Patents by Inventor Chi-Wei Liao
Chi-Wei Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136420Abstract: A thin film transistor includes a substrate, a semiconductor layer, a gate insulating layer, a gate, a source and a drain. The semiconductor layer is located above the substrate. The gate insulating layer is located above the semiconductor layer. The gate is located above the gate insulating layer and overlapping with the semiconductor layer. The gate includes a first portion, a second portion and a third portion. The first portion is extending along the surface of the gate insulating layer and directly in contact with the gate insulating layer. The second portion is separated from the gate insulating layer. Taking the surface of the gate insulating layer as a reference, the top surface of the second portion is higher than the top surface of the first portion. The third portion connects the first portion to the second portion. The source and the drain are electrically connected to the semiconductor layer.Type: ApplicationFiled: December 1, 2022Publication date: April 25, 2024Applicant: AUO CorporationInventors: Kuo-Jui Chang, Wen-Tai Chen, Chi-Sheng Chiang, Yu-Chuan Liao, Chien-Sen Weng, Ming-Wei Sun
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Patent number: 11946569Abstract: An actuating and sensing module is disclosed and includes a bottom plate, a gas pressure sensor, a thin gas transportation device and a cover plate. The bottom plate includes a pressure relief orifice, a discharging orifice and a communication orifice. The gas pressure sensor is disposed on the bottom plate and seals the communication orifice. The thin gas transportation device is disposed on the bottom plate and seals the pressure relief orifice and the discharging orifice. The cover plate is disposed on the bottom plate and covers the gas pressure sensor and the thin gas-transportation device. The cover plate includes an intake orifice. The thin gas transportation device is driven to inhale gas through the intake orifice, the gas is then discharged through the discharging orifice by the thin gas transportation device, and a pressure change of the gas is sensed by the gas pressure sensor.Type: GrantFiled: April 19, 2021Date of Patent: April 2, 2024Assignee: MICROJET TECHNOLOGY CO., LTD.Inventors: Hao-Jan Mou, Shih-Chang Chen, Jia-Yu Liao, Hung-Hsin Liao, Chung-Wei Kao, Chi-Feng Huang, Yung-Lung Han, Chang-Yen Tsai, Wei-Ming Lee
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Publication number: 20230396035Abstract: The laser device includes a substrate, a laser element disposed on the substrate for emitting a laser light ray, a light guide member disposed on the substrate, and a wavelength conversion layer. The light guide member is light-transmissible and thermally conductive, and has at least one reflection surface for reflecting the laser light ray from the laser element so as to change travelling direction of the laser light ray. The wavelength conversion layer converts wavelength of the laser light ray from the light guide member to result in a laser beam, and contacts the light guide member so that heat from the wavelength conversion layer is transferred to the substrate through the light guide member.Type: ApplicationFiled: August 11, 2023Publication date: December 7, 2023Inventors: Hui CHEN, Junpeng SHI, Xinglong LI, CHI-WEI LIAO, Weng-Tack WONG, CHIH-WEI CHAO, Chen-ke HSU
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Patent number: 11769985Abstract: The laser device includes a substrate, a laser element disposed on the substrate for emitting a laser light ray, a light guide member disposed on the substrate, and a wavelength conversion layer. The light guide member is light-transmissible and thermally conductive, and has at least one reflection surface for reflecting the laser light ray from the laser element so as to change travelling direction of the laser light ray. The wavelength conversion layer converts wavelength of the laser light ray from the light guide member to result in a laser beam, and contacts the light guide member so that heat from the wavelength conversion layer is transferred to the substrate through the light guide member.Type: GrantFiled: January 27, 2022Date of Patent: September 26, 2023Inventors: Hui Chen, Junpeng Shi, Xinglong Li, Chi-Wei Liao, Weng-Tack Wong, Chih-Wei Chao, Chen-ke Hsu
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Publication number: 20220199592Abstract: A light-emitting diode (LED) packaging module includes light-emitting units arranged in an array having m row(s) and n column(s), an encapsulating layer, and a wiring assembly, where m and n each independently represents a positive integer. Each of the light-emitting units includes LED chips each including a chip first surface, a chip second surface, a chip side surface, and an electrode assembly disposed on the chip second surface. The encapsulating layer covers the chip side surface and fills a space among the LED chips. The wiring assembly is disposed on the chip second surface and is electrically connected to the electrode assembly.Type: ApplicationFiled: March 10, 2022Publication date: June 23, 2022Inventors: SHUNING XIN, ZHEN-DUAN LIN, YANQIU LIAO, JUNPENG SHI, AIHUA CAO, CHANGCHIN YU, CHEN-KE HSU, CHI-WEI LIAO, CHIA-EN LEE, ZHENG WU
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Publication number: 20220199590Abstract: A light-emitting diode (LED) packaging module includes a plurality of LED chips spaced apart from one another, an encapsulating layer that fills in a space among the LED chips, a light-transmitting layer disposed on the encapsulating layer, a wiring assembly disposed on and electrically connected to the LED chips, and an insulation component that covers the encapsulating layer and the wiring assembly. Each of the LED chips includes an electrode assembly including first and second electrodes. The light-transmitting layer includes a light-transmitting layer that has a light transmittance greater than that of the encapsulating layer.Type: ApplicationFiled: March 10, 2022Publication date: June 23, 2022Inventors: SHUNING XIN, CHEN-KE HSU, AIHUA CAO, JUNPENG SHI, WENG-TACK WONG, YANQIU LIAO, ZHEN-DUAN LIN, CHANGCHIN YU, CHI-WEI LIAO, ZHENG WU, CHIA-EN LEE
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Publication number: 20220157793Abstract: A light-emitting device includes a number (N) of light-emitting units, a number (a) of first metal pads and a number (b) of second metal pads. Each of the light-emitting units includes a number (n) of light-emitting chips each having two distinct terminals, where N and n are integers and N>1, n>?3. The numbers (a) and (b) are integers and a>1, b>1, and the terminals of each of the light-emitting chips are electrically connected to a unique combination of one of the number (a) of first metal pads and a number (b) of second metal pads, respectively. The numbers (N), (n), (a) and (b) satisfy the equation: a*b=n*N.Type: ApplicationFiled: February 8, 2022Publication date: May 19, 2022Inventors: Yanqiu LIAO, Junpeng SHI, Shuning XIN, Chen-ke HSU, Zhen-duan LIN, Changchin YU, Aihua CAO, CHI-WEI LIAO, Zheng WU, Chia-en LEE
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Publication number: 20220149586Abstract: The laser device includes a substrate, a laser element disposed on the substrate for emitting a laser light ray, a light guide member disposed on the substrate, and a wavelength conversion layer. The light guide member is light-transmissible and thermally conductive, and has at least one reflection surface for reflecting the laser light ray from the laser element so as to change travelling direction of the laser light ray. The wavelength conversion layer converts wavelength of the laser light ray from the light guide member to result in a laser beam, and contacts the light guide member so that heat from the wavelength conversion layer is transferred to the substrate through the light guide member.Type: ApplicationFiled: January 27, 2022Publication date: May 12, 2022Inventors: Hui CHEN, Junpeng SHI, Xinglong LI, CHI-WEI LIAO, Weng-Tack WONG, CHIH-WEI CHAO, Chen-ke HSU
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Publication number: 20220139890Abstract: A light-emitting diode (LED) packaging module includes LED chips, a wiring layer, and an encapsulant component. Each of the LED chips includes a chip first surface, a chip second surface, a chip side surface, and an electrode unit. The wiring layer is disposed on the chip second surfaces of the LED chips, and contacts and is electrically connected to the electrode units. The encapsulant component includes a first encapsulating layer that covers the chip side surface, and a second encapsulating layer that covers the wiring layer. The LED chip has a thickness TA, the first encapsulating layer has a thickness TB, in which TB/TA?1.Type: ApplicationFiled: January 19, 2022Publication date: May 5, 2022Inventors: Zhen-duan LIN, Yanqiu LIAO, Shuning XIN, Weng-Tack WONG, Junpeng SHI, Aihua CAO, Changchin YU, Chi-Wei LIAO, Chen-ke HSU, Zheng WU, Chia-en LEE
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Patent number: 11271362Abstract: The laser device includes a substrate, a laser element disposed on the substrate for emitting a laser light ray, a light guide member disposed on the substrate, and a wavelength conversion layer. The light guide member is light-transmissible and thermally conductive, and has at least one reflection surface for reflecting the laser light ray from the laser element so as to change travelling direction of the laser light ray. The wavelength conversion layer converts wavelength of the laser light ray from the light guide member to result in a laser beam, and contacts the light guide member so that heat from the wavelength conversion layer is transferred to the substrate through the light guide member.Type: GrantFiled: March 26, 2020Date of Patent: March 8, 2022Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: Hui Chen, Junpeng Shi, Xinglong Li, Chi-Wei Liao, Weng-Tack Wong, Chih-Wei Chao, Chen-ke Hsu
