Abstract: A core-shell particle includes a core having a chemical structure of Ti(1-x)M1xNb(2-y)M2yO(7-z)Qz, in which M1 is Li or Mg; M2 is Fe, Mn, V, Ni, Cr, or Cu; Q is F, Cl, Br, I, or S; x is 0 to 0.15; y is 0 to 0.15; and z is 0 to 2; and a shell layer wrapping at least a portion of the surface of the core, and the shell layer includes Cu, Nb, Ti, and O.

Abstract: An electric heating material processing device includes a material transporting module, a material feeding controller, a material discharging controller, a gas vent, and an electric heating thermal desorption device. The material transporting module has a material inlet and a material outlet. The material feeding controller is connected to the material inlet, and is configured to control a feeding quantity and a feeding speed of the materials. The material discharging controller is connected to the material outlet, and is configured to control a discharging quantity and a discharging speed of the materials. The gas vent is disposed on an end of the material transporting module. The electric heating thermal desorption device is disposed on an outer surface of the material transporting module, and is configured to perform a thermal desorption process on the materials. The electric heating thermal desorption device includes an electric heating acceptor and plural electric heaters.

Abstract: The present disclosure relates to a CMOS image sensor having a multiple deep trench isolation (MDTI) structure, and an associated method of formation. In some embodiments, the image sensor comprises a boundary deep trench isolation (BDTI) structure disposed at boundary regions of a pixel region surrounding a photodiode. The BDTI structure has a ring shape from a top view and two columns surrounding the photodiode with the first depth from a cross-sectional view. A multiple deep trench isolation (MDTI) structure is disposed at inner regions of the pixel region overlying the photodiode, the MDTI structure extending from the back-side of the substrate to a second depth within the substrate smaller than the first depth. The MDTI structure has three columns with the second depth between the two columns of the BDTI structure from the cross-sectional view. The MDTI structure is a continuous integral unit having a ring shape.

Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: A method of manufacturing an image sensor structure includes forming an isolation structure in a substrate to divide the substrate into a first region and a second region, forming a first light sensing region in the first region and a second light sensing region in the second region, forming a first gate structure over the first light sensing region and a second gate structure over the second light sensing region, forming gate spacers on sidewalls of the first and second gate structures, and depositing a blocking layer on sidewalls of the gate spacers. The blocking layer has an opening positioned between the first and second gate structures. A source/drain structure is formed directly under the opening in the blocking layer. The method also includes forming an interlayer dielectric layer over the first and second gate structures and the blocking layer.

Abstract: The present disclosure discloses an advanced mental fatigue early warning system, electronic device and storage medium, including a data acquisition module, a preprocessing module, an adjustment ability calculation module, a fatigue early warning module, a communication module and a storage module; the data acquisition module is configured for obtaining pupil diameter data; the preprocessing module is configured for preprocessing the pupil diameter data, removing invalid data, and performing linear interpolation; the adjustment ability calculation module is configured for performing calculation and correcting the preprocessed pupil diameter data; the fatigue early warning module is configured for performing mathematical modeling, establishing an advanced prediction model, and calculating a remaining time for an upcoming mental fatigue occurs and issuing an alarm; the communication module is configured for uploading mental fatigue adjustment abilities and alarm methods; the storage module is configured for arc

Abstract: An image-sensor device is provided. The image-sensor device includes a semiconductor substrate and a radiation-sensing region in the semiconductor substrate. The image-sensor device also includes a doped isolation region in the semiconductor substrate and a dielectric film extending into the doped isolation region from a surface of the semiconductor substrate. A portion of the doped isolation region is between the dielectric film and the radiation-sensing region.

Abstract: The present disclosure provides a method for aligning a master oscillator power amplifier (MOPA) system. The method includes ramping up a pumping power input into a laser amplifier chain of the MOPA system until the pumping power input reaches an operational pumping power input level; adjusting a seed laser power output of a seed laser of the MOPA system until the seed laser power output is at a first level below an operational seed laser power output level; and performing a first optical alignment process to the MOPA system while the pumping power input is at the operational pumping power input level, the seed laser power output is at the first level, and the MOPA system reaches a steady operational thermal state.

Abstract: A chamber adaptor and a manufacturing method thereof. The chamber adaptor includes: a housing provided with a gas inlet, a gas outlet, a chamber inlet, and a chamber outlet, where the gas inlet is configured to be removably connected to a main board device, the gas outlet is configured to be removably connected to a respiratory pathway, the chamber inlet is configured to be removably connected to an input end of a chamber for storing liquid and the chamber outlet is configured to be removably connected to an output end of the chamber, the chamber adaptor further includes a control circuit and at least one sensing apparatus, where the at least one sensing apparatus is arranged on one end of the control circuit closer to the gas outlet and extends into a gas output channel.

Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is ?13.

Abstract: A base station may include a base body, a landing pad, and a base station opening and closing structure. The base station opening and closing structure may include an open state and a closed state. In the open state, the base station opening and closing structure may provide a landing space for an aerial vehicle to land on the landing pad, and in the closed state, the base station opening and closing structure may provide an accommodating space to accommodate the aerial vehicle. During a process of the base station opening and closing structure transitioning from the open state to the closed state, the base station opening and closing structure may be configured to propel some blades of the aerial vehicle partially protruding out of the accommodating space to fold or retract so as to accommodate the aerial vehicle within the accommodating space.

Abstract: Embodiments of the present disclosure relate to a solution for translation verification and correction. According to the solution, a neural network is trained to determine an association degree among a group of words in a source or target language. The neural network can be used for translation verification and correction. According to the solution, a group of words in a source language and translations of the group of words in a target language are obtained. An association degree among the group of words and an association degree among the translations can be determined by using the trained neural network. Then, whether there is a wrong translation can be determined based on the association degrees. In some embodiments, corresponding methods, systems and computer program products are provided.

Abstract: Various embodiments provide a wellness tracking device with a base plate that may be utilized as a combination electrode by a variety of sensors. The base plate may be a multi-material electrode that includes a conductor and a transparent or semi-transparent material to enable optical sensing. In certain embodiments, the base plate supports a plurality of different sensors, which may selectively utilize the base plate as an electrode.

Abstract: A semiconductor structure including a substrate, a first dielectric layer disposed on the substrate, a second dielectric layer disposed on the first dielectric layer and in physical contact with the first dielectric layer, an opening on the substrate and having a lower portion through the first dielectric layer and an upper portion through the second dielectric layer, an conductive layer disposed on the second dielectric layer at two sides of the opening and in physical contact with the second dielectric layer, a contact structure disposed in the lower portion of the opening, and a passivation layer covering a top surface of the contact structure, a sidewall of the second dielectric layer, and a sidewall of the conductive layer.

Abstract: A real-time vector analysis method for detecting an optical signal with a bandwidth greater than 1 THz includes: mapping, by a time-lens focusing system, a spectrum of a signal under test to different temporal location information; obtaining, by fully broadening an ultrashort pulse by a dispersion, a time domain spectrum of the ultrashort pulse to form a chirped swept frequency source; inputting an out of the signal under test after passing through the time-lens and the chirped swept frequency source to a coherent receiver to realize an interference process and a conversion of an optical signal to an electrical signal, and recovering an intensity information and a phase information of frequency domain of the signal under test from the electrical signal by data acquisition and processing; then recovering a full-field information of time domain of the signal under test by a Fourier inverse transform.

Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

Abstract: According to an aspect, a computer-implemented method includes accessing a profile of a user that indicates a likelihood that the user will execute each of a plurality of types of processing when training a new AI model. A runtime matrix that includes identifiers of runtime environments is accessed. The matrix also includes, for each of the runtime environments, a frequency of use of the runtime environment to train previously trained AI models using each of the plurality of types of processing. One or more of the runtime environments is selected for output to the user based at least in part on the profile of the user and the runtime matrix. Identifiers of the selected one or more of the runtime environments are output to a user interface of the user along with a suggestion to use one of the selected one or more of the runtime environments.

Abstract: The disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a package structure, a circuit structure, a bonding structure and an external element. The circuit structure is disposed on the package structure and is electrically connected to the package structure. The circuit structure has a recess. The bonding structure includes a first bonding pad and a second bonding pad. The second bonding pad is disposed in the recess, and the second bonding pad is disposed on the first bonding pad. The bonding structure is disposed between the circuit structure and the external element. The external element is electrically connected to the circuit structure through the bonding structure. A width of the first bonding pad is smaller than a width of the second bonding pad.

Abstract: Manufacturing of a shoe or a portion of a shoe is enhanced by executing various shoe-manufacturing processes in an automated fashion. For example, information describing a shoe part may be determined, such as an identification, an orientation, a color, a surface topography, an alignment, a size, etc. Based on the information describing the shoe part, automated shoe-manufacturing apparatuses may be instructed to apply various shoe-manufacturing processes to the shoe part, such as a pickup and placement of the shoe part with a pickup tool.