Patents by Inventor Chien-Fu Huang
Chien-Fu Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180226537Abstract: The present disclosure provides a light-emitting device including a substrate, a first block of semiconductor stack on the substrate, a second block of semiconductor stack on the substrate and a third block of semiconductor stack on the substrate. The first block of semiconductor stack includes a first emitting wavelength and a first surface away from the substrate. The second block of semiconductor stack on the substrate includes a second emitting wavelength and a second surface away from the substrate. The third block of semiconductor stack includes s a third emitting wavelength and a third surface away from the substrate. The second surface and the first surface are non-coplanar and the third surface and the first surface are coplanar. The first emitting wavelength, the second emitting wavelength and the third emitting wavelength are different.Type: ApplicationFiled: April 3, 2018Publication date: August 9, 2018Inventors: Chien-Fu Huang, Chih-Chiang Lu, Chun-Yu Lin, Hsin-Chih Chiu
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Patent number: 10038128Abstract: The present disclosure provides a method of manufacturing a light-emitting device, which comprises providing a first substrate and a plurality of semiconductor stacked blocks comprising a first semiconductor stacked block and a second semiconductor stacked block on the first substrate, and each of the plurality semiconductor stacked blocks comprises a first conductive-type semiconductor layer, a light-emitting layer on the first conductive-type semiconductor layer, and a second conductive-type semiconductor layer on the light-emitting layer; conducting a separating step to separate the first semiconductor stacked block from the first substrate, and the second semiconductor stacked block remains on the first substrate; providing an element substrate comprising a patterned metal layer; and conducting a bonding step to bond and align the first semiconductor stacked block or the second semiconductor stacked block with the patterned metal layer.Type: GrantFiled: September 12, 2017Date of Patent: July 31, 2018Assignee: EPISTAR CORPORATIONInventors: Chien-Fu Huang, Yao-Ning Chan, Tzu Chieh Hsu, Yi-ming Chen, Hsin-Chih Chiu, Chih-Chiang Lu, Chia-liang Hsu, Chun-Hsien Chang
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Patent number: 9997687Abstract: A light-emitting device comprising: a supportive substrate; a transparent layer formed on the supportive substrate, and the transparent layer comprising conductive metal oxide material; a light-emitting stacked layer comprising an active layer formed on the transparent layer; and an etching-stop layer formed between the light-emitting stacked layer and the supportive substrate and contacting the transparent layer, wherein a thickness of the etching-stop layer is thicker than that of the transparent layer.Type: GrantFiled: January 9, 2017Date of Patent: June 12, 2018Assignee: EPISTAR CORPORATIONInventors: Shih-I Chen, Chia-Liang Hsu, Tzu-Chieh Hsu, Han-Min Wu, Ye-Ming Hsu, Chien-Fu Huang, Chao-Hsing Chen, Chiu-Lin Yao, Hsin-Mao Liu, Chien-Kai Chung
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Patent number: 9954140Abstract: The present disclosure provides a light-emitting device. The light-emitting device comprises: a substrate; an intermediate layer on the substrate; a first window layer comprising a first semiconductor optical layer on the intermediate layer and a second semiconductor optical layer on the first semiconductor optical layer; and a light-emitting stack on the second semiconductor optical layer; wherein a difference between the lattice constant of the intermediate layer and the lattice constant of the first semiconductor optical layer is greater than 2.3 ?.Type: GrantFiled: May 16, 2017Date of Patent: April 24, 2018Assignee: Epistar CorporationInventors: Chien-Fu Huang, Shiuan-Leh Lin, Chih-Chiang Lu, Chia-Liang Hsu
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Publication number: 20180006206Abstract: The present disclosure provides a method of manufacturing a light-emitting device, which comprises providing a first substrate and a plurality of semiconductor stacked blocks comprising a first semiconductor stacked block and a second semiconductor stacked block on the first substrate, and each of the plurality semiconductor stacked blocks comprises a first conductive-type semiconductor layer, a light-emitting layer on the first conductive-type semiconductor layer, and a second conductive-type semiconductor layer on the light-emitting layer; conducting a separating step to separate the first semiconductor stacked block from the first substrate, and the second semiconductor stacked block remains on the first substrate; providing an element substrate comprising a patterned metal layer; and conducting a bonding step to bond and align the first semiconductor stacked block or the second semiconductor stacked block with the patterned metal layer.Type: ApplicationFiled: September 12, 2017Publication date: January 4, 2018Inventors: Chien-Fu HUANG, Yao-Ning CHAN, Tzu Chieh HSU, Yi-ming CHEN, Hsin-Chih CHIU, Chih-Chiang LU, Chia-liang HSU, Chun-Hsien CHANG
