Abstract: A connection structure embedded substrate includes: a printed circuit board including a plurality of first insulating layers and a plurality of first wiring layers, respectively disposed on or between the plurality of first insulating layers; and a connection structure disposed in the printed circuit board and including a plurality of internal insulating layers and a plurality of internal wiring layers, respectively disposed on or between the plurality of internal insulating layers. Among the plurality of internal wiring layers, an internal wiring layer disposed in one surface of the connection structure is in contact with one surface of a first insulating layer, among the plurality of first insulating layers.

Abstract: A connection structure embedded substrate includes: a printed circuit board including a plurality of first insulating layers and a plurality of first wiring layers, respectively disposed on or between the plurality of first insulating layers; and a connection structure disposed in the printed circuit board and including a plurality of internal insulating layers and a plurality of internal wiring layers, respectively disposed on or between the plurality of internal insulating layers. Among the plurality of internal wiring layers, an internal wiring layer disposed in one surface of the connection structure is in contact with one surface of a first insulating layer, among the plurality of first insulating layers.

Abstract: A printed circuit board includes: a first insulating layer; a first cavity disposed in one surface of the first insulating layer; a plurality of protrusion portions spaced apart from each other in the first cavity; and a first wiring layer embedded in the one surface of the first insulating layer.

Abstract: A printed circuit board includes: a wiring substrate including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers; and a bridge embedded in the wiring substrate and having a plurality of connection pads thereon. An uppermost wiring layer of the plurality of wiring layers includes a plurality of bump pads connected to the plurality of connection pads, and a pitch between at least two adjacent connection pads of the plurality of connection pads is larger than a pitch between at least two adjacent ones of the plurality of bump pads.

Abstract: A printed circuit board includes: an insulating member; a first wiring layer disposed in the insulating member, and including first and second pattern layers spaced apart from each other based on a thickness direction of the printed circuit board; and a second wiring layer disposed in the insulating member, and spaced apart from the first pattern layer over the first pattern layer based on the thickness direction. Based on the thickness direction, an insulation distance between the first pattern layer and the second pattern layer is smaller than an insulation distance between the first pattern layer and the second wiring layer, and each of the first and second pattern layers is thinner than the second wiring layer.

Abstract: A printed circuit board includes: an insulating member; a first bump disposed on the insulating member; a second bump disposed adjacently to but spaced apart from the first bump on the insulating member; a first insulating wall covering at least a portion of the first bump; and a second insulating wall covering at least a portion of the second bump and disposed adjacently to but spaced apart from the first insulating wall.

Abstract: The present disclosure relates to a printed circuit board and a method of manufacturing the same. The printed circuit board includes: an insulating layer; a plurality of pads disposed on the insulating layer; and a plurality of insulating walls that are disposed on the insulating layer and cover side surfaces of the plurality of pads, respectively, but are not disposed on upper surfaces of the plurality of pads. The plurality of insulating walls are disposed to be spaced apart from each other on the first insulating layer.

Abstract: A printed circuit board includes: an insulating layer; a plurality of pads disposed on the insulating layer; and a plurality of insulating walls disposed on the insulating layer, and at least partially covering side surfaces of the plurality of pads, respectively, while being free from surfaces of the plurality of pads, respectively. The plurality of insulating walls are disposed to be spaced apart from each other on the insulating layer.

Abstract: A printed circuit board includes: a first insulating layer having at least one recess portion in one surface thereof; a first wiring layer embedded in one surface of the first insulating layer; and a first via layer including a first via penetrating through at least a portion of the first insulating layer, one surface of the first via being exposed externally through the recess portion.

Abstract: A printed circuit board includes a first board including a plurality of first insulating layers and a plurality of first wiring layers disposed between the plurality of first insulating layers, respectively; and a second board disposed on one surface of the first board and including a plurality of second insulating layers and a plurality of second wiring layers disposed on or between the plurality of second insulating layers, respectively. At least one of the plurality of first insulating layers has a thickness less than a thickness of at least one of the plurality of second insulating layers. The first board further includes a through-via penetrating each of the plurality of first insulating layers and connected to one of the plurality of second wiring layers.

Abstract: A connection structure embedded substrate includes: a printed circuit board including a plurality of first insulating layers and a plurality of first wiring layers, respectively disposed on or between the plurality of first insulating layers; and a connection structure disposed in the printed circuit board and including a plurality of internal insulating layers and a plurality of internal wiring layers, respectively disposed on or between the plurality of internal insulating layers. Among the plurality of internal wiring layers, an internal wiring layer disposed in one surface of the connection structure is in contact with one surface of a first insulating layer, among the plurality of first insulating layers.

Abstract: A printed circuit board includes a first insulating layer, a first conductor-pattern layer disposed on one surface of the first insulating layer, a first recess formed in the other surface of the first insulating layer opposing one surface of the first insulating layer, a second conductor-pattern layer disposed in the first recess, and a first metal post penetrating the first insulating layer, connecting the first and second conductor-pattern layers to each other, and having one end exposed to a bottom surface of the first recess, wherein the second conductor-pattern layer includes a seed layer disposed on at least a portion of each of a surface of one end of the first metal post exposed to the bottom surface of the first recess and an internal surface of the first recess including the bottom surface of the first recess, and a plating layer disposed on the seed layer to fill at least a portion of the first recess.

Abstract: A printed circuit board includes: a first insulating layer; a first cavity disposed in one surface of the first insulating layer; a plurality of protrusion portions spaced apart from each other in the first cavity; and a first wiring layer embedded in the one surface of the first insulating layer.

Abstract: A printed circuit board includes a printed circuit board includes a substrate portion having a recess portion and including a first circuit layer, abridge disposed in the recess portion and including an insulating layer and a bridge circuit layer, an insulating material disposed in at least a portion of the recess portion and covering at least a portion of the bridge, a second circuit layer disposed on the insulating material, and a first via penetrating through the insulating material and a portion of the bridge and connecting the second circuit layer and the bridge circuit layer to each other.

Abstract: A printed circuit board includes: an insulation material including a cavity formed therein; a first electronic element disposed in the cavity and including a groove; and a second electronic element disposed in the groove of the first electronic element.

Abstract: A printed circuit board includes: an insulation material including a cavity formed therein; a first electronic element disposed in the cavity and including a groove; and a second electronic element disposed in the groove of the first electronic element.

Abstract: A conductive ball mounting device is provided. The conductive ball mounting device includes: a mask having a thickness equal to or larger than a diameter of a conductive ball and having an opening formed therein, wherein the conductive ball is absorbed and desorbed into and from the opening; a frame having a vacuum hole formed therein and formed to enclose sides and an upper portion of the mask; and a porous member formed between the frame and the upper portion of the mask.

Abstract: Methods of forming microelectronic device structures are described. Those methods may include forming at least one opening through a build up structure and a photo sensitive material disposed on the build up structure, wherein the build up structure comprises a portion of a package substrate, filling the at least one opening with a metal containing nanopaste, and sintering the metal containing nanopaste to form a bulk property metal structure in the at least one opening.

Abstract: Disclosed herein is a conductive ball mounting device including: a mask having a thickness equal to or larger than a diameter of a conductive ball and having an opening formed therein, wherein the conductive ball is absorbed and desorbed into and from the opening; a frame having a vacuum hole formed therein and formed to enclose sides and an upper portion of the mask; and a porous member formed between the frame and the upper portion of the mask.

Abstract: The present invention relates to an electrolytic cell for an FT-CDI including: an injection port into which a bead and a concentrate are injected and a discharge port through which the bead and the concentrate are discharged to circulate the bead, thereby preventing the concentration of the bead from being degraded and disposes a mesh at a place in which the concentrate and the bead are received to disperse the concentrate and the bead well.