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Publication number: 20210126423Abstract: A laser diode packaging structure includes a lead frame and a laser chip. The lead frame includes a frame body that has a front side and a back side opposite to the front side, a front circuit layer and a back circuit layer that are respectively disposed on the front and back sides, and an inner circuit layer that is disposed inside the frame body. The inner circuit layer includes first and second circuit connecting units, each of which has at least one first conductive via to electrically connect to the front circuit layer, and at least one second conductive via to electrically connect to the back circuit layer. The laser chip is mounted on and electrically connected to the front circuit layer, and is configured to emit a laser beam.Type: ApplicationFiled: December 31, 2020Publication date: April 29, 2021Inventors: Hui CHEN, Junpeng SHI, Chi-Wei LIAO, Weng-Tack WONG, Chen-ke HSU
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Patent number: 10833232Abstract: A light-emitting diode (LED) includes: a base having an upward-opening accommodating space; an LED chip disposed at the base, and arranged in the accommodating space; a packaging adhesive covering the LED chip; a lens disposed over the packaging adhesive, wherein: the lens has a first surface proximal to the packaging adhesive; the first surface has: a first subsurface at a center area with a substantially spherical or parabolic shape; a second subsurface with a substantially ring shape and surrounding the first subsurface and extending downward with an increasing diameter; a third subsurface with a substantially ring shape and surrounding the second subsurface, having a top ring edge and extending downward with a decreasing diameter; and a fourth subsurface with a substantially planar shape and surrounding the top ring edge of the third subsurface and connected with the base.Type: GrantFiled: September 30, 2018Date of Patent: November 10, 2020Assignee: XIAMENC SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: Xing-Long Li, Chi-Wei Liao, Chen-Ke Hsu, Weng Tack Wong
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Publication number: 20200227890Abstract: The laser device includes a substrate, a laser element disposed on the substrate for emitting a laser light ray, a light guide member disposed on the substrate, and a wavelength conversion layer. The light guide member is light-transmissible and thermally conductive, and has at least one reflection surface for reflecting the laser light ray from the laser element so as to change travelling direction of the laser light ray. The wavelength conversion layer converts wavelength of the laser light ray from the light guide member to result in a laser beam, and contacts the light guide member so that heat from the wavelength conversion layer is transferred to the substrate through the light guide member.Type: ApplicationFiled: March 26, 2020Publication date: July 16, 2020Inventors: Hui CHEN, Junpeng SHI, Xinglong LI, CHI-WEI LIAO, Weng-Tack WONG, CHIH-WEI CHAO, Chen-ke HSU
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Publication number: 20190051799Abstract: A light-emitting diode (LED) includes: a base having an upward-opening accommodating space; an LED chip disposed at the base, and arranged in the accommodating space; a packaging adhesive covering the LED chip; a lens disposed over the packaging adhesive, wherein: the lens has a first surface proximal to the packaging adhesive; the first surface has: a first subsurface at a center area with a substantially spherical or parabolic shape; a second subsurface with a substantially ring shape and surrounding the first subsurface and extending downward with an increasing diameter; a third subsurface with a substantially ring shape and surrounding the second subsurface, having a top ring edge and extending downward with a decreasing diameter; and a fourth subsurface with a substantially planar shape and surrounding the top ring edge of the third subsurface and connected with the base.Type: ApplicationFiled: September 30, 2018Publication date: February 14, 2019Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: Xing-Long LI, Chi-Wei LIAO, Chen-Ke HSU, Weng Tack WONG