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Patent number: 9850190Abstract: Provided is a process of preparing dichloropropanol, DCP. The process includes the step of: subjecting a three-carbon material to a first chlorination reaction with an aqueous hydrochloric acid solution in the presence of a carboxylic acid catalyst; adding the three-carbon material into the first mixture solution to undergo a second chlorination reaction and obtain a second mixture solution containing less than 13 wt % of hydrochloric acid; distilling the second mixture solution; and purifying the overhead product by oil-water separation to obtain DCP from the oil phase. By lowering the concentration of the hydrochloric acid contained in the mixture to be distilled, the DCP product can be straightly obtained via distillation and oil-water separation, thereby effectively simplifying the process of preparing DCP.Type: GrantFiled: September 13, 2016Date of Patent: December 26, 2017Assignee: Chang Chun Plastics Co., Ltd.Inventors: Chien-Fu Huang, Cheng-Hui Chan
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Patent number: 9793454Abstract: This disclosure discloses a method for making a light-emitting device, comprising steps of: providing a substrate; forming a light-emitting stack on the substrate; forming a first layer on the light-emitting stack; providing a permanent substrate; forming a second layer on the permanent substrate; bonding the first layer and the second layer to form a bonding layer to connect the substrate and the permanent substrate; wherein a refractive index of the bonding layer decreases from the light-emitting stack toward the permanent substrate.Type: GrantFiled: January 11, 2016Date of Patent: October 17, 2017Assignee: EPISTAR CORPORATIONInventors: Chien-Fu Huang, Shiuan-Leh Lin, Chih-Chiang Lu, Chia-Liang Hsu
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Patent number: 9793451Abstract: An encapsulated light-emitting diode device is disclosed. The encapsulated light-emitting diode device includes a circuit carrier including a surface; a light-emitting device including a transparent substrate, the transparent substrate including a first surface and a second surface, and the first surface and the surface of the circuit carrier includes an included angle larger than zero; a light-emitting diode chip located on the first surface of the transparent substrate; and a first transparent glue covering the light-emitting diode chip and formed on the first surface; and a second transparent glue formed on the second surface corresponding to the first transparent glue; wherein the first transparent glue has a circular projection on the first surface and the light-emitting diode chip is substantially located at the center of the circular projection.Type: GrantFiled: November 25, 2014Date of Patent: October 17, 2017Assignee: Epistar CorporationInventors: Chia-Liang Hsu, Han-Min Wu, Ye-Ming Hsu, Chien-Fu Huang, Tzu-Chieh Hsu, Min-Hsun Hsieh
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Patent number: 9793458Abstract: The present disclosure provides a method of manufacturing a light-emitting device, which comprises providing a first substrate and a plurality of semiconductor stacked blocks on the first substrate, and each of the plurality semiconductor stacked blocks comprises a first conductive-type semiconductor layer, a light-emitting layer on the first conductive-type semiconductor layer, and a second conductive-type semiconductor layer on the light-emitting layer; wherein there is a trench separating two adjacent semiconductor stacked blocks on the first substrate, and a width of the trench is less than 10 ?m; and conducting a first separating step to separate a first semiconductor stacked block of the plurality of semiconductor stacked blocks from the first substrate and keep a second semiconductor stacked block on the first substrate.Type: GrantFiled: February 21, 2017Date of Patent: October 17, 2017Assignee: EPISTAR CORPORATIONInventors: Chien-Fu Huang, Yao-Ning Chan, Tzu Chieh Hsu, Yi Ming Chen, Hsin-Chih Chiu, Chih-Chiang Lu, Chia-Liang Hsu, Chun-Hsien Chang
