Abstract: A close-end fuel cell and an anode bipolar plate thereof are provided. The anode bipolar plate includes an airtight conductive frame and a conductive porous substrate disposed within the airtight conductive frame. In the airtight conductive frame, an edge of a first side has a fuel inlet, and an edge of a second side has a fuel outlet. The conductive porous substrate has at least one flow channel, where a first end of the flow channel communicates with the fuel inlet, a second end of the flow channel communicates with the fuel outlet. The flow channel is provided with a blocking part near the fuel inlet to divide the flow channel into two areas.

Abstract: A method is provided for forming an integrated circuit (IC) chip package structure. The method includes providing a substrate for an interposer, and forming a conductive interconnect structure in and on the substrate for connecting a group of selected IC dies. The method includes forming warpage-reducing trenches in non-routing regions of the interposer, wherein the warpage-reducing trenches are sized and positioned based on a warpage characteristic to reduce the warpage of the chip package structure. The method also includes depositing a warpage-relief material in the warpage-reducing trenches according to the warpage characteristic to reduce the warpage of the chip package structure, and bonding the group of selected IC dies to the interposer to form a chip package structure.

Abstract: An optical integrated circuit (IC) structure includes: a substrate including a fiber slot formed in an upper surface of the substrate and extending from an edge of the substrate, and an undercut formed in the upper surface and extending from the fiber slot; a semiconductor layer disposed on the substrate; a dielectric structure disposed on the semiconductor layer; an interconnect structure disposed in the dielectric structure; a plurality of vents that extend through a coupling region of the dielectric structure and expose the undercut; a fiber cavity that extends through the coupling region of dielectric structure and exposes the fiber slot; and a barrier ring disposed in the dielectric structure, the barrier ring surrounding the interconnect structure and routed around the perimeter of the coupling region.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A power module of an electric assisted bicycle is disclosed and includes a pedal shaft, a gear-plate-output shaft, a reducer-output shaft and a motor-output shaft. The pedal shaft is arranged along an axial direction. The gear-plate-output shaft includes a first section and a second section arranged in the axial direction. The first section is concentrically sleeved on the pedal shaft through a first one-way bearing along a radial direction. When the pedal shaft is forced to rotate, the gear-plate-output shaft is driven through the first one-way bearing. The reducer-output shaft is concentrically sleeved on an outer surface of the second section through a second one-way bearing along the radial direction. The motor-output shaft is concentrically sleeved on the reducer-output shaft along the radial direction. When the motor-output shaft drives the reducer-output shaft to rotate, the gear-plate-output shaft is driven by the reducer-output shaft through the second one-way bearing.

Abstract: A system for compensating acceleration of electrical motorbike includes a throttle unit and an electro-mechanic assembly. After the electrical motorbike starts, the throttle unit receives external operation from a rider for generating a series of original throttle signal. An acceleration compensating module calculates a throttle variation rate based on the original throttle signal and variation of a throttle operation magnitude, and calculates a throttle compensating value based on the throttle variation rate when the throttle variation rate is larger than or equal to a correction threshold. A throttle compensating module receives and sums the original throttle signal and the throttle compensating value up for generating a new throttle signal. A torque controller generates a corresponding torque command based on the new throttle signal, and outputs the torque command to the electro-mechanic assembly for operation.

Abstract: A speed-command generating unit incorporated with an electric vehicle having a throttle module, a mechanical brake and a motor is disclosed and includes: a computation module for generating a computation value of a speed-command according to a throttle operating signal from the throttle module, a sensing module for detecting an activated status of the mechanical brake, a selecting module for providing a braking approach selecting signal, a trimming module for setting a trimming flag according to the activated status of the mechanical brake of last cycle, and a switching module connected therewith. The switching module generates different output values of the speed-command for the motor according to different foundations depending on the content of the trimming flag when the mechanical brake is inactivated in this cycle, and generates the output value according to the content of the braking approach selecting signal when the mechanical brake is activated in this cycle.

Abstract: A method for fabricating a carrier-free semiconductor package includes: half-etching a metal carrier to form a plurality of recess grooves and a plurality of metal studs each serving in position as a solder pad or a die pad; filing each of the recess grooves with a first encapsulant; forming on the metal studs an antioxidant layer such as a silver plating layer or an organic solderable protection layer; and performing die-bonding, wire-bonding and molding processes respectively to form a second encapsulant encapsulating the chip. The recess grooves are filled with the first encapsulant to enhance the adhesion between the first encapsulant and the metal carrier, thereby solving the conventional problem of having a weak and pliable copper plate and avoiding transportation difficulty. The invention eliminates the use of costly metals as an etching resist layer to reduce fabrication cost, and further allows conductive traces to be flexibly disposed on the metal carrier to enhance electrical connection quality.

Abstract: An electric motor controlling system used for vibration suppression of an electric vehicle is disclosed. The controlling system includes a PID-controller and a vibration suppression compensator. The PID-controller generates a basic torque command through performing a calculation based on input speed-error signal of the electric vehicle, the vibration suppression compensator generates a compensated torque command through performing a compensation gain procedure on the input speed-error signal. The vibration suppression compensator further receives a motor speed of the electric vehicle, sets its output as the compensated torque command when the motor speed is smaller than a preset active speed level, otherwise sets the output as 0. The controlling system generates an output torque command via adding up the basic torque command and the output of the vibration suppression compensator, and operates electric motor components of the electric vehicle according to the output torque command.

Abstract: An electric motor controlling system used for vibration suppression of an electric vehicle is disclosed. The controlling system includes a PID-controller and a vibration suppression compensator. The PID-controller generates a basic torque command through performing a calculation based on input speed-error signal of the electric vehicle, the vibration suppression compensator generates a compensated torque command through performing a compensation gain procedure on the input speed-error signal. The vibration suppression compensator further receives a motor speed of the electric vehicle, sets its output as the compensated torque command when the motor speed is smaller than a preset active speed level, otherwise sets the output as 0. The controlling system generates an output torque command via adding up the basic torque command and the output of the vibration suppression compensator, and operates electric motor components of the electric vehicle according to the output torque command.

Abstract: A system for compensating acceleration of electrical motorbike includes a throttle unit and an electro-mechanic assembly. After the electrical motorbike starts, the throttle unit receives external operation from a rider for generating a series of original throttle signal. An acceleration compensating module calculates a throttle variation rate based on the original throttle signal and variation of a throttle operation magnitude, and calculates a throttle compensating value based on the throttle variation rate when the throttle variation rate is larger than or equal to a correction threshold. A throttle compensating module receives and sums the original throttle signal and the throttle compensating value up for generating a new throttle signal. A torque controller generates a corresponding torque command based on the new throttle signal, and outputs the torque command to the electro-mechanic assembly for operation.

Abstract: A method for fabricating a carrier-free semiconductor package includes: half-etching a metal carrier to form a plurality of recess grooves and a plurality of metal studs each serving in position as a solder pad or a die pad; filing each of the recess grooves with a first encapsulant; forming on the metal studs an antioxidant layer such as a silver plating layer or an organic solderable protection layer; and performing die-bonding, wire-bonding and molding processes respectively to form a second encapsulant encapsulating the chip. The recess grooves are filled with the first encapsulant to enhance the adhesion between the first encapsulant and the metal carrier, thereby solving the conventional problem of having a weak and pliable copper plate and avoiding transportation difficulty. The invention eliminates the use of costly metals as an etching resist layer to reduce fabrication cost, and further allows conductive traces to be flexibly disposed on the metal carrier to enhance electrical connection quality.

Abstract: A method for fabricating a carrier-free semiconductor package includes: half-etching a metal carrier to form a plurality of recess grooves and a plurality of metal studs each serving in position as a solder pad or a die pad; filing each of the recess grooves with a first encapsulant; forming on the metal studs an antioxidant layer such as a silver plating layer or an organic solderable protection layer; and performing die-bonding, wire-bonding and molding processes respectively to form a second encapsulant encapsulating the chip. The recess grooves are filled with the first encapsulant to enhance the adhesion between the first encapsulant and the metal carrier, thereby solving the conventional problem of having a weak and pliable copper plate and avoiding transportation difficulty. The invention eliminates the use of costly metals as an etching resist layer to reduce fabrication cost, and further allows conductive traces to be flexibly disposed on the metal carrier to enhance electrical connection quality.

Abstract: A method for fabricating a carrier-free semiconductor package includes: half-etching a metal carrier to form a plurality of recess grooves and a plurality of metal studs each serving in position as a solder pad or a die pad; filing each of the recess grooves with a first encapsulant; forming on the metal studs an antioxidant layer such as a silver plating layer or an organic solderable protection layer; and performing die-bonding, wire-bonding and molding processes respectively to form a second encapsulant encapsulating the chip. The recess grooves are filled with the first encapsulant to enhance the adhesion between the first encapsulant and the metal carrier, thereby solving the conventional problem of having a weak and pliable copper plate and avoiding transportation difficulty. The invention eliminates the use of costly metals as an etching resist layer to reduce fabrication cost, and further allows conductive traces to be flexibly disposed on the metal carrier to enhance electrical connection quality.

Abstract: A semiconductor package is provided, including a substrate having a top surface, a bottom surface opposing the top surface, a via communicating the top surface with the bottom surface, and a stator set formed by circuits; an axial tube axially installed in the via of the substrate; a plurality of electronic components mounted on the top surface of the substrate and electrically connected to the substrate; an encapsulant formed on the top surface of the substrate for encapsulating the electronic components and the axial tube; and an impeller axially coupled to the axial tube via the bottom surface of the substrate. In the semiconductor package, the stator set is formed in the substrate by a patterning process. Therefore, the thickness of the semiconductor package is reduced significantly.

Abstract: A semiconductor package is provided, including a substrate having a top surface, a bottom surface opposing the top surface, a via communicating the top surface with the bottom surface, and a stator set formed by circuits; an axial tube axially installed in the via of the substrate; a plurality of electronic components mounted on the top surface of the substrate and electrically connected to the substrate; an encapsulant formed on the top surface of the substrate for encapsulating the electronic components and the axial tube; and an impeller axially coupled to the axial tube via the bottom surface of the substrate. In the semiconductor package, the stator set is formed in the substrate by a patterning process. Therefore, the thickness of the semiconductor package is reduced significantly.

Abstract: An EMI shielding package structure includes a substrate unit having a first surface with a die mounting area and a second surfaces opposite to the first surface, metallic pillars formed on the first surface, a chip mounted on and electrically connected to the die-mounting area, an encapsulant covering the chip and the first surface while exposing a portion of each of the metallic pillars from the encapsulant, and a shielding film enclosing the encapsulant and electrically connecting to the metallic pillars. A fabrication method of the above structure by two cutting processes is further provided. The first cutting process forms grooves by cutting the encapsulant. After a shielding film is formed in the grooves and electrically connected to the metallic pillars, the complete package structure is formed by the second cutting process, thereby simplifying the fabrication process while overcoming inferior grounding of the shielding film as encountered in prior techniques.

Abstract: A cleaning apparatus for a semiconductor equipment is provided. The cleaning apparatus comprising a cleaning pad with a plurality of brushes thereon is located on a rotor of the semiconductor equipment to remove residues within the semiconductor equipment by using the brushes against the residues via moving and rotating the rotor and the cleaning apparatus.

Abstract: A semiconductor package is provided, including a substrate having a top surface, a bottom surface opposing the top surface, a via communicating the top surface with the bottom surface, and a stator set formed by circuits; an axial tube axially installed in the via of the substrate; a plurality of electronic components mounted on the top surface of the substrate and electrically connected to the substrate; an encapsulant formed on the top surface of the substrate for encapsulating the electronic components and the axial tube; and an impeller axially coupled to the axial tube via the bottom surface of the substrate. In the semiconductor package, the stator set is formed in the substrate by a patterning process. Therefore, the thickness of the semiconductor package is reduced significantly.

Abstract: A heat dissipating device includes a semiconductor packaging structure having a stator set and a semiconductor element provided therein, a fan wheel set pivotally connected to the semiconductor packaging structure, and a guiding structure having a guiding channel. The guiding structure receives the semiconductor packaging structure and the fan wheel set. The fan wheel set includes a plurality of blades located above the surface of the semiconductor packaging structure. The stator set and the semiconductor element controls the first blades. The blades extend beyond side surfaces the semiconductor packaging structure and have their sizes increased, such that the airflow volume can be increased without changing the size of the semiconductor packaging structure.