Abstract: A method is described. The method includes obtaining a relationship between a thickness of a contamination layer formed on a mask and an amount of compensation energy to remove the contamination layer, obtaining a first thickness of a first contamination layer formed on the mask from a thickness measuring device, and applying first compensation energy calculated from the relationship to a light directed to the mask.

Abstract: An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts. The spacing structure has a recess to enhance the flexibility of the electronic elements after the electronic elements are connected to one another, thereby preventing the problem of warpage. A method for fabricating the electronic package is also provided.

Abstract: A passivation equipment and a passivation method for a semiconductor device are provided in the present invention. The passivation equipment for the semiconductor device includes a chamber housing and a splitter disposed in the chamber housing. The splitter divides the chamber housing to a first chamber and a second chamber. The passivation equipment further includes a first intake tube connected to the first chamber, a plasma producing unit disposed in the first chamber and a pressure detecting unit connected to the first chamber. By using the passivation equipment of the present invention, high-pressure plasma is used to increase a passivation efficiency of the semiconductor device and decrease a temperature of a passivation reaction.

Abstract: Embodiments of the present disclosure relate to apparatus and methods for cleaning an exhaust path of a semiconductor process tool. One embodiment provides an exhaust pipe section and a pipe cleaning assembly connected between a semiconductor process tool and a factory exhaust. The pipe cleaning assembly includes a residue remover disposed in the exhaust pipe section. The residue remover is operable to move in the exhaust pipe section to dislodge accumulated materials from an inner surface of the exhaust pipe section.

Abstract: A system and method for controlling a locking device used in logistic management, the method including the step of receiving a command associated with an operation of a mechanical locking device; validating the received command and a protocol associated with the command; and manipulating the mechanical locking device operable in at least a locking state and an unlocking state; wherein the mechanical locking device is arranged to operate in response to a successful validation of the command associated with one of at least two protocols.

Abstract: A semiconductor device includes: M*1st conductors in a first layer of metallization (M*1st layer) and being aligned correspondingly along different corresponding ones of alpha tracks and representing corresponding inputs of a cell region in the semiconductor device; and M*2nd conductors in a second layer of metallization (M*2nd layer) aligned correspondingly along beta tracks, and the M*2nd conductors including at least one power grid (PG) segment and one or more of an output pin or a routing segment; and each of first and second ones of the input pins having a length sufficient to accommodate at most two access points; each of the access points of the first and second input pins being aligned to a corresponding different one of first to fourth beta tracks; and the PG segment being aligned with one of the first to fourth beta tracks.

Abstract: A dynamic calibration method for heterogeneous sensors includes: sensing dynamic objects by a first sensor to generate first sensing data; sensing the dynamic objects by a second sensor to generate second sensing data; performing feature matching between the first sensing data and the second sensing data to determine first valid data and second valid data, and identifying a tracked object from the dynamic objects based on the first valid data and the second valid data; performing feature comparison between the first valid data and the second valid data corresponding to the tracked object to calculate data errors between the first sensor and the second sensor; and calculating a calibration parameter based on the first valid data and the second valid data when the number of the data errors exceeds an error threshold, and adjusting the first sensing data and the second sensing data based on the calibration parameter.

Abstract: A light-emitting device includes a substrate including a top surface; a semiconductor stack including a first semiconductor layer, an active layer and a second semiconductor layer formed on the substrate, wherein a portion of the top surface is exposed; a distributed Bragg reflector (DBR) formed on the semiconductor stack and contacting the portion of the top surface of the substrate; a metal layer formed on the distributed Bragg reflector (DBR), contacting the portion of the top surface of the substrate and being insulated with the semiconductor stack; and an insulation layer formed on the metal layer and contacting the portion of the top surface of the substrate.

Abstract: Provided are cell niche engineering platform which represents a valuable in vitro tool for investigating physiological and pathological cellular activities, an all-in-one technology to engineer cell niche (particularly soluble cell niche factors) with retained bioactivities, a mask-free, non-contact, biocompatible and multiphoton-based microfabrication and micropatterning method for engineering a spatially and quantitatively controllable soluble proteins/bioactive factors and cell-cell adhesion molecules. An universal cell niche engineering platform is provided that contributes to reconstituting heterogeneous native soluble cell niche for signal transduction modeling and drug screening studies.

