module and dissipate the heat external to the housing.

Abstract: A backlight module includes a light guide plate and a number of light sources. The light guide plate includes a first surface and a number of projecting portions extending from the first surface corresponding to the light sources. Each projection portion includes a second surface facing a light source. A number of microstructures are formed on the second surface for increasing the divergence angle of the light incident to the light guide plate through the second surface.

Abstract: The embodiments described herein relate to photosensitizer dyes for dye-sensitized solar cell (DSSC) devices. In one example, a series of photosensitizer dyes for DSSC devices that have a high absorption coefficient and conversion efficiency, lower cost and better safety, are provided. The photosensitizer dyes are porphyrin-based zinc (Zn) complexes.

Abstract: A method for the automatic configuration of conference resources includes receiving a user request identifying at least one conference resource to be used in a conference. The at least one conference resource is reserved for the conference. Operation of the conference resource is automatically initiated without user interaction.

Abstract: Methods and systems for transferring a communications exchange using a mobile handset are described. A radio frequency (RF) signal is transmitted from a mobile handset to a base station to provide a communications exchange. The communications exchange exists between the mobile handset and a first communications device. The mobile handset automatically detects a second communications device when it is in close proximity to the second communications device. The second communications device is capable of receiving a call handoff. If the mobile handset is in close proximity to the second communications device, then a transfer request including information associated with the second communications device is received from the second communications device. The transfer request is accepted and the communications exchange is seamlessly transferred to the second communications device form the mobile handset.

Abstract: This invention relates to photosensitizer dyes for dye-sensitized solar cells. The photosensitizer dyes are porphyrin-based zinc complexes represented by the following general formulae (100) and (200). wherein A is represented by one of the following formulae (111)˜(118), wherein Z1˜Z10 independently represent a hydrogen atom (H), lithium (Li), sodium (Na), or tetra-alkyl ammonium group (as represented by the following general formula (120)), wherein X1˜X4 independently represent CmH2m+1 (m=1˜6), and B, C, D, and E independently represent one of the following formulae (131)˜(140), wherein Ra˜Rz are independently selected from the group consisting of H, CmH2m+1 (m=1˜15), OCpH2p+1 (p=1˜15), CH2[OC2H4]nOCH3 (n=1˜30), and [OC2H4]qOCH3 (q=1˜30).

Abstract: A method for the automatic configuration of conference resources includes receiving a user request identifying at least one conference resource to be used in a conference. The at least one conference resource is reserved for the conference. Operation of the conference resource is automatically initiated without user interaction.

Abstract: A method for forming aluminum bumps by first sputter aluminum and then chemical mechanical polishing to remove excess aluminum is disclosed. In the method, a pre-processed electronic substrate which has a plurality of I/O pads formed on top is first provided. An insulating material layer such as SiO2, Si3N4, SOG or polyimide is then deposited on the pads to a thickness that is essentially the thickness of the aluminum bumps to be formed. A plurality of openings with one on each of the plurality of I/O pads is then photolithographically formed, followed by a sputtering deposition to fill the plurality of openings with a metal that includes aluminum. A chemical mechanical polishing technique is then used to remove the excess aluminum so that a top surface of the aluminum bump is flush with the top surface of the insulating material layer, followed by the final step of removing at least partially a thickness of the insulating material layer by a wet etch process.

Abstract: A new method is provided for the creation of an aluminum bump on a surface of a semiconductor device. A patterned layer of aluminum overlying a substrate is created, the patterned layer of aluminum is the layer of aluminum over which a contact bump is to be created. A layer of passivation is deposited, a first layer of photoresist is deposited for the creation of an opening in the layer of passivation that partially exposed the surface of the patterned layer of aluminum. This patterned first layer of photoresist remains in place, a layer of aluminum is sputter deposited, a second layer of photoresist is deposited which is patterned and etched for the creation of the aluminum bump overlying the patterned layer of aluminum. The aluminum solder bump is created by etching the deposited layer of aluminum. After the solder bump has been created, the patterned first and the second layers of photoresist are removed in one processing step, leaving in place the solder bump.

Abstract: A method for forming aluminum bumps by first sputter aluminum and then chemical mechanical polishing to remove excess aluminum is disclosed. In the method, a pre-processed electronic substrate which has a plurality of I/O pads formed on top is first provided. An insulating material layer such as SiO2, Si3N4, SOG or polyimide is then deposited on the pads to a thickness that is essentially the thickness of the aluminum bumps to be formed. A plurality of openings with one on each of the plurality of I/O pads is then photolithographically formed, followed by a sputtering deposition to fill the plurality of openings with a metal that includes aluminum. A chemical mechanical polishing technique is then used to remove the excess aluminum so that a top surface of the aluminum bump is flush with the top surface of the insulating material layer, followed by the final step of removing at least partially a thickness of the insulating material layer by a wet etch process.

Abstract: A method for forming aluminum bumps that has significantly reduced processing steps than the conventional method is disclosed. The method utilizes a chemical vapor deposition technique for the selective deposition of aluminum into an opening for forming the bump and then a wet etch process for removing a polymide layer that functioned both as a photoresist layer for providing an opening in a passivation layer and as a support for a via hole during the selective aluminum deposition process. The thickness of the passivation layer and the polyimide layer formed on top of the metal I/O pad is important since it determines the height of the aluminum bump formed.

Abstract: A method for forming aluminum bumps that has significantly reduced processing steps than the conventional method is disclosed. The method utilizes a chemical vapor deposition technique for the selective deposition of aluminum into an opening for forming the bump and then a wet etch process for removing a polyimide layer that functioned both as a photoresist layer for providing an opening in a passivation layer and as a support for a via hole during the selective aluminum deposition process. The thickness of the passivation layer and the polyimide layer formed on top of the metal I/O pad is important since it determines the height of the aluminum bump formed.