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Publication number: 20170271548Abstract: The present disclosure provides a method for manufacturing a light-emitting device, comprising: providing a first substrate; providing a semiconductor stack on the first substrate, the semiconductor stack comprising a first conductive type semiconductor layer, a light-emitting layer on the first conductive type semiconductor layer, and a second conductive type semiconductor layer on the light-emitting layer, wherein the semiconductor stack comprises a plurality of blocks of semiconductor stack separated from each other, and wherein the plurality of blocks of semiconductor stack comprise a first block of semiconductor stack and a second block of semiconductor stack; performing a separating step to separate the first block of semiconductor stack from the first substrate, and the second block of semiconductor stack remained on the first substrate; providing a permanent substrate comprising a first surface, a second surface, and a third block of semiconductor stack on the first surface; and bonding one of the firType: ApplicationFiled: May 31, 2017Publication date: September 21, 2017Inventors: Chien-Fu HUANG, Chih-Chiang LU, Chun-Yu LIN, Hsin-Chih CHIU
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Publication number: 20170256678Abstract: A light-emitting device comprises a light-emitting stack; a reflective structure comprising a reflective layer on the light-emitting stack and a first insulating layer covering the reflective layer; and a first conductive layer on the reflective structure; wherein the first insulating layer isolates the reflective layer from the first conductive layer.Type: ApplicationFiled: May 23, 2017Publication date: September 7, 2017Inventors: Wen-Luh LIAO, Shao-Ping LU, Hung-Ta CHENG, Shih-I CHEN, Chia-Liang HSU, Shou-Chin WEI, Ching-Pei LIN, Yu-Ren PENG, Chien-Fu HUANG, Wei-Yu CHEN, Chun-Hsien CHANG
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Publication number: 20170250310Abstract: The present disclosure provides a light-emitting device. The light-emitting device comprises: a substrate; an intermediate layer on the substrate; a first window layer comprising a first semiconductor optical layer on the intermediate layer and a second semiconductor optical layer on the first semiconductor optical layer; and a light-emitting stack on the second semiconductor optical layer; wherein a difference between the lattice constant of the intermediate layer and the lattice constant of the first semiconductor optical layer is greater than 2.3 ?.Type: ApplicationFiled: May 16, 2017Publication date: August 31, 2017Inventors: Chien-Fu HUANG, Shiuan-Leh LIN, Chih-Chiang LU, Chia-Liang HSU
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Patent number: 9705029Abstract: The present disclosure provides a method for manufacturing a light-emitting device, comprising: providing a first substrate; providing a semiconductor stack on the first substrate, the semiconductor stack comprising a first conductive type semiconductor layer, a light-emitting layer on the first conductive type semiconductor layer, and a second conductive type semiconductor layer on the light-emitting layer, wherein the semiconductor stack is patterned and comprises a plurality of blocks of semiconductor stack separated from each other, and wherein the plurality of blocks of semiconductor stack comprise a first block of semiconductor stack and a second block of semiconductor stack; performing a separating step to separate the first block of semiconductor stack from the first substrate, and the second block of semiconductor stack remained on the first substrate; providing a permanent substrate comprising a first surface, a second surface, and a third block of semiconductor stack on the first surface; and bondiType: GrantFiled: June 26, 2013Date of Patent: July 11, 2017Assignee: EPISTAR CORPORATIONInventors: Chien-Fu Huang, Chih-Chiang Lu, Chun-Yu Lin, Hsin-Chih Chiu
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Publication number: 20170174593Abstract: Provided is a process of preparing dichloropropanol, DCP. The process includes the step of: subjecting a three-carbon material to a first chlorination reaction with an aqueous hydrochloric acid solution in the presence of a carboxylic acid catalyst; adding the three-carbon material into the first mixture solution to undergo a second chlorination reaction and obtain a second mixture solution containing less than 13 wt % of hydrochloric acid; distilling the second mixture solution; and purifying the overhead product by oil-water separation to obtain DCP from the oil phase. By lowering the concentration of the hydrochloric acid contained in the mixture to be distilled, the DCP product can be straightly obtained via distillation and oil-water separation, thereby effectively simplifying the process of preparing DCP.Type: ApplicationFiled: September 13, 2016Publication date: June 22, 2017Inventors: Chien-Fu Huang, Cheng-Hui Chan
