Abstract: A semiconductor device includes a conductive feature, a dielectric layer disposed over the conductive feature, and a contact feature extending through the dielectric layer. The contact feature has an upper portion and a lower portion. The upper portion is spaced apart from the dielectric layer with a spacer layer. The lower portion is electrically coupled to the conductive feature and in contact with the dielectric layer.

Abstract: A wafer inspection method, wherein a motorized chuck stage is controlled by a control rod to be displaced between an upper position and a lower position along Z-axis direction, to change a relative position of a wafer on the motorized chuck stage relative to a probe. The control rod is movable between an upper and an lower limit positions. The wafer inspection method includes: determining a position of the control rod based on a measurement signal; determining a first moving direction and a moving distance of the control rod based on a change of the measurement signal; generating a control signal based on the moving distance of the control rod; controlling the motorized chuck stage to be displaced along a second moving direction opposite to the first moving direction; and controlling an objective lens module to keep focusing on the wafer when the motorized chuck stage is on the move.

Abstract: A method of battery charging is to be implemented by an energy station communicable with a cloud server that stores reference battery identifiers. The method includes: detecting a provided battery identifier of a battery, and transmitting the provided battery identifier to the cloud server so as to enable the cloud server to determine one of the reference battery identifiers that matches the provided battery identifier, and to determine to which one of a first lease code and a second lease codes the one of the reference battery identifiers thus determined corresponds; and being controlled to charge the battery when it is determined that the one of the reference battery identifiers thus determined by the cloud server corresponds to the first lease code.

Abstract: A semiconductor inspecting method for ensuring a scrubbing length on a pad includes following steps. First off, a first position of a probe needle from above is defined. In addition, a wafer comprising at least a pad is placed on a wafer chuck of a semiconductor inspecting system. Thereafter, a relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system to generate a scrubbing length on the pad. Next, whether the scrubbing length is equal to or larger than a preset value or not is recognized by adopting the vision system and the relative vertical movement is stopped by adopting the driving system.

Abstract: The semiconductor inspecting method includes following steps. First, a first position of a probe needle from above is defined by adopting a vision system of a semiconductor inspecting system. Then, a first relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system. Thereafter, a minimum change in position of the probe needle corresponding to the first position is recognized by adopting the vision system of the semiconductor inspecting system. Next, the first relative vertical movement is stopped by adopting the driving system of the semiconductor inspecting system.

Abstract: A semiconductor package includes a substrate, a semiconductor die, a ring structure and a lid. The semiconductor die is disposed on the substrate. The ring structure is disposed on the substrate and surrounds the semiconductor die, where a first side of the semiconductor die is distant from an inner sidewall of the ring structure by a first gap, and a second side of the semiconductor die is distant from the inner sidewall of the ring structure by a second gap. The first side is opposite to the second side, and the first gap is less than the second gap. The lid is disposed on the ring structure and has a recess formed therein, and the recess overlaps with the first gap in a stacking direction of the ring structure and the lid.

Abstract: A fan includes a frame, an impeller and a motor. The impeller includes a hub, a plurality of blades, first air-guiding plates and second air-guiding plates. The hub has a tapered shape. A width of the hub gradually increases along a direction from a top portion of the hub to a bottom portion of the hub. The hub has at least an air vent. The blades are disposed around an outer periphery of the hub. The first air-guiding plates and the second air-guiding plates are disposed around an inner periphery of the hub. The first air-guiding plates are arranged between two of the second air-guiding plates in staggered. The second air-guiding plates are arranged between two of the first air-guiding plates in staggered. The first air-guiding plates and the second air-guiding plates have different thicknesses, heights or shapes.

Abstract: A method for locating a touched position on a touch panel acquires a sensing signal from a sensing area on the touch panel when the touch panel is touched. A determination is made as to whether the sensing signal of the sensing area on the touch panel is a touch signal and if so, sorting all the touch signals to obtain a decreasing sequence of strength of touch signals. Selection of groups of all the touch signals in the decreasing sequence is carried out according to a direction of decrease of strength, to divide all the touch areas into at least one group. Calculating a physical center of each of the at least one group, wherein the touch position of each of the groups is taken as the physical center and point of origin of the coordinates.

Abstract: A method for compensating to a first distance between a probe tip and a device under test (DUT) after a temperature change of the DUT includes: capturing a first image having the probe and its reflected image on a reflective surface of the DUT at a first temperature; measuring a second distance between a reference point of the probe and its reflected image; changing the first temperature of the DUT to a second temperature; capturing a second image having the probe and its reflected image on the reflective surface at the second temperature; measuring a third distance between the reference point of the probe and its reflected image; dividing the difference between the third and the second distances by two to obtain a fourth distance; and determining a relative position between the probe and the DUT by the fourth distance to compensate to the first distance.

Abstract: A camera device includes a plurality of lenses and an annular body. The annular body is disposed between the object side and the plurality of lenses, between the plurality of lenses, or between the plurality of lenses and the image side. The annular body includes an annular main body, an outer circumferential portion, and an inner circumferential portion, wherein the annular main body connects to the outer circumferential portion and the inner circumferential portion, the annular main body is disposed between the outer circumferential portion and the inner circumferential portion, and the inner circumferential portion is non-circular and surrounds the optical axis to form a hole. The camera device satisfies: Dx>Dy; where Dx is a maximum dimension of the hole through which the optical axis passes, and Dy is a minimum dimension of the hole through which the optical axis passes.

Abstract: A lens assembly includes a first lens, a second lens, a third lens, a fourth lens and a fifth lens are arranged in order from an object side to an image side along an optical axis. The first lens has positive refractive power and includes a convex surface facing the object side and a concave surface facing the image side. The second lens has negative refractive power. The third lens has positive refractive power and includes a convex surface facing the object side. The fourth lens has positive refractive power. The fifth lens has negative refractive power and includes a concave surface facing the image side. The lens assembly satisfies 5<(R11+R12)/(R21+R22)<15.

Abstract: A lens assembly includes a first lens group, a second lens group, a third lens group, a fourth lens group, and a fifth lens group, all of which are arranged in order from a first side to a second side along an axis. The first lens group is with negative refractive power. The second lens group is with positive refractive power. The third lens group is with refractive power. The fourth lens group is with refractive power. The fifth lens group is with refractive power. The lens assembly further includes a first reflective element disposed between the first lens group and the fifth lens group, wherein the first reflective element includes a first reflective surface.

Abstract: A method of aligning a wafer includes defining a reference direction for aligning the wafer; capturing an image of the wafer held on a chuck; using an identifying module to analyze a straight line on the image of the wafer; calculating an offset angle between the straight line and the reference direction; and calibrating the offset angle to align the straight line with the reference direction by way rotating the chuck.

Abstract: A lens assembly includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, and a reflective element. The first lens is with refractive power and includes a concave surface facing an object side along an axis. The second lens is with refractive power and includes a convex surface facing the object side along the axis. The third, fourth, and fifth lenses are with refractive power. The reflective element includes a reflective surface. The first, second, third, fourth, and fifth lenses are arranged in order from the object side to an image side along the axis. The reflective element is disposed between the first lens and the fifth lens. The lens assembly satisfies: 2 mm<L<6 mm; wherein L is an interval from an object side surface of the first lens to the reflective surface along the axis.

Abstract: A camera device includes a plurality of lenses and an annular body having a fixed hole. The plurality of lenses and the annular body are arranged between an object side and an image side along an optical axis. The annular body includes an annular main body, an outer circumferential portion, and an inner circumferential portion, wherein the annular main body connects to the outer circumferential portion and the inner circumferential portion, and the inner circumferential portion is non-circular and surrounds the optical axis to form the fixed hole. The camera device satisfies: EFL/?{square root over (4A/?)}=(EFL/Dx+EFL/Dy)×K1; K1?0.49, where EFL is an effective focal length of the camera device, A is an area of the fixed hole, K1 is a coefficient, Dx is a maximum dimension of the fixed hole through which the optical axis passes, and Dy is a minimum dimension of the fixed hole through which the optical axis passes.

Abstract: A method for fabricating a static random access memory (SRAM) includes the steps of: forming a gate structure on a substrate; forming an epitaxial layer adjacent to the gate structure; forming a first interlayer dielectric (ILD) layer around the gate structure; transforming the gate structure into a metal gate; forming a contact hole exposing the epitaxial layer, forming a barrier layer in the contact hole, forming a metal layer on the barrier layer, and then planarizing the metal layer and the barrier layer to form a contact plug. Preferably, a bottom portion of the barrier layer includes a titanium rich portion and a top portion of the barrier layer includes a nitrogen rich portion.

Abstract: A method for compensating to a first distance between a probe tip and a device under test (DUT) after a temperature change of the DUT includes: capturing a first image having the probe and its reflected image on a reflective surface of the DUT at a first temperature; measuring a second distance between a reference point of the probe and its reflected image; changing the first temperature of the DUT to a second temperature; capturing a second image having the probe and its reflected image on the reflective surface at the second temperature; measuring a third distance between the reference point of the probe and its reflected image; dividing the difference between the third and the second distances by two to obtain a fourth distance; and determining a relative position between the probe and the DUT by the fourth distance to compensate to the first distance.

Abstract: A static random access memory (SRAM) includes a substrate having a first active region and a second active region adjacent to the first active region. A first gate structure is disposed on the substrate and across the first active region and the second active region. A second gate structure is adjacent to a first side of the first gate structure. A first lower contact structure is disposed on the first active region and adjacent to a second side of the first gate structure. A first upper contact structure is disposed on and in direct contact with the first lower contact structure. A top surface of the first lower contact structure and a sidewall of the first upper contact structure comprise a step profile therebetween.

Abstract: A method of determining a first distance between a probe and a wafer held by a wafer probe station includes adjusting a microscope at a specific magnification; moving the microscope perpendicularly relative to a chuck to focus on the chuck to obtain a clear image of the chuck; defining a specific position of the microscope after the clear image of the chuck is obtained; maintaining the specific magnification of the microscope and moving the microscope perpendicularly relative to the chuck from the specific position by a travelling distance to focus on the probe to obtain a clear image of the probe; and determining the travelling distance minus a thickness of a wafer to be placed on a side of the chuck facing to the microscope as the first distance between the probe and the wafer.

Abstract: A display device is provided. The display device includes a first substrate, a second substrate, a liquid-crystal layer, a first electrode, and an opposite electrode. The liquid-crystal layer is disposed between the first substrate and the second substrate. The first electrode is disposed on the first substrate. The opposite electrode is disposed on the side of the second substrate that faces the first substrate. The first electrode includes a first main portion and a plurality of first extending portions. The first extending portions are connected to the first main portion, at least one of the first extending portions includes a first side, a second side, and a curved structure. The curved structure connects the first side to the second side, and the curved structure has a first curvature radius greater than zero.