Abstract: A resistance switching RAM logic device is presented. The device includes a pair of resistance switching RAM cells that may be independently programed into at least a low resistance state (LRS) or a high resistance state (HRS). The resistance switching RAM logic device may further include a shared output node electrically connected to the pair of resistance switching RAM cells. A logical output may be determined from the programmed resistance state of each of the resistance switching RAM cells.

Abstract: A security region is provided. The security region includes a plurality of parallel conductive lines on a substrate, wherein each of the parallel conductive lines has a width and includes a bend, and wherein at least a portion of the plurality of parallel conductive lines is discontinuous, and an electrically insulating material between each adjacent pair of parallel conductive lines.

Abstract: A method for fabricating a semiconductor device includes forming a plurality of mandrel cuts from a first set of mandrels of a base structure using lithography, surrounding the first set of mandrels and a second set of mandrels of the base structure with spacer material to form mandrel-spacer structures, forming a flowable material layer on exposed surfaces of the mandrel-spacer structures, and performing additional processing, including forming a plurality of dielectric trenches within the base structure based on patterns formed in the flowable material layer.

Abstract: A self-priming resist may be formed from a first random copolymer forming a resist and a polymer brush having the general formula poly(A-r-B)-C-D, wherein A is a first polymer unit, B is a second polymer unit, wherein A and B are the same or different polymer units, C is a cleavable unit, D is a grafting group and r indicates that poly(A-r-B) is a second random copolymer formed from the first and second polymer units. The first random copolymer may be the same or different from the second random polymer. The self-priming resist can create a one-step method for forming an adhesion layer and resist by using the resist/brush blend.

Abstract: A method of forming a semiconductor structure includes forming a memorization layer over a substrate, forming a first self-aligned double patterning (SADP) stack including a first organic planarization layer (OPL), masking layer, set of mandrels, and set of spacers, and forming a patterned memorization layer by transferring a first pattern of the first set of spacers to the memorization layer. The method also includes forming a second SADP stack comprising a second OPL, masking layer, set of mandrels, and set of spacers, and forming an array of pillars by transferring a second pattern of the second set of spacers to the patterned memorization layer. The first and second OPL and the first and second sets of mandrels are a spin-on coated OPL material, and the memorization layer and first and second masking layers are a material configured for removal selective to the spin-on coated OPL material.

Abstract: A microfluidic chip with high volumetric flow rate is provided that includes at least two vertically stacked microfluidic channel layers, each microfluidic channel layer including an array of spaced apart pillars. Each microfluidic channel layer is interconnected by an inlet/outlet opening that extends through the microfluidic chip. The microfluidic chip is created without wafer to wafer bonding thus circumventing the cost and yield issues associated with microfluidic chips that are created by wafer bonding.

Abstract: Methods of forming fins include masking a region on a three-color hardmask fin pattern, leaving a fin of a first color exposed. The exposed fin of the first color is etched away with a selective etch that does not remove fins of a second color or a third color. The mask and all fins of a second color are etched away. Fins are etched into a fin base layer using the fins of the first color and the fins of the third color.

Abstract: A method for forming fins includes forming a three-color hardmask fin pattern on a fin base layer. The three-color hardmask fin pattern includes hardmask fins of three mutually selectively etchable compositions. Some of the fins of the first color are etched away with a selective etch that does not remove fins of a second color or a third color and that leaves at least one fin of the first color behind. The fins of the second color are etched away. Fins are etched into the fin base layer by anisotropically etching around remaining fins of the first color and fins of the third color.

Abstract: Integrated chips and methods for forming vias in the same include forming a multi-layer isolation structure on an underlying layer. The multi-layer isolation structure includes a first isolation layer around a second isolation layer. Conductive material is formed around the multi-layer isolation structure. The first isolation layer is etched back to expose at least a portion of a sidewall of the conductive material. A conductive via is formed to contact a top surface and the exposed portion of the sidewall of the conductive material.

Abstract: A method of forming a self-aligned top via is provided. The method includes forming a metallization layer on a substrate, and forming a hardmask layer on the metallization layer. The method further includes forming a pair of adjacent parallel mandrels on the hardmask layer with sidewall spacers on opposite sides of each mandrel. The method further includes forming a planarization layer on the exposed portions of the hardmask layer, mandrels, and sidewall spacers, and forming an opening in the planarization layer aligned between the adjacent parallel mandrels. The method further includes forming a spacer layer in the opening, and removing portions of the spacer layer to form a pair of spacer plugs between sections of the sidewall spacers.

Abstract: A microfluidic chip with a high volumetric flow rate is provided that includes at least two vertically stacked microfluidic channel layers, each microfluidic channel layer including an array of spaced apart pillars. Each microfluidic channel layer is interconnected by an inlet/outlet opening that extends through the microfluidic chip. The microfluidic chip is created without wafer to wafer bonding thus circumventing the cost and yield issues associated with microfluidic chips that are created by wafer bonding.

