Abstract: A noised-reduced capacitive image sensor and a method operating the capacitive image sensor are provided. The capacitive image sensor includes: a number of capacitive sensing units forming an array, each capacitive sensing unit for transforming a distance between a portion of a surface of an approaching finger and a top surface thereof into an output electric potential, wherein a value of the output electric potential is changed by a driving signal applied to the sensing unit; at least one sample-and-hold circuit for capturing and retaining different output electric potentials; at least one signal conditioning circuit, each comprising at least one differential amplifier for amplifying a difference between two electric potentials retained by the sample-and-hold circuit; and a driving source, for providing the driving signal to the capacitive sensing units.

Abstract: A capacitive image sensor and a method for operating the capacitive image sensor are provided. The capacitive image sensor has an array of capacitive sensing units for transforming a distance between each of the capacitive sensing units and a surface of an adjacent finger into an output electric potential. The capacitive sensing unit comprises: a protective layer; a first sensing plate, formed under the protective layer; a second sensing plate, formed under the first sensing plate; an active semiconductor circuitry, formed under the second sensing plate and connected to the first and second sensing plates; at least one first insulating layer, formed between the first sensing plate and the second sensing plate; and at least one second insulating layer, formed between the second sensing plate and the active semiconductor circuitry.

Abstract: A capacitive fingerprint sensing unit and enhanced capacitive fingerprint reader using the capacitive fingerprint sensing units are disclosed. The enhanced capacitive fingerprint reader includes a number of capacitive fingerprint sensing units, forming a fingerprint sensing array; a conductive element; and an excitation signal driver, for providing excitation signals to the conductive element. By increasing the thicknesses of a first inter-metal dielectric layer and a second inter-metal dielectric layer in fingerprint sensing units in the enhanced capacitive fingerprint reader, sensitivity of the enhanced capacitive fingerprint reader can be improved.

Abstract: A printed circuit board assembly (PCBA) and a method to assemble the PCBA are disclosed. The PCBA includes a printed circuit board (PCB), an image sensing chip and a protection layer. The PCB includes a first insulation layer, a second insulation layer, a first electrically conductive layer, a second electrically conductive layer, and a third electrically conductive layer. The image sensing chip has a number of bonding pads with a sensor portion facing down through the second opening. The PCBA can function as an image sensing module and make the module have the thinnest thickness.

Abstract: A capacitive image sensor with noise reduction feature and a method operating the capacitive image sensor are provided. The capacitive image sensor includes: a number of capacitive sensing units forming an array, each capacitive sensing unit for transforming a distance between a portion of a surface of an approaching finger and a top surface thereof into an output electric potential, wherein a value of the output electric potential is changed by a driving signal coupled on the finger; at least one sample-and-hold circuit for capturing and retaining different output electric potentials; at least one signal conditioning circuit, each comprising: at least one differential amplifier for amplifying a difference between two electric potentials retained by the sample-and-hold circuit; and a driving source, for providing the driving signal to the finger.

Abstract: A capacitive fingerprint sensor which includes capacitive sensing units is disclosed. Each of the capacitive sensing unit includes a sensing electrode; a first switch; a voltage follower; and a reference capacitor. The voltage follower includes an adjustable current source, for providing at least two distinct current levels; and a MOS transistor. The MOS transistor includes a source node, connected to ground via the adjustable current source and serves as an output node of the voltage follower; a gate node, connected to the sensing electrode and serves as an input node of the voltage follower; a drain node, connected to a power source, for providing power to the voltage follower; and a bulk node, connected to the source node.

Abstract: A Printed Circuit Board Assembly (PCBA) for forming an enhanced biometric module and a method for manufacturing the PCBA are disclosed. The method includes the steps of providing a PCB, a biometric sensing chip and SMDs; mounting the biometric sensing chip on the PCB with each bonding pad being electrically linked to one corresponding first contact pad; mounting the SMDs on second contact pads which are electrically linked thereto, respectively; and forming a protection layer. The present invention takes advantages of compact size of small conductive elements to avoid cracks in the protection layer.

Abstract: A read-only method and a read-only system for operating a portable device are disclosed. The system includes a portable device which has a memory unit and a processing unit, and a host which has a display unit and a processor. A browser requests an access to a portable device inserted to a host. After the storage units been accessed are traced, corresponding service will be performed by the portable device without being blocked by the security system of the host.

Abstract: A chip with I/O pads on the peripheries and a method making the chip is disclosed. The chip includes: a substrate; a first metal layer, formed above the substrate; an inter-metal dielectric layer, formed above the first metal layer, having concave portions formed along the peripheries of the chip so that a portion of the first metal layer is exposed to form an input-output (I/O) pad in each of the concave portions which are spaced apart from each other; and a passivation layer, formed above the second metal layer without covering the concave portions so that specific circuits are formed by the first metal layer and the second metal layer, respectively. By changing the I/O pad from the top of the chip to the peripheries, the extra thickness of the packaged chip caused by wire bonding in the prior arts can be reduced.

Abstract: A capacitive fingerprint sensor which includes capacitive sensing units is disclosed. Each of the capacitive sensing unit includes a sensing electrode; a first switch; a voltage follower; and a reference capacitor. The voltage follower includes an adjustable current source, for providing at least two distinct current levels; and a MOS transistor. The MOS transistor includes a source node, connected to ground via the adjustable current source and serves as an output node of the voltage follower; a gate node, connected to the sensing electrode and serves as an input node of the voltage follower; a drain node, connected to a power source, for providing power to the voltage follower; and a bulk node, connected to the source node.

