Abstract: An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.

Abstract: An optoelectronic device. The device comprising: a silicon-on-insulator, SOI, wafer, the SOI wafer including a cavity and an input waveguide, the input waveguide being optically coupled into the cavity; and a mirror, located within the cavity and bonded to a bed thereof, the mirror including a reflector configured to reflect light received from the input waveguide in the SOI wafer.

Abstract: An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.

Abstract: A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.

Abstract: A silicon photonic integrated circuit with a heater. In some embodiments, the silicon photonic integrated circuit includes a first waveguide, on a top surface of the silicon integrated circuit, and a heater element, on the first waveguide. The heater element may include a first metal layer, on the first waveguide, and a second metal layer, on the first metal layer, the second metal layer having a different composition than the first metal layer, the second layer having a thickness of less than 300 nm.

Abstract: An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.

Abstract: An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.

Abstract: An optical engine. In some embodiments, the optical engine includes an electronic interfacing component including: an upper surface having a plurality of conductors for forming a corresponding plurality of connections to a host board, a lower surface having a plurality of conductors for forming a corresponding plurality of connections to one or more optoelectronic elements, and a plurality of vias extending from the lower surface to the upper surface.

Abstract: A system integrating a fan-out package, including a first semiconductor die, with a second semiconductor die. In some embodiments the fan-out package includes the first semiconductor die, a mold compound, covering the first semiconductor die on at least two sides, and an electrical contact, on a lower surface of the first semiconductor die. The fan-out package may have a rabbet along a portion of a lower edge of the fan-out package.

Abstract: A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.

Abstract: An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.

Abstract: A method for non-destructively estimating a current physical condition of a cordage product in-service is described. The method involves obtaining sensor data associated with the cordage product while in-service handling a load. The sensor data includes any combination of cordage product elongation data, applied load data, and diametric data. The method further includes determining an axial stiffness value associated with the cordage product based on the sensor data and estimating a health state of the cordage product based on the determined axial stiffness value. The estimated health state is indicative of the current physical condition of the cordage product.

Abstract: An optoelectronic module. In some embodiments, the optoelectronic module includes: a substrate; a digital integrated circuit, on an upper surface of the substrate; and a frame, secured in a pocket of the substrate. The pocket is in a lower surface of the substrate, and the substrate includes an insulating layer, and a plurality of conductive traces.

Abstract: An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.

Abstract: An optical touch device includes a foldable frame assembly, two image sensing units and two light emitting units. The foldable frame assembly comprises a first frame, a second frame, a third frame and a fourth frame. The two image sensing units are disposed on opposite ends of the fourth frame respectively. The two light emitting units are disposed on opposite ends of the fourth frame respectively and adjacent to the two image sensing units respectively. The frames of the foldable frame assembly are pivotally connected to each other such that the frames can rotate with respect to each other so as to be folded or expanded.

Abstract: A rope structure adapted to engage a bearing structure while under load comprises a plurality of fibers, a matrix, and lubricant particles. The plurality of fibers is adapted to bear the loads applied to the ends of the rope structure. The matrix surrounds at least a portion of some of the plurality of fibers. The lubricant particles are supported by the matrix such that at least some of the lubricant particles are arranged between at least some of the fibers to reduce friction between at least some of the plurality of fibers and at least some of the lubricant particles are arranged to be between the bearing structure and at least some of the plurality of fibers to reduce friction between the bearing structure and at least some of the plurality of fibers.

Abstract: An optical touch device includes a foldable frame assembly, two image sensing units and two light emitting units. The foldable frame assembly comprises a first frame, a second frame, a third frame and a fourth frame. The two image sensing units are disposed on opposite ends of the fourth frame respectively. The two light emitting units are disposed on opposite ends of the fourth frame respectively and adjacent to the two image sensing units respectively. The frames of the foldable frame assembly are pivotally connected to each other such that the frames can rotate with respect to each other so as to be folded or expanded.

Abstract: A foldable frame assembly is adapted for an optical touch device. The foldable frame assembly includes a first frame, a second frame and a third frame. The second frame is pivotally connected to a first end of the first frame and the third frame is pivotally connected to a second end of the first frame, wherein the first end is opposite to the second end. The second frame and the third frame can rotate with respect to the first frame so as to be folded or expanded with respect to the first frame.

Abstract: A method for non-destructively estimating a current physical condition of a cordage product in-service is described. The method involves obtaining sensor data associated with the cordage product while in-service handling a load. The sensor data includes any combination of cordage product elongation data, applied load data, and diametric data. The method further includes determining an axial stiffness value associated with the cordage product based on the sensor data and estimating a health state of the cordage product based on the determined axial stiffness value. The estimated health state is indicative of the current physical condition of the cordage product.

Abstract: A rope system adapted to be connected between first and second structures comprises a rope recoil system comprising first and second rope recoil assemblies. The first rope recoil assembly defines a first length and a first predetermined rope recoil maximum limit at which the first rope recoil assembly fails when under tension. The second rope recoil assembly defines a second length, where the second length is longer than the first length. The rope recoil assembly is arranged between the first and second structures such that the rope recoil system is in a first configuration. When at least one of the first and second structures moves away from another of the first and second structures, the first rope recoil assembly fails and the rope recoil system reconfigures into a second configuration.