Abstract: An interconnect structure is provided. The interconnect structure includes a first metallization layer, an insulating layer and a second metallization layer. The first metallization layer includes, at an uppermost surface thereof, a first body formed of first dielectric material, first metallic elements and buffer elements formed of second dielectric material adjacent the first metallic elements. The insulating layer is disposed on the uppermost surface of the first metallization layer and defines apertures located at the first metallic elements and the corresponding buffer elements. The second metallization layer is disposed on the insulating layer and includes a second body formed of first dielectric material and second metallic elements located at the apertures and extending through the apertures to contact the corresponding first metallic elements and the corresponding buffer elements.

Abstract: A method of forming a semiconductor structure includes forming a memorization layer over a substrate, forming a first self-aligned double patterning (SADP) stack including a first organic planarization layer (OPL), masking layer, set of mandrels, and set of spacers, and forming a patterned memorization layer by transferring a first pattern of the first set of spacers to the memorization layer. The method also includes forming a second SADP stack comprising a second OPL, masking layer, set of mandrels, and set of spacers, and forming an array of pillars by transferring a second pattern of the second set of spacers to the patterned memorization layer. The first and second OPL and the first and second sets of mandrels are a spin-on coated OPL material, and the memorization layer and first and second masking layers are a material configured for removal selective to the spin-on coated OPL material.

Abstract: A method for forming fins includes forming a three-color hardmask fin pattern on a fin base layer. The three-color hardmask fin pattern includes hardmask fins of three mutually selectively etchable compositions. Some of the fins of the first color are etched away with a selective etch that does not remove fins of a second color or a third color and that leaves at least one fin of the first color behind. The fins of the second color are etched away. Fins are etched into the fin base layer by anisotropically etching around remaining fins of the first color and fins of the third color.

Abstract: Semiconductor devices include channel structures, arranged in vertically aligned pairs of channel structures. A gate stack is formed around all of the plurality of channel structures, filling a space between each pair of channel structures. Inner spacers are formed at respective ends of the channel structures, each having a vertical central portion and horizontal portions that extend outward from sides of the central portion, between the channels.

Abstract: A method of forming a self-aligned top via is provided. The method includes forming a metallization layer on a substrate, and forming a hardmask layer on the metallization layer. The method further includes forming a pair of adjacent parallel mandrels on the hardmask layer with sidewall spacers on opposite sides of each mandrel. The method further includes forming a planarization layer on the exposed portions of the hardmask layer, mandrels, and sidewall spacers, and forming an opening in the planarization layer aligned between the adjacent parallel mandrels. The method further includes forming a spacer layer in the opening, and removing portions of the spacer layer to form a pair of spacer plugs between sections of the sidewall spacers.

Abstract: A method for fabricating a semiconductor device includes forming a plurality of mandrel cuts from a first set of mandrels of a base structure using lithography, surrounding the first set of mandrels and a second set of mandrels of the base structure with spacer material to form mandrel-spacer structures, forming a flowable material layer on exposed surfaces of the mandrel-spacer structures, and performing additional processing, including forming a plurality of dielectric trenches within the base structure based on patterns formed in the flowable material layer.

Abstract: A method of forming source/drain contacts with reduced capacitance and resistance, including, forming a source/drain and a channel region on an active region of a substrate, forming a dielectric fill on the source/drain, forming a trench in the dielectric fill, forming a source/drain contact in the trench, forming an inner contact mask section on a portion of an exposed top surface of the source/drain contact, removing a portion of the source/drain contact to form a channel between a sidewall of the dielectric fill and a remaining portion of the source/drain contact, where a surface area of the remaining portion of the source/drain contact is greater than the surface area of the exposed top surface of the source/drain contact, and forming a source/drain electrode fill on the remaining portion of the source/drain contact.

Abstract: A capacitor includes a stack. The stack has a first metallic layer formed over a substrate, an insulator formed over the first metallic layer, and a second metallic layer formed over the insulator. The first metallic layer has at least one high domain and at least one low domain, where a surface of the substrate in the at least one low domain has a height that is lower than a surface of the substrate in the at least one high domain.

Abstract: Techniques for VFET gate length control are provided. In one aspect, a method of forming a VFET device includes: patterning fins in a substrate; forming first polymer spacers alongside opposite sidewalls of the fins; forming second polymer spacers offset from the fins by the first polymer spacers; removing the first polymer spacers selective to the second polymer spacers; reflowing the second polymer spacers to close a gap to the fins; forming a cladding layer above the second polymer spacers; removing the second polymer spacers; forming gates along opposite sidewalls of the fins exposed in between the bottom spacers and the cladding layer, wherein the gates have a gate length Lg set by removal of the second polymer spacers; forming top spacers above the cladding layer; and forming top source and drains above the top spacers. A VFET device is also provided.