Abstract: A semiconductor device includes a fin extending from a substrate. The fin has a source/drain region and a channel region. The channel region includes a first semiconductor layer and a second semiconductor layer disposed over the first semiconductor layer and vertically separated from the first semiconductor layer by a spacing area. A high-k dielectric layer at least partially wraps around the first semiconductor layer and the second semiconductor layer. A metal layer is formed along opposing sidewalls of the high-k dielectric layer. The metal layer includes a first material. The spacing area is free of the first material.

Abstract: A circuit test structure includes a chip including a conductive line which traces a perimeter of the chip. The circuit test structure further includes an interposer electrically connected to the chip, wherein the conductive line is over both the chip and the interposer. The circuit test structure further includes a test structure connected to the conductive line. The circuit test structure further includes a testing site, wherein the test structure is configured to electrically connect the testing site to the conductive line.

Abstract: A semiconductor structure, comprising a redistribution layer (RDL) including a dielectric layer and a conductive trace within the dielectric layer; a first conductive member disposed over the RDL and electrically connected with the conductive trace; a second conductive member disposed over the RDL and electrically connected with the conductive trace; a first die disposed over the RDL; a second die disposed over the first die, the first conductive member and the second conductive member; and a connector disposed between the second die and the second conductive member to electrically connect the second die with the conductive trace, wherein the first conductive member is electrically isolated from the second die.

Abstract: A semiconductor device includes a first set of nanostructures stacked over a substrate in a vertical direction, and each of the first set of nanostructures includes a first end portion and a second end portion, and a first middle portion laterally between the first end portion and the second end portion. The first end portion and the second end portion are thicker than the first middle portion. The semiconductor device also includes a first plurality of semiconductor capping layers around the first middle portions of the first set of nanostructures, and a gate structure around the first plurality of semiconductor capping layers.

Abstract: A water supply device (10) and a tube connector structure (2) thereof, which are used for an electronic device (100) having a water inlet (101) and a water outlet (102), are disclosed. The tube connector structure (2) includes a connecting plate (21) and two tube connector plugs (22) passing through and fixed to the connecting plate (21). One of the tube connector plugs (22) is connected with the water inlet (101), and the other one of the tube connector plugs (22) is connected with the water outlet (102). Therefore, advantages of rapid connection and disconnection between the water supply device (10) and the tube connector structure (2) and saving time and labor in assembling may be accomplished.

Abstract: Liquid-cooled notebook computer and power supply device thereof, includes a power supply line set including AC power supply line, transformer device set in adapter and electrically connected to AC power supply line and DC power supply line electrically connected to the other side of transformer device, a water cooling device installed in adapter, and a notebook computer with infusion inlet and infusion outlet thereof respectively connected to water outlet and water inlet of water cooling device. The infusion inlet and the infusion outlet are connected to the internal chip surface of notebook computer through infusion pipeline, and a heat conduction source is attached to the chip surface. After the water pump in water cooling device is actuated, the heat conduction source transports the heat generated by the chip from the notebook computer to water cooling device for circulating exchange of cold and hot liquids for heat dissipation.

Abstract: An electronic device (10) with a liquid cooling mechanism includes an electronic device body (1), a heat dissipation module (2) and a liquid cooling module (3). The electronic device body (1) includes a housing (11) and at least one heat generating element (12) installed in the housing (11). The heat dissipation module (2) is contained in the housing (11) and attached to the heat generating element (12). The liquid cooling module (3) includes a liquid cooling pipe (31) contained in the housing (11) and attached to the heat dissipation module (2), and two ends of the liquid cooling pipe (31) have two interface portions (311) exposed from the housing (11). In this way, the liquid cooling pipe (31) is used for water cooling to achieve a desirable cooling efficiency for the electronic device (10).

Abstract: A method of encouraging exercise collects motion data of a user of a type of exercise machine. It is determined whether the user is in a good state according to the motion data. If the user is deemed in a good state, the motion data are sent to a cloud server. Ranking information of multiple users on same type of exercise machine are received from the cloud server. The ranking information is displayed on a touch screen of the exercise machine. The method realizes interaction of the user on a virtual reality basis, and improves exercise motivation of the user.

