Patents by Inventor Chi-Wei Liao
Chi-Wei Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20130242554Abstract: A traffic light assembly includes at least one light module, at least one lens located in front of the at least one light module, a housing enclosing the at lest one light module and the at least one lens therein, and a foldable cover located in front of the at least one lens and connected to the housing. A cleaning device is located on an outer surface of the foldable cover to clean snow and dust accumulated on the outer surface of the foldable cover.Type: ApplicationFiled: May 9, 2013Publication date: September 19, 2013Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: CHI-WEI LIAO, WEN-LIANG TSENG, MIN-TSUN HSIEH, CHIH-YUNG LIN, CHING-LIEN YEH
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Patent number: 8459838Abstract: A traffic light assembly includes at least one light module, at least one lens located in front of the at least one light module, a transparent housing located in front of the at least one lens, and a cleaning device. The cleaning device includes a wiper located on an outer surface of the transparent housing, and a driver which drives the wiper to brush the transparent housing.Type: GrantFiled: October 8, 2010Date of Patent: June 11, 2013Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Chi-Wei Liao, Wen-Liang Tseng, Min-Tsun Hsieh, Chih-Yung Lin, Ching-Lien Yeh
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Patent number: 8344406Abstract: In a light emitting device package and manufacturing method thereof, a multi-layer structure is allocated upon a substrate, of which at least two films with different refractive indices are alternately stacked together.Type: GrantFiled: December 17, 2010Date of Patent: January 1, 2013Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Min-Tsun Hsieh, Wen-Liang Tseng, Lung-Hsin Chen, Chih-Yung Lin, Ching-Lien Yeh, Chi-Wei Liao, Jian-Shihn Tsang
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Publication number: 20120043576Abstract: An LED package structure includes a substrate with a concave groove therein, an LED die received in the concave groove, a heat conductive pillar, two electrically conductive pillars, a heat conductive plate, and two contact pads. The heat conductive pillar extends through the substrate and thermally connects with the LED die and the heat conductive plate. The electrically conductive pillars extend through substrate and electrically connect with the LED die, respectively. The electrically conductive pillars and the heat conductive pillar are spaced from each other. The contact pads respectively and electrically connect with the electrically conductive pillars. The contact pads are spaced from each other.Type: ApplicationFiled: March 9, 2011Publication date: February 23, 2012Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: MIN-TSUN HSIEH, WEN-LIANG TSENG, LUNG-HSIN CHEN, CHIH-YUNG LIN, CHING-LIEN YEH, CHI-WEI LIAO, JIAN-SHIHN TSANG
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Publication number: 20120020089Abstract: An LED light bar includes an elongated circuit board, a first lighting module formed in the middle of the circuit board and two second light modules formed at two opposite ends of the circuit board. Each of first lighting module and the two second lighting module includes a plurality of LEDs arranged linearly on a surface of the circuit board. A density of the LEDs in the first lighting module is smaller than that in the second lighting modules.Type: ApplicationFiled: March 29, 2011Publication date: January 26, 2012Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: MIN-TSUN HSIEH, WEN-LIANG TSENG, LUNG-HSIN CHEN, CHIH-YUNG LIN, CHING-LIEN YEH, CHI-WEI LIAO
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Publication number: 20110297981Abstract: A fluorescent structure for a light-emitting package includes a first fluorescent layer and a second fluorescent layer covering the first fluorescent layer. The first fluorescent layer includes first fluorescent strips, and defines first transparent regions between the first fluorescent strips. The second fluorescent layer includes second fluorescent strips, and defines second transparent regions between the second fluorescent strips. A method for forming the fluorescent structure and a light-emitting diode package using the fluorescent structure are also provided.Type: ApplicationFiled: January 9, 2011Publication date: December 8, 2011Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: CHI-WEI LIAO, WEN-LIANG TSENG, CHIH-YUNG LIN, MIN-TSUN HSIEH, CHING-LIEN YEH
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Publication number: 20110291138Abstract: A light-emitting element package includes a package member for encapsulating a light-emitting element. A plurality of photonic crystal patterns is formed on the package member. A distribution density of the photonic crystal patterns corresponds to light distribution of the light-emitting element. Each photonic crystal pattern consists of a plurality of photonic crystals.Type: ApplicationFiled: May 23, 2011Publication date: December 1, 2011Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: MIN-TSUN HSIEH, WEN-LIANG TSENG, LUNG-HSIN CHEN, CHIH-YUNG LIN, CHING-LIEN YEH, CHI-WEI LIAO
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Publication number: 20110266570Abstract: In a light emitting device package and manufacturing method thereof, a multi-layer structure is allocated upon a substrate, of which at least two films with different refractive indices are alternately stacked together.Type: ApplicationFiled: December 17, 2010Publication date: November 3, 2011Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: MIN-TSUN HSIEH, WEN-LIANG TSENG, LUNG-HSIN CHEN, CHIH-YUNG LIN, CHING-LIEN YEH, CHI-WEI LIAO, JIAN-SHIHN TSANG
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Publication number: 20110266574Abstract: An LED package includes a substrate, an LED die, and an encapsulating layer. The LED die is arranged on the substrate. The encapsulating layer covers the LED die and at least a part of the substrate. The encapsulating layer includes a light dispersing element. A light scattering intensity of the light dispersing element is proportional to the light intensity of light generated by the LED die and illuminated at the encapsulating layer. A luminance at a center of the LED package is substantially identical to that at a circumference of the LED package.Type: ApplicationFiled: January 17, 2011Publication date: November 3, 2011Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: CHI-WEI LIAO, WEN-LIANG TSENG, CHIH-YUNG LIN, MIN-TSUN HSIEH, CHING-LIEN YEH
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Publication number: 20110261562Abstract: A traffic light assembly includes at least one light module, at least one lens located in front of the at least one light module, a transparent housing located in front of the at least one lens, and a cleaning device. The cleaning device includes a wiper located on an outer surface of the transparent housing, and a driver which drives the wiper to brush the transparent housing.Type: ApplicationFiled: October 8, 2010Publication date: October 27, 2011Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: CHI-WEI LIAO, WEN-LIANG TSENG, MIN-TSUN HSIEH, CHIH-YUNG LIN, CHING-LIEN YEH
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Publication number: 20090278152Abstract: A light emitting diode comprises a sheet-like package body, a barricade, a light emitting diode die, and fluorescent filler. The sheet-like package body has a die-bonding region. The barricade is a transparent wall that is disposed on the die-bonding region, and is integrated with the sheet-like package body or is adhered to sheet-like package body. The light emitting diode die is disposed on the region enclosed by the barricade, and the fluorescent filler is also filled into the region and surrounds the light emitting diode die. The light emitting diode and the method for packaging the light emitting diode can improve the uniformity and efficiency of the outputting light emitted from the light emitting diode, and the loss of the outputted light is reduced.Type: ApplicationFiled: May 5, 2009Publication date: November 12, 2009Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY INC.Inventors: CHIA CHEN CHANG, YI HSUN CHEN, CHI WEI LIAO
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Patent number: 6070360Abstract: A plant cultivating basin includes a basin containing a perforated conical cap located inside for holding soil and plants. The basin has a bottom opening and is placed upon a water container which has a side water funnel and water inlet to receive water. Fibrous roots of plants may pass through perforated cap to reach water container for water needed. The plant may grow without a lot of human care and attention.Type: GrantFiled: November 4, 1998Date of Patent: June 6, 2000Inventors: Chi-Wei Liao, Cheng-Fang Liao, Cheng-Chin Liao, Cheng-Te Liao
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Patent number: D640212Type: GrantFiled: September 28, 2010Date of Patent: June 21, 2011Assignee: Advanced Optoelectric Technology, Inc.Inventors: Chih-Yung Lin, Min-Tsun Hsieh, Ching-Lien Yeh, Chi-Wei Liao, Lung-Hsin Chen, Wen-Liang Tseng
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Patent number: D642545Type: GrantFiled: September 28, 2010Date of Patent: August 2, 2011Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Chih-Yung Lin, Min-Tsun Hsieh, Ching-Lien Yeh, Chi-Wei Liao, Lung-Hsin Chen, Wen-Liang Tseng
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Patent number: D642994Type: GrantFiled: September 28, 2010Date of Patent: August 9, 2011Assignee: Advanced Optoelectronic Technolgy, Inc.Inventors: Chih-Yung Lin, Min-Tsun Hsieh, Ching-Lien Yeh, Chi-Wei Liao, Lung-Hsin Chen, Wen-Liang Tseng
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Patent number: D642995Type: GrantFiled: September 28, 2010Date of Patent: August 9, 2011Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Chih-Yung Lin, Min-Tsun Hsieh, Ching-Lien Yeh, Chi-Wei Liao, Lung-Hsin Chen, Wen-Liang Tseng
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Patent number: D644189Type: GrantFiled: September 28, 2010Date of Patent: August 30, 2011Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Chih-Yung Lin, Min-Tsun Hsieh, Ching-Lien Yeh, Chi-Wei Liao, Lung-Hsin Chen, Wen-Liang Tseng