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Patent number: 9685588Abstract: An optoelectronic element comprises a semiconductor stack comprising an active layer, wherein the semiconductor stack has a first surface and a second surface opposite to the first surface; a first transparent layer on the second surface; a plurality of cavities in the first transparent layer; and a layer on the first transparent layer, wherein the first transparent layer comprises oxide or diamond-like carbon.Type: GrantFiled: March 29, 2016Date of Patent: June 20, 2017Assignee: Epistar CorporationInventors: Wen-Luh Liao, Shao-Ping Lu, Hung-Ta Cheng, Shih-I Chen, Chia-Liang Hsu, Shou-Chin Wei, Ching-Pei Lin, Yu-Ren Peng, Chien-Fu Huang, Wei-Yu Chen, Chun-Hsien Chang
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Publication number: 20170170375Abstract: The present disclosure provides a method of manufacturing a light-emitting device, which comprises providing a first substrate and a plurality of semiconductor stacked blocks on the first substrate, and each of the plurality semiconductor stacked blocks comprises a first conductive-type semiconductor layer, a light-emitting layer on the first conductive-type semiconductor layer, and a second conductive-type semiconductor layer on the light-emitting layer; wherein there is a trench separating two adjacent semiconductor stacked blocks on the first substrate, and a width of the trench is less than 10 ?m; and conducting a first separating step to separate a first semiconductor stacked block of the plurality of semiconductor stacked blocks from the first substrate and keep a second semiconductor stacked block on the first substrate.Type: ApplicationFiled: February 21, 2017Publication date: June 15, 2017Inventors: Chien-Fu HUANG, Yao-Ning CHAN, Tzu Chieh HSU, Yi Ming CHEN, Hsin-Chih CHIU, Chih-Chiang LU, Chia-Liang HSU, Chun-Hsien CHANG
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Patent number: 9656943Abstract: The present disclosure relates to a recycling method for producing dimethyl carbonate. The process is unique in that it produces a by-product that can be re-used in the process as a raw material for repeating the process. For example, when the process is directed to synthesizing dimethyl carbonate, glycerol is used as a starting material. Glycerol is also a by-product produced during formation of dimethyl carbonate, and therefore it can be re-used as starting material to generate more dimethyl carbonate.Type: GrantFiled: October 20, 2015Date of Patent: May 23, 2017Assignee: Chang Chun Plastics Co. Ltd.Inventors: Chien Fu Huang, Yi Ta Tsai
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Publication number: 20170113991Abstract: The present disclosure relates to an improved, environmentally friendly, process for producing compounds such as hydroquinone (benzene-1,4-diol) and its derivatives. The process can be carried out at ambient temperature and pressure using a recyclable copper catalyst and recyclable intermediate materials. The process generally entails reacting an aromatic compound such as benzene with hydrogen peroxide in the present of a pure elemental copper catalyst or a copper (I) salt catalyst to form oxidation product such as benzoquinone, and reducing the compound to hydroquinone or a hydroquinone derivative.Type: ApplicationFiled: October 26, 2015Publication date: April 27, 2017Inventors: Chien Fu Huang, Yi Hung Chou
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Publication number: 20170117450Abstract: A light-emitting device comprising: a supportive substrate; a transparent layer formed on the supportive substrate, and the transparent layer comprising conductive metal oxide material; a light-emitting stacked layer comprising an active layer formed on the transparent layer; and an etching-stop layer formed between the light-emitting stacked layer and the supportive substrate and contacting the transparent layer, wherein a thickness of the etching-stop layer is thicker than that of the transparent layer.Type: ApplicationFiled: January 9, 2017Publication date: April 27, 2017Inventors: Shih-I CHEN, Chia-Liang HSU, Tzu-Chieh HSU, Han-Min WU, Ye-Ming HSU, Chien-Fu HUANG, Chao-Hsing CHEN, Chiu-Lin YAO, Hsin-Mao LIU, Chien-Kai CHUNG
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Patent number: 9630899Abstract: The present disclosure relates to an improved, environmentally friendly, process for producing compounds such as hydroquinone (benzene-1,4-diol) and its derivatives. The process can be carried out at ambient temperature and pressure using a recyclable copper catalyst and recyclable intermediate materials. The process generally entails reacting an aromatic compound such as benzene with hydrogen peroxide in the present of a pure elemental copper catalyst or a copper (I) salt catalyst to form oxidation product such as benzoquinone, and reducing the compound to hydroquinone or a hydroquinone derivative.Type: GrantFiled: October 26, 2015Date of Patent: April 25, 2017Assignee: Chang Chun Plastics Co. Ltd.Inventors: Chien Fu Huang, Yi Hung Chou