Abstract: Methods for forming metal contacts having tungsten liner layers are provided herein. In some embodiments, a method of processing a substrate includes: exposing a substrate, within a first substrate process chamber, to a plasma formed from a first gas comprising a metal organic tungsten precursor gas or a fluorine-free tungsten halide precursor to deposit a tungsten liner layer, wherein the tungsten liner layer is deposited atop a dielectric layer and within a feature formed in a first surface of the dielectric layer of a substrate; transferring the substrate to a second substrate process chamber without exposing the substrate to atmosphere; and exposing the substrate to a second gas comprising a tungsten fluoride precursor to deposit a tungsten fill layer atop the tungsten liner layer.

Abstract: A chip package having ESD protection and a method for making the chip are disclosed. The chip package includes a chip and a substrate. The chip includes a number of I/O pads each connected to a corresponding I/O contact via a first bonding wire. It also includes a number of ESD protective pads each connected to a corresponding ESD contact via a second bonding wire. Bonding wires connecting the ESD protective pads and the ESD contacts have vertexes closer to the top surface of the chip than the vertexes of the bonding wires connecting the I/O pads and the I/O contacts. Hence, a perfect ESD protection effect is achieved by leading the ESD through the bonding wires to the ESD contacts rather than via the I/O contacts.

Abstract: A noise-reduced capacitive sensing unit is disclosed. The noise-reduced capacitive sensing unit includes: a sensing plate; a first bias voltage source for providing a first bias voltage; a second bias voltage source for providing a second bias voltage; a switch unit, connected between two bias voltage sources and the sensing plate, for selectively providing one of the bias voltages to the sensing plate; an excitation signal source for providing a bi-level waveform; a reference capacitor, formed between the excitation signal source and the sensing plate, for injecting the excitation signal to the sensing plate; and a voltage follower for providing sensing results, wherein an input node of the voltage follower is connected to the sensing plate.

Abstract: A printed circuit board having an electronic component embedded is disclosed. The printed circuit board has four electrically conductive layers and three core layers formed interleavedly. By properly removing a portion of the printed circuit board, the electronic component can be exposed. It has advantages that the exposed electronic component can be a CCD, CMOS or module. When the devices mentioned are embedded in the printed circuit board, one part of them can be exposed from the printed circuit board for normal functions. The overall thickness of the printed circuit board assembly can be minimized to meet the trend of compact design of electronic products.

Abstract: A capacitive image sensor and a method for running the capacitive image sensor are disclosed. The capacitive image sensor includes a number of capacitive sensing elements, forming an array, each capacitive sensing element for transforming a distance between a portion of a surface of an approaching finger and a top surface thereof into an output voltage, wherein a value of the output voltage is changed by a driving signal exerted on the finger; an A/D converter, for converting the output voltage into a number and outputting the number; and a signal source, for providing the driving signal to the finger.

Abstract: A method for packaging fingerprint sensing chips and a fingerprint sensing module using the method are disclosed. The method includes the steps of: A. providing a number of PCBs for packaging fingerprint sensing chips, wherein the PCBs are connected in a form of a panel before cutting; each PCB located in the periphery has a protruding structure on a top surface thereof; each protruding structure connects to adjacent protruding structures to form an cofferdam body; B. mounting a fingerprint sensing chip and other electronic components for each PCB to form a number of PCBAs; C. fixing the PCBAs so that the top surfaces of the fingerprint sensing chips are on the same level substantially; D. dispensing a liquid packaging material to a space enclosed by the cofferdam body; E. curing the liquid packaging material; and F. cutting the connected PCBAs and removing the protruding structure to form independent PCBAs.

Abstract: A compound and securable key is disclosed in the present invention. It includes a printed circuit board, a fingerprint sensor, a micro control unit, and a housing. The present invention provides a key structure with combination of a physical key patterns and biometrics for identification. The key is convenient to carry, difficult to duplicate. It is also has advantages such as low cost, easy use, and compact size of biometric module. The invention enhances security of keys.

Abstract: A Printed Circuit Board Assembly (PCBA) forming an enhanced fingerprint module is disclosed. The PCBA includes a Printed Circuit Board (PCB), an image sensing chip, at least one electrode and a protection layer. An opening in a first insulation layer and a second insulation layer of the PCB together form a sensor portion so that the image sensing chip can be packaged in the opening. Thus, the thickness of the enhanced fingerprint module can be thinner than other fingerprint modules provided by the conventional package methods.

Abstract: A contact image sensor is disclosed in the present invention. The contact image sensor includes: a substrate; an array of sensing units, formed above the substrate; a first insulation structure, formed over the sensing units and the substrate; a number of focusing units, formed above the first insulation structure, each focusing unit is aligned above a corresponding sensing unit with the first insulation structure sandwiched therebetween; a conductive metal layer, linked to a control circuit; an array of Organic Light-Emitting Diode (OLED) units, formed above the conductive metal layer and connected thereto; a transparent conductive layer, formed above the array of OLED units, and connected to the control circuit to control the statuses of the OLED units; and a transparent insulation structure, formed above the transparent conductive layer.

Abstract: A remote control for a smart TV or a set-top box is disclosed. The remote control includes a capacitive fingerprint sensor, a processor and a wireless transmitter. The present invention takes advantages of the capacitive fingerprint sensor so that every user's personal data and corresponding setting for the smart TV or set-top box are available. Channel (or web-site) content rating can be achieved. Purchasing over TV can be safer than ever.