Abstract: A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.

Abstract: An inductor structure formed on a substrate and extending in a quadrant comprising a first domain, a second domain, a third domain and a fourth domain is provided. The inductor structure comprises an input conducting wire, an output conducting wire and a conducting wire. The conducting wire is coupled between the input conducting wire and the output conducting wire. A first portion of the conducting wire is extended from a start terminal, to the second domain, to the fourth domain, to a stop terminal. A second portion of the conducting wire is extended from the start terminal, to the third domain, to the first domain, to the stop terminal.

Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.

Abstract: A package structure includes an insulating encapsulation, at least one die, and conductive structures. The at least one die is encapsulated in the insulating encapsulation. The conductive structures are located aside of the at least one die and surrounded by the insulating encapsulation, and at least one of the conductive structures is electrically connected to the at least one die. Each of the conductive structures has a first surface, a second surface opposite to the first surface and a slant sidewall connecting the first surface and the second surface, and each of the conductive structures has a top diameter greater than a bottom diameter thereof, and wherein each of the conductive structures has a plurality of pores distributed therein.

Abstract: A method for manufacturing a nitride phosphor is provided. The method comprises providing a nitride phosphor formulation and subjecting the nitride phosphor formulation to a hot isostatic pressing step. The nitride phosphor formulation comprises a flux and a phosphor precursor, wherein the flux is a barium-containing nitride. The phosphor precursor comprises two or more metal nitrides, and wherein a plurality of metal elements are present in the nitride phosphor and the two or more metal nitrides contain the plurality of metal elements.

Abstract: A package includes a device die, and an encapsulating material encircling the device die. The encapsulating material includes a first portion with a substantially uniform first width, and a second portion lower than the first portion. Lower portions of the second portion have second widths increasingly smaller than widths of respective overlying upper portions of the second portion. The package further includes at least one dielectric layer underlying and in contact with the encapsulating material. The at least one dielectric layer has third widths smaller than the substantially uniform first width. The substantially uniform first width, the second widths, and the third widths are measured in a cross-sectional view of the package, and are measured in directions parallel to a major top surface of the encapsulating material.

Abstract: A relay device comprises a base, a pin, and an outer cap. A gap is arranged at a peripheral of the base. The pin has a convex plate and assembled to the gap of the base and one end thereof is protruded from the gap. The convex plate is covered/shielded the gap. The outer cap includes a receiving groove. A notch of the receiving groove is covered the base and the pin. A paste is applied among the peripheral of the base, the convex plate of the pin, and the notch of the receiving groove for fastening. The gap arranged at the peripheral of the base is providing the pin for assembling without directional limitation and advantageous to once assembly of the base and the pin in an automatic machine so as to simplify the manufacturing process of the relay device.

Abstract: The present invention relates to a light-emitting module and a light-emitting display panel. The light-emitting module comprises a substrate, one ore more light-emitting unit, and a driving unit. The substrate comprises a power input, a ground, a data input, a data output, a clock input, and a clock output. The one or more light-emitting unit is disposed on the substrate. The driving unit is connected electrically to the data input, the clock input, and the power input, respectively, and controls the color-scale changes of the light-emitting unit. A plurality of light-emitting modules are disposed on the circuit board. The control signal controlling the plurality of light-emitting modules is transmitted in series. It isn't required to connect the plurality of light-emitting module to additional connecting wires for signal control. Accordingly, shading of the light passing through the display panel and inferior transmittance due to excess electrical connecting wires may be prevented.

Abstract: A package includes a device die, and an encapsulating material encircling the device die. The encapsulating material includes a first portion with a substantially uniform first width, and a second portion lower than the first portion. Lower portions of the second portion have second widths increasingly smaller than widths of respective overlying upper portions of the second portion. The package further includes at least one dielectric layer underlying and in contact with the encapsulating material. The at least one dielectric layer has third widths smaller than the substantially uniform first width. The substantially uniform first width, the second widths, and the third widths are measured in a cross-sectional view of the package, and are measured in directions parallel to a major top surface of the encapsulating material.