Abstract: An intraocular pressure inspection device includes an intraocular pressure detection unit, a high-precision positioning system and a wide-area positioning system, wherein according to the position of the intraocular pressure detection unit, a set of high-precision coordinates output by the high-precision positioning system and a set of wide-area coordinates output by the wide-area positioning system are integrated in appropriate weights to obtain a set of more precise integrated coordinate. The above-mentioned intraocular pressure inspection device can prevent the intraocular pressure detection unit from failing to operate once it is not in the working area of the high-precision positioning system.

Abstract: A semiconductor device includes a single diffusion break (SDB) structure dividing a fin-shaped structure into a first portion and a second portion, an isolation structure on the SDB structure, a first spacer adjacent to the isolation structure, a metal gate adjacent to the isolation structure, a shallow trench isolation (STI around the fin-shaped structure, and a second isolation structure on the STI. Preferably, a top surface of the first spacer is lower than a top surface of the isolation structure and a bottom surface of the first spacer is lower than a bottom surface of the metal gate.

Abstract: An auxiliary operation device for a droplet dispenser includes a droplet sensor, an imaging device and a processor. The droplet sensor has a detected area located between a droplet dispenser and a target area, wherein the droplet sensor detects a droplet output from the droplet dispenser, and outputs a corresponding droplet detection signal. The imaging device captures an image of the target area. The processor obtains a dripping time point at which the droplet passes through the detected area according to the droplet detection signal, and determines whether the target area is shielded within a first time range according to the image, so as to evaluate whether the droplet has successfully dropped into the target area. The above-mentioned auxiliary operating device of the droplet dispenser can objectively determine whether the droplets successfully drops into the target area, and improve the accuracy of judgment.

Abstract: A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.

Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.

Abstract: A method includes forming a photoresist layer over a wafer. The photoresist layer is exposed to a pattern of radiation using a photomask. The photoresist layer is developed after the photoresist layer is exposed to the pattern of radiation. The photomask includes a substrate and at least one opaque main feature. The substrate has a recessed region recessed from a first surface of the substrate and has a first width. The at least one opaque main feature protrudes from the first surface of the substrate and has a second width greater than the first width of the recessed region of the substrate. A height of the at least one opaque main feature is greater than a depth of the recess region of the substrate.

Abstract: A video processing apparatus implemented in a chip includes an on-chip prediction buffer and a processing circuit. The on-chip prediction buffer is shared by a plurality of coding tools for prediction, and is used to store reference data. The processing circuit supports the coding tools for prediction, reads a plurality of first reference data from the on-chip prediction buffer as input data of a first coding tool that is included in the coding tools and enabled by the processing circuit, and writes output data of the first coding tool enabled by the processing circuit into the on-chip prediction buffer as a plurality of second reference data.

Abstract: A motion vector refinement apparatus includes a first storage device, a motion vector predictor (MVP) derivation circuit, and a decoder side motion vector refinement (DMVR) circuit. The MVP derivation circuit derives a first MVP for a current block, stores the first MVP into the first storage device, and performs a new task. The DMVR circuit performs a DMVR operation to derive a first motion vector difference (MVD) for the first MVP. The MVP derivation circuit starts performing the new task before the DMVR circuit finishes deriving the first MVD for the first MVP.

Abstract: A prediction processing system includes a processing circuit and a reference data buffer. The processing circuit performs a first inter prediction operation upon a first prediction block in a frame to generate a first inter prediction result, and further performs a second inter prediction operation upon a second prediction block during a first period. The reference data buffer buffers a reference data derived from the first inter prediction result. The processing circuit further fetches the reference data from the reference data buffer, and performs a non-inter prediction operation according to at least the reference data during a second period, wherein the second period overlaps the first period.

Abstract: A video processing apparatus implemented in a chip includes an on-chip prediction buffer and a processing circuit. The on-chip prediction buffer is shared by a plurality of coding tools for prediction, and is used to store reference data. The processing circuit supports the coding tools for prediction, reads a plurality of first reference data from the on-chip prediction buffer as input data of a first coding tool that is included in the coding tools and enabled by the processing circuit, and writes output data of the first coding tool enabled by the processing circuit into the on-chip prediction buffer as a plurality of second reference data.

Abstract: A motion vector refinement apparatus includes a storage device, a reference block fetch circuit, and a processing circuit. The reference block fetch circuit fetches a forward reference block and a backward reference block according to at least specified motion vectors (MVs) of a current block, and stores the forward reference block and the backward reference block into the storage device. The processing circuit derives a first reference block from the forward reference block and a second reference block from the backward reference block, calculates at least one accumulated pixel difference (APD) value for at least one block pair each having a first block found in the first reference block and a second block found in the second reference block, and determines an offset setting for motion vector refinement of the specified MVs according to the at least one APD value.