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Patent number: 9048367Abstract: A multichip package structure for generating a symmetrical and uniform light-blending source includes a substrate unit, a light-emitting unit and a package unit. The substrate unit includes a substrate body and at least one bridging conductive layer disposed on the top surface of the substrate body. The light-emitting unit includes at least two first light-emitting elements diagonally disposed on the substrate body and electrically connected to the substrate body and at least two second light-emitting elements diagonally disposed on the substrate body and electrically connected to the substrate body. The package unit includes at least two first light-transmitting package bodies respectively covering the at least two first light-emitting elements and at least two second light-transmitting package bodies respectively covering the at least two second light-emitting elements.Type: GrantFiled: March 7, 2013Date of Patent: June 2, 2015Assignee: BRIGHTEK OPTOELECTRONIC CO., LTD.Inventors: Chien Chung Huang, Chih-Ming Wu, Yi Hsun Chen, Chi Wei Liao
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Patent number: 8828755Abstract: A fabrication method for a light-emitting element package, the method comprising: providing a high precision wafer level mold module, the high precision wafer level mold module comprising an upper mold and a bottom mold; mounting a substrate with a plurality of light-emitting elements between the upper mold and the bottom mold; filling package materials into the high precision wafer level mold module to obtain package members mounted on the light-emitting elements; and removing the high precision wafer level mold module.Type: GrantFiled: August 22, 2013Date of Patent: September 9, 2014Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Min-Tsun Hsieh, Wen-Liang Tseng, Lung-Hsin Chen, Chih-Yung Lin, Ching-Lien Yeh, Chi-Wei Liao
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Patent number: 8657469Abstract: A traffic light assembly includes at least one light module, at least one lens located in front of the at least one light module, a housing enclosing the at lest one light module and the at least one lens therein, and a foldable cover located in front of the at least one lens and connected to the housing. A cleaning device is located on an outer surface of the foldable cover to clean snow and dust accumulated on the outer surface of the foldable cover.Type: GrantFiled: May 9, 2013Date of Patent: February 25, 2014Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Chi-Wei Liao, Wen-Liang Tseng, Min-Tsun Hsieh, Chih-Yung Lin, Ching-Lien Yeh
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Publication number: 20140051193Abstract: A fabrication method for a light-emitting element package, the method comprising: providing a high precision wafer level mold module, the high precision wafer level mold module comprising an upper mold and a bottom mold; mounting a substrate with a plurality of light-emitting elements between the upper mold and the bottom mold; filling package materials into the high precision wafer level mold module to obtain package members mounted on the light-emitting elements; and removing the high precision wafer level mold module.Type: ApplicationFiled: August 22, 2013Publication date: February 20, 2014Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: MIN-TSUN HSIEH, WEN-LIANG TSENG, LUNG-HSIN CHEN, CHIH-YUNG LIN, CHING-LIEN YEH, CHI-WEI LIAO
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Publication number: 20130320361Abstract: A multichip package structure for generating a symmetrical and uniform light-blending source includes a substrate unit, a light-emitting unit and a package unit. The substrate unit includes a substrate body and at least one bridging conductive layer disposed on the top surface of the substrate body. The light-emitting unit includes at least two first light-emitting elements diagonally disposed on the substrate body and electrically connected to the substrate body and at least two second light-emitting elements diagonally disposed on the substrate body and electrically connected to the substrate body. The package unit includes at least two first light-transmitting package bodies respectively covering the at least two first light-emitting elements and at least two second light-transmitting package bodies respectively covering the at least two second light-emitting elements.Type: ApplicationFiled: March 7, 2013Publication date: December 5, 2013Applicant: BRIGHTEK OPTOELECTRONIC CO., LTD.Inventors: CHIEN CHUNG HUANG, CHIH-MING WU, YI HSUN CHEN, CHI WEI LIAO
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Patent number: 8541799Abstract: A light-emitting element package includes a package member for encapsulating a light-emitting element. A plurality of photonic crystal patterns is formed on the package member. A distribution density of the photonic crystal patterns corresponds to light distribution of the light-emitting element. Each photonic crystal pattern consists of a plurality of photonic crystals.Type: GrantFiled: May 23, 2011Date of Patent: September 24, 2013Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Min-Tsun Hsieh, Wen-Liang Tseng, Lung-Hsin Chen, Chih-Yung Lin, Ching-Lien Yeh, Chi-Wei Liao