Abstract: A method includes placing a first device die and a second device die over a carrier, with a scribe line between the first device die and the second device die. The first device die and the second device die are encapsulated with an encapsulating material, which has a portion in the scribe line. The method further includes forming a dielectric layer over the encapsulating material, performing a first die-saw to form a first trench in the scribe line, performing a second die-saw to form a second trench in the scribe line, and performing a third die-saw on the scribe line to separate the first device die from the second device die.

Abstract: A method for transmitting a human input event includes the steps of: connecting an Android device to an electrical device which can execute Android debug Bridge (ADB) through a USB cable to run a software program with shell permission of the Android device; establishing a cable communication way between the electrical device and the Android device with the shell permission, wherein the software program is configured to use the shell permission to inject the human input event into the Android device; changing the cable communication way into a wireless communication way with the shell permission; disconnecting the Android device from the electrical device while remaining the wireless communication way with the shell permission; and transmitting the human input event from an external device to the Android device through the wireless communication way with the shell permission.

Abstract: An illumination structure including an illumination module, a light base and a cover is provided. The light base includes a cylindrical shell and an electrical connector, wherein the cylindrical shell is used for receiving and supporting the illumination module. A first end of the cylindrical shell has a first edge including a plurality of protrusions. A second end of the cylindrical shell is connected to the electrical connector. The cover has a second edge including a plurality of recessions. Each recession is complementary in shape to a corresponding protrusion, so that the protrusions are received in corresponding recessions respectively.

Abstract: A movable power source device is to dispose a control substrate, a display module, a biomedical detection module and a power source module in a housing. It does not only utilize a power source transmission port of the power source module connected to mobile digital apparatuses of a mobile phone, a digital camera, a laptop computer and a tablet computer to supply power required for operating the connected mobile digital apparatus or charge the connected mobile digital apparatus but also facilitates a user to understand his/her biomedical information real-time under a condition of activating the biomedical detection module, thereby further achieving two-way interaction.

Abstract: A light guide device includes N+1 light guide plates and N linear plane splitters. The light guide plates include a light outlet face, a light guiding face and a reflection face. The volume of the light guide device is defined by the light outlet face opposite to the light guiding face. The light guiding face has a plurality of first microstructures for diverting the light. The reflection face extends from the light outlet face toward a splitting portion. The linear plane splitters have a first and a second splitting portion. The first and second splitting portions of the ith linear plane splitter connects the light guiding face and the reflection face of the (j?1)th and jth light guide plates. The i and j satisfy 1?i?N and 2?j?N+1. Moreover, a light module utilizing the light guide device is disclosed.

Abstract: A light device and a lighting component are provided. The lighting device comprises a LED module and a lighting component. The LED module has an exposed light emitting surface. The lighting component covers the LED module and has an inputting surface and a top outputting surface. The inputting surface faces the light emitting surface of the LED module, the top outputting surface has a concave structure, and the concave structure is located opposite the light emitting surface.

Abstract: The present disclosure relates to a duty cycle adjusting circuit of a lighting system and method thereof for sensing light of a first color and a second color emitted by a light emitting device of the first color and a light emitting device of the second color to generate corresponding intensity values. Then a first pulse width correcting value and a second pulse width correcting value can be calculated for adjusting a first duty cycle and a second duty cycle of a driving current to adjust the illuminating intensity of the light emitting devices of the first and the second colors. Through these adjusting steps, the light of the first and the second colors is within a predetermined range of color temperature. Therefore, light source for stable light in color temperature is provided.

Abstract: A multi-stack package light emitting diode (LED) includes an LED chip, a first fluorescent powder layer, a first optical bandpass filter layer and a second fluorescent powder layer. The LED chip generates an LED light. The first fluorescent powder layer and the second fluorescent powder layer respectively have a first fluorescent powder and a second fluorescent powder. The first fluorescent powder and the second fluorescent powder are excited by the LED light to respectively generate a first excitation light and a second excitation light. The first optical bandpass filter layer allows the LED light and the first excitation light to pass and reflects the second excitation light. A wavelength of the LED light is shorter than a wavelength of the second excitation light. The wavelength of the second excitation light is shorter than a wavelength of the first excitation light. Therefore, the multi-stack package LED improves a light emission efficiency.