Patents by Inventor Chia Shen
Chia Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11002927Abstract: In an embodiment, a package structure including an electro-optical circuit board, a fanout package disposed over the electro-optical circuit board is provided. The electro-optical circuit board includes an optical waveguide. The fanout package includes a first optical input/output portion, a second optical input/output portion and a plurality of electrical input/output terminals electrically connected to the electro-optical circuit board. The first optical input/output portion is optically coupled to the second optical input/output portion through the optical waveguide of the electro-optical circuit board.Type: GrantFiled: February 21, 2019Date of Patent: May 11, 2021Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Lun Chang, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hsuan-Ting Kuo, Chia-Shen Cheng, Chih-Chiang Tsao
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Patent number: 10978370Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.Type: GrantFiled: September 13, 2019Date of Patent: April 13, 2021Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen, Chia-Lun Chang, Chih-Wei Lin, Hsiu-Jen Lin, Ching-Hua Hsieh, Chung-Shi Liu
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Patent number: 10921933Abstract: A touch detection apparatus and a touch detection method are provided. The touch detection apparatus includes a sensing element and a detection circuit. The touch detection method includes the following steps. At least one touch sensing value is provided by the sensing element. Whether a first object touches the sensing element is determined by the detection circuit according to the at least one touch sensing value and a first reference value in a first stage. If the first object touches the sensing element, a second reference value is calculated by the detection circuit according to the at least one touch sensing value and the detection circuit enters a second stage. Whether a second object touches the first object is determined by the detection circuit according to the at least one touch sensing value and the second reference value in the second stage.Type: GrantFiled: October 7, 2019Date of Patent: February 16, 2021Assignee: ITE Tech. Inc.Inventors: Chih-Hsuan Lo, Chia-Shen Hsu
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Publication number: 20210044886Abstract: An earphone has a housing, a sound output hole, a first touch sensor, a second touch, a third touch sensor, and a microprocessor. The microprocessor is coupled to the first touch sensor, the second touch sensor and the third touch sensor for determining whether the earphone is worn on an ear according to the sensing result of the first touch sensor, determining whether the earphone is held in hand according to the sensing result of the second touch sensor, and providing a corresponding control function according to the sensing result of the third touch sensor.Type: ApplicationFiled: August 5, 2020Publication date: February 11, 2021Inventors: Chia-Shen Hsu, Ping-Yuan Wang
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Patent number: 10910469Abstract: A semiconductor device includes a substrate and a conducting structure. The substrate has a first conductivity type and includes a first isolation region, a first implant region, and a second implant region. The first isolation region is disposed along the circumference of the substrate. The first implant region has the first conductivity type, and the second implant region has a second conductivity type that is the opposite of the first conductivity type. The conducting structure is disposed on the substrate, and at least a portion of the conducting structure is located on the first isolation region.Type: GrantFiled: June 7, 2019Date of Patent: February 2, 2021Assignee: Vanguard International Semiconductor CorporationInventors: Wen-Hua Wen, Chia-Shen Liu, Wen-Chung Chen, Chrong-Jung Lin
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Patent number: 10903090Abstract: A method of forming a package structure includes the following processes. A die is attached to a polymer layer. An encapsulant is formed over the polymer layer to encapsulate sidewalls of the die. A RDL structure is formed on the encapsulant and the die. A conductive terminal is electrically connected to the die through the RDL structure. A light transmitting film is formed on the polymer layer. An alignment process is performed, and the alignment process uses an optical equipment to see through the light transmitting film to capture the alignment information included in the polymer layer. A singulating process is performed to singulate the package structure according to the alignment information.Type: GrantFiled: May 16, 2019Date of Patent: January 26, 2021Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng-Ting Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Wei-Yu Chen, Chia-Lun Chang, Chia-Shen Cheng, Cheng-Shiuan Wong
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Publication number: 20210019013Abstract: A touch detection apparatus and a touch detection method are provided. The touch detection apparatus includes a sensing element and a detection circuit. The touch detection method includes the following steps. At least one touch sensing value is provided by the sensing element. Whether a first object touches the sensing element is determined by the detection circuit according to the at least one touch sensing value and a first reference value in a first stage. If the first object touches the sensing element, a second reference value is calculated by the detection circuit according to the at least one touch sensing value and the detection circuit enters a second stage. Whether a second object touches the first object is determined by the detection circuit according to the at least one touch sensing value and the second reference value in the second stage.Type: ApplicationFiled: October 7, 2019Publication date: January 21, 2021Applicant: ITE Tech. Inc.Inventors: Chih-Hsuan Lo, Chia-Shen Hsu
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Publication number: 20210013173Abstract: A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.Type: ApplicationFiled: September 28, 2020Publication date: January 14, 2021Inventors: Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang, Yu-Peng Tsai, Hsiu-Jen Lin, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu
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Patent number: 10868353Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a chip package, an antenna pattern, and an insulating layer. The chip package includes a semiconductor die and an insulating encapsulation enclosing the semiconductor die. The antenna pattern is electrically coupled to the chip package, where a material of the antenna pattern comprises a conductive powder having fused metal particles. The insulating layer disposed between the chip package and the antenna pattern, where the antenna pattern includes a first surface in contact with the insulating layer, and a second surface opposite to the first surface, and a surface roughness of the second surface is greater than a surface roughness of the first surface.Type: GrantFiled: April 18, 2019Date of Patent: December 15, 2020Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Lin Lu, Hsiu-Jen Lin, Hsuan-Ting Kuo, Kai-Chiang Wu, Ming-Che Ho, Wei-Yu Chen, Yu-Peng Tsai, Chia-Lun Chang, Chia-Shen Cheng, Chih-Chiang Tsao, Tzu-Chun Tang, Ching-Hua Hsieh, Tuan-Yu Hung, Cheng-Shiuan Wong
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Publication number: 20200388676Abstract: A semiconductor device includes a substrate and a conducting structure. The substrate has a first conductivity type and includes a first isolation region, a first implant region, and a second implant region. The first isolation region is disposed along the circumference of the substrate. The first implant region has the first conductivity type, and the second implant region has a second conductivity type that is the opposite of the first conductivity type. The conducting structure is disposed on the substrate, and at least a portion of the conducting structure is located on the first isolation region.Type: ApplicationFiled: June 7, 2019Publication date: December 10, 2020Applicant: Vanguard International Semiconductor CorporationInventors: Wen-Hua WEN, Chia-Shen LIU, Wen-Chung CHEN, Chrong-Jung LIN
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Publication number: 20200365420Abstract: A method of forming a package structure includes the following processes. A die is attached to a polymer layer. An encapsulant is formed over the polymer layer to encapsulate sidewalls of the die. A RDL structure is formed on the encapsulant and the die. A conductive terminal is electrically connected to the die through the RDL structure. A light transmitting film is formed on the polymer layer. An alignment process is performed, and the alignment process uses an optical equipment to see through the light transmitting film to capture the alignment information included in the polymer layer. A singulating process is performed to singulate the package structure according to the alignment information.Type: ApplicationFiled: May 16, 2019Publication date: November 19, 2020Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Cheng-Ting Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Wei-Yu Chen, Chia-Lun Chang, Chia-Shen Cheng, Cheng-Shiuan Wong
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Patent number: 10790261Abstract: A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.Type: GrantFiled: September 5, 2018Date of Patent: September 29, 2020Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang, Yu-Peng Tsai, Hsiu-Jen Lin, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu
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Publication number: 20200271873Abstract: In an embodiment, a package structure including an electro-optical circuit board, a fanout package disposed over the electro-optical circuit board is provided. The electro-optical circuit board includes an optical waveguide. The fanout package includes a first optical input/output portion, a second optical input/output portion and a plurality of electrical input/output terminals electrically connected to the electro-optical circuit board. The first optical input/output portion is optically coupled to the second optical input/output portion through the optical waveguide of the electro-optical circuit board.Type: ApplicationFiled: February 21, 2019Publication date: August 27, 2020Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chia-Lun Chang, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hsuan-Ting Kuo, Chia-Shen Cheng, Chih-Chiang Tsao
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Publication number: 20200106156Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a chip package, an antenna pattern, and an insulating layer. The chip package includes a semiconductor die and an insulating encapsulation enclosing the semiconductor die. The antenna pattern is electrically coupled to the chip package, where a material of the antenna pattern comprises a conductive powder having fused metal particles. The insulating layer disposed between the chip package and the antenna pattern, where the antenna pattern includes a first surface in contact with the insulating layer, and a second surface opposite to the first surface, and a surface roughness of the second surface is greater than a surface roughness of the first surface.Type: ApplicationFiled: April 18, 2019Publication date: April 2, 2020Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chun-Lin Lu, Hsiu-Jen Lin, Hsuan-Ting Kuo, Kai-Chiang Wu, Ming-Che Ho, Wei-Yu Chen, Yu-Peng Tsai, Chia-Lun Chang, Chia-Shen Cheng, Chih-Chiang Tsao, Tzu-Chun Tang, Ching-Hua Hsieh, Tuan-Yu Hung, Cheng-Shiuan Wong
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Patent number: 10604700Abstract: A method for manufacturing a nitride phosphor is provided. The method comprises providing a nitride phosphor formulation and subjecting the nitride phosphor formulation to a hot isostatic pressing step. The nitride phosphor formulation comprises a flux and a phosphor precursor, wherein the flux is a barium-containing nitride. The phosphor precursor comprises two or more metal nitrides, and wherein a plurality of metal elements are present in the nitride phosphor and the two or more metal nitrides contain the plurality of metal elements.Type: GrantFiled: November 1, 2017Date of Patent: March 31, 2020Assignee: BELL CERAMICS CO., LTD.Inventors: Chang-Lung Chiang, Mu-Huai Fang, Chia-Shen Hsu, Ru-Shi Liu, Chaochin Su, Te-Hsin Chiang
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Patent number: 10600556Abstract: An inductor structure formed on a substrate and extending in a quadrant comprising a first domain, a second domain, a third domain and a fourth domain is provided. The inductor structure comprises an input conducting wire, an output conducting wire and a conducting wire. The conducting wire is coupled between the input conducting wire and the output conducting wire. A first portion of the conducting wire is extended from a start terminal, to the second domain, to the fourth domain, to a stop terminal. A second portion of the conducting wire is extended from the start terminal, to the third domain, to the first domain, to the stop terminal.Type: GrantFiled: January 4, 2018Date of Patent: March 24, 2020Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATIONInventor: Chia-Shen Liu
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Patent number: 10566261Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.Type: GrantFiled: March 29, 2018Date of Patent: February 18, 2020Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen, Chia-Lun Chang, Chih-Wei Lin, Hsiu-Jen Lin, Ching-Hua Hsieh, Chung-Shi Liu
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Publication number: 20200006191Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.Type: ApplicationFiled: September 13, 2019Publication date: January 2, 2020Inventors: Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen, Chia-Lun Chang, Chih-Wei Lin, Hsiu-Jen Lin, Ching-Hua Hsieh, Chung-Shi Liu
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Patent number: 10504815Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.Type: GrantFiled: March 29, 2018Date of Patent: December 10, 2019Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen, Chia-Lun Chang, Chih-Wei Lin, Hsiu-Jen Lin, Ching-Hua Hsieh, Chung-Shi Liu
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Publication number: 20190296002Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.Type: ApplicationFiled: October 1, 2018Publication date: September 26, 2019Inventors: Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu