Patents by Inventor Chia Lun Chen
Chia Lun Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240153842Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.Type: ApplicationFiled: January 4, 2024Publication date: May 9, 2024Inventors: Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen, Chia-Lun Chang, Chih-Wei Lin, Hsiu-Jen Lin, Ching-Hua Hsieh, Chung-Shi Liu
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Patent number: 11958200Abstract: An automatic robotic arm system and a coordinating method for robotic arm and computer vision thereof are disclosed. A beam-splitting mirror splits an incident light into a visible light and a ranging light and respectively guides to an image capturing device and an optical ranging device arranged in the different reference axes. In a calibration mode, a transformation relation is computed based on a plurality of the calibration postures and corresponding calibration images. In an operation mode, a mechanical space coordinate is determined based on an operation image and the transformation relation, and the robotic arm is controlled to move based on the mechanical space coordinate.Type: GrantFiled: December 28, 2021Date of Patent: April 16, 2024Assignee: DELTA ELECTRONICS, INC.Inventors: Hung-Hsin Chen, Chia-Jun Yu, Qi-Ming Huang, Chin-Lun Chang, Keng-Ning Chang
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Publication number: 20240087878Abstract: A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base, a spindle extending through the spin base, and a clamping member covering the spin base. The spindle includes a mounting part and a supporting part disposed on the mounting part. The mounting part includes an inner projection, the supporting part includes a conical projection, and the conical projection is surrounded by the inner projection. The semiconductor wafer cleaning apparatus further includes a first sealing ring disposed between the spin base and the mounting part.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Inventors: Chia-Lun CHEN, Po-Jen SHIH, Ming-Sung HUNG, Wen-Hung HSU
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Publication number: 20240086633Abstract: A method for generating and outputting a message is implemented using an electronic device the stores a computer program product and a text database. The text database includes a main message template, a template text that includes a placeholder, and a word group that includes a plurality of preset words for replacing the placeholder. The method includes: in response to receipt of a command for execution of the computer program product, displaying an editing interface including the main message template; in response to receipt of user operation of a selection of the main message template, displaying the template text; in response to receipt of user operation of a selection of one of the preset words via the user interface, generating an edited text by replacing the placeholder with the one of the preset words in the template text; and outputting the edited text as a message.Type: ApplicationFiled: April 25, 2023Publication date: March 14, 2024Inventors: Yi-Ru CHIU, Ting-Yi LI, Hong-Xun WANG, Jin-Lin CHEN, Chih-Hsuan YEH, Chia-Chi YIN, Wei-Ting LI, Po-Lun CHANG
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Publication number: 20240071953Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.Type: ApplicationFiled: November 6, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
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Publication number: 20240071954Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.Type: ApplicationFiled: November 9, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
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Publication number: 20240045268Abstract: An electronic device includes a substrate, a sidewall, a plurality of light emitting elements and an optical element. The sidewall is connected to the substrate. The plurality of light emitting elements are disposed on the substrate. The optical element covers at least two of the plurality of light emitting elements, wherein, in a cross-sectional view of the electronic device, a portion of the optical element is disposed between two adjacent ones of the plurality of light emitting elements, and a height of the sidewall is greater than a thickness of the optical element.Type: ApplicationFiled: October 20, 2023Publication date: February 8, 2024Inventors: Chin-Lung TING, Ming-Hui CHU, Fang-Ho LIN, Chia-Lun CHEN, Yen-Liang CHEN
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Patent number: 11854793Abstract: A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base, a spindle, a clamping member, and a first sealing ring. The spin base has a through hole and a flange. The spindle extends through the through hole. The clamping member covers the through hole and is connected to the spindle. The clamping member includes a mounting part. The first sealing ring is disposed under the clamping member. A top surface of the first sealing ring and a top surface of the flange are in contact with a bottom surface of the mounting part.Type: GrantFiled: April 16, 2021Date of Patent: December 26, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chia-Lun Chen, Po-Jen Shih, Ming-Sung Hung, Wen-Hung Hsu
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Publication number: 20230411190Abstract: The present disclosure provides a system and method for determining condition of wafers during processing of the wafers. The system and method include detecting vibrations of a wafer transfer robot, generating signals based upon the vibrations, and processing the signals for determining a condition of the wafers held by the wafer transfer robot.Type: ApplicationFiled: August 4, 2023Publication date: December 21, 2023Inventors: Ming-Sung HUNG, Chia-Lun CHEN, Cheng-Hao KUO
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Patent number: 11835820Abstract: A display device including a backlight module is provided. The backlight module includes: a substrate, a backlight cavity, a plurality of light emitting elements, and an optical adjustment layer. The backlight cavity is located on the substrate. The plurality of light emitting elements is disposed in the backlight cavity. The optical adjustment layer covers the plurality of light emitting elements and fills the remaining space of the backlight cavity. The optical adjustment layer has a refractive index n greater than the refractive index no of the air.Type: GrantFiled: September 20, 2022Date of Patent: December 5, 2023Assignee: INNOLUX CORPORATIONInventors: Chin-Lung Ting, Ming-Hui Chu, Fang-Ho Lin, Chia-Lun Chen, Yen-Liang Chen
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Patent number: 11817336Abstract: The present disclosure provides a system and method for determining condition of wafers during processing of the wafers. The system and method include detecting vibrations of a wafer transfer robot, generating signals based upon the vibrations, and processing the signals for determining a condition of the wafers held by the wafer transfer robot.Type: GrantFiled: December 4, 2020Date of Patent: November 14, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ming-Sung Hung, Chia-Lun Chen, Cheng-Hao Kuo
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Patent number: 11742335Abstract: An electronic device is provided. The electronic device includes a driving substrate, a plurality of light-emitting units, and a protective layer. The light-emitting units are electrically connected to the driving substrate. The protective layer covers the light-emitting units, and the protective layer has a Young's modulus less than or equal to 20 MPa.Type: GrantFiled: December 14, 2020Date of Patent: August 29, 2023Assignee: INNOLUX CORPORATIONInventors: Shih-Chang Huang, Chia-Lun Chen, Ming-Hui Chu, Chin-Lung Ting, Chien-Tzu Chu, Hui-Chi Wang
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Patent number: 11687102Abstract: Semiconductor processing systems and methods are provided in which an amount or concentration of a chemical in a chemical mixture contained in a tank is automatically controlled based on a sensed properties of the chemical mixture. In some embodiments, a semiconductor processing system includes a processing tank that is configured to contain a chemical mixture. A chemical sensor is configured to sense one or more properties of the chemical mixture. The system further includes an electrically controllable valve that is configured to adjust an amount of the first chemical in the chemical mixture based on the sensed one or more properties of the chemical mixture.Type: GrantFiled: August 1, 2022Date of Patent: June 27, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chia-Lun Chen, Cheng-Hao Kuo, Chung-Hao Hu
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Patent number: 11626300Abstract: An apparatus includes a substrate stage configured to secure a substrate thereon and a motion mechanism configured to rotate the substrate stage. The substrate stage includes a plurality of holding pins for holding an edge of the substrate. Rotating the substrate stage causes a chemical solution dispensed on an upper surface of the substrate to spread outwardly toward the edge of the substrate. At least one of the plurality of holding pins includes at least one opening or at least one tapered side surface, or both, for guiding the chemical solution to flow off the substrate.Type: GrantFiled: June 30, 2022Date of Patent: April 11, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chia-Lun Chen, Ming-Sung Hung, Po-Jen Shih, Wen-Hung Hsu
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Patent number: 11586230Abstract: Semiconductor processing systems and methods are provided in which an amount or concentration of a chemical in a chemical mixture contained in a tank is automatically controlled based on a sensed properties of the chemical mixture. In some embodiments, a semiconductor processing system includes a processing tank that is configured to contain a chemical mixture. A chemical sensor is configured to sense one or more properties of the chemical mixture. The system further includes an electrically controllable valve that is configured to adjust an amount of the first chemical in the chemical mixture based on the sensed one or more properties of the chemical mixture.Type: GrantFiled: July 17, 2020Date of Patent: February 21, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Cheng-Hao Kuo, Chia-Lun Chen, Chung-Hao Hu
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Publication number: 20230014539Abstract: A display device including a backlight module is provided. The backlight module includes: a substrate, a backlight cavity, a plurality of light emitting elements, and an optical adjustment layer. The backlight cavity is located on the substrate. The plurality of light emitting elements is disposed in the backlight cavity. The optical adjustment layer covers the plurality of light emitting elements and fills the remaining space of the backlight cavity. The optical adjustment layer has a refractive index n greater than the refractive index no of the air.Type: ApplicationFiled: September 20, 2022Publication date: January 19, 2023Inventors: Chin-Lung TING, Ming-Hui CHU, Fang-Ho LIN, Chia-Lun CHEN, Yen-Liang CHEN
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Publication number: 20220365546Abstract: Semiconductor processing systems and methods are provided in which an amount or concentration of a chemical in a chemical mixture contained in a tank is automatically controlled based on a sensed properties of the chemical mixture. In some embodiments, a semiconductor processing system includes a processing tank that is configured to contain a chemical mixture. A chemical sensor is configured to sense one or more properties of the chemical mixture. The system further includes an electrically controllable valve that is configured to adjust an amount of the first chemical in the chemical mixture based on the sensed one or more properties of the chemical mixture.Type: ApplicationFiled: August 1, 2022Publication date: November 17, 2022Inventors: Chia-Lun CHEN, Cheng-Hao KUO, Chung-Hao HU
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Patent number: 11487157Abstract: A display device including a backlight module is provided. The backlight module includes: a substrate, a backlight cavity, a plurality of light emitting elements, and an optical adjustment layer. The backlight cavity is located on the substrate. The plurality of light emitting elements is disposed in the backlight cavity. The optical adjustment layer covers the plurality of light emitting elements and fills the remaining space of the backlight cavity. The optical adjustment layer has a refractive index n greater than the refractive index n0 of the air.Type: GrantFiled: June 23, 2021Date of Patent: November 1, 2022Assignee: INNOLUX CORPORATIONInventors: Chin-Lung Ting, Ming-Hui Chu, Fang-Ho Lin, Chia-Lun Chen, Yen-Liang Chen
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Publication number: 20220336236Abstract: An apparatus includes a substrate stage configured to secure a substrate thereon and a motion mechanism configured to rotate the substrate stage. The substrate stage includes a plurality of holding pins for holding an edge of the substrate. Rotating the substrate stage causes a chemical solution dispensed on an upper surface of the substrate to spread outwardly toward the edge of the substrate. At least one of the plurality of holding pins includes at least one opening or at least one tapered side surface, or both, for guiding the chemical solution to flow off the substrate.Type: ApplicationFiled: June 30, 2022Publication date: October 20, 2022Inventors: Chia-Lun Chen, Ming-Sung Hung, Po-Jen Shih, Wen-Hung Hsu
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Publication number: 20220293674Abstract: A light emitting module and a display device including the same are disclosed. The light emitting module including: a substrate; a plurality of light emitting units disposed on the substrate; a plurality of encapsulating elements covering the plurality of light emitting units; and a reflective layer surrounding each of the plurality of light emitting units.Type: ApplicationFiled: February 10, 2022Publication date: September 15, 2022Inventors: Li-Wei SUNG, Hsuan-Yu YU, Chien-Tzu CHU, Chueh-Yuan NIEN, Chia-Lun CHEN, Kuo-Tsun HUANG