Abstract: A method for forming semiconductor devices includes providing a substrate with a conductive pad formed thereon; forming a transparent structure over the substrate, wherein the transparent structure includes a plurality of collimating pillars adjacent to the conductive pad; forming a light-shielding structure over the plurality of collimating pillars and the conductive pad; performing a cutting process to remove one or more materials directly above the conductive pad, while leaving remaining material to cover the conductive pad, wherein the material includes a portion of the light-shielding structure; and performing an etching process to remove the remaining material to expose the conductive pad.

Abstract: A method for forming semiconductor devices includes providing a substrate with a conductive pad formed thereon; forming a transparent structure over the substrate, wherein the transparent structure includes a plurality of collimating pillars adjacent to the conductive pad; forming a light-shielding structure over the plurality of collimating pillars and the conductive pad; performing a cutting process to remove one or more materials directly above the conductive pad, while leaving remaining material to cover the conductive pad, wherein the material includes a portion of the light-shielding structure; and performing an etching process to remove the remaining material to expose the conductive pad.

Abstract: A method for forming semiconductor devices includes providing a substrate with a conductive pad formed thereon; forming a transparent structure over the substrate, wherein the transparent structure includes a plurality of collimating pillars adjacent to the conductive pad; forming a light-shielding structure over the plurality of collimating pillars and the conductive pad; performing a cutting process to remove one or more materials directly above the conductive pad, while leaving remaining material to cover the conductive pad, wherein the material includes a portion of the light-shielding structure; and performing an etching process to remove the remaining material to expose the conductive pad.

Abstract: A back-light module includes a back board. The back board includes a substrate and a plurality of frame monomers. Each frame monomer comprises four lateral ribs, every two adjacent lateral ribs are perpendicularly connected with each other. The frame monomers are detachably assembled to each other to form a height adjustable back frame, and the height adjustable back frame is assembled with the substrate to form a height adjustable light-mixing chamber.

Abstract: An ultra-thin television includes a wall holder and a liquid crystal display screen. The wall holder includes a support structure and a plurality of accessories. The support structure includes a front frame having a decorative front surface, the front frame defines a display screen receiving space. The support structure defines an accessory receiving cavity in air communication with the display screen receiving space. The accessories are located in the receiving cavity. The liquid crystal display screen is received in the display screen receiving space and electrically connects to the accessories through a connector.

Abstract: A back-light module includes a back board. The back board includes a substrate and a plurality of frame monomers. Each frame monomer comprises four lateral ribs, every two adjacent lateral ribs are perpendicularly connected with each other. The frame monomers are detachably assembled to each other to form a height adjustable back frame, and the height adjustable back frame is assembled with the substrate to form a height adjustable light-mixing chamber.

Abstract: A liquid crystal display device thermally insulated from light source heat, includes a display panel, a backlight module positioned on the display panel, a bezel positioned around the backlight module, and a thermal insulating element mounted on the bezel. The backlight module includes a light guiding plate and at least one light source located at a side of the light guiding plate. The thermal insulating element is positioned between the at least one light source and the bezel. A sealed space is formed between the thermal insulating element and the bezel. The thermal insulating element and the sealed vacuum space are configured to thermally insulate heat generated by the at least one light source and prevent heat from transferring to the bezel and display panel.

Abstract: A backlight module includes a light guiding plate having a side surface, at least one light source facing towards the light guiding plate, and a thermal insulation element. The thermal insulation element is configured to prevent heat from the at least one light source from transferring to the bezel and display panel. The thermal insulation element is coupled to the side surface. The at least one light source is enclosed by the light guiding plate and the thermal insulation element.

Abstract: A backlight module includes a light guiding plate having a side surface, at least one light source facing towards the light guiding plate, and a thermal insulation element. The thermal insulation element is configured to prevent heat from the at least one light source from transferring to the bezel and display panel. The thermal insulation element is coupled to the side surface. The at least one light source is enclosed by the light guiding plate and the thermal insulation element.

Abstract: A liquid crystal display device thermally insulated from light source heat, includes a display panel, a backlight module positioned on the display panel, a bezel positioned around the backlight module, and a thermal insulating element mounted on the bezel. The backlight module includes a light guiding plate and at least one light source located at a side of the light guiding plate. The thermal insulating element is positioned between the at least one light source and the bezel. A sealed space is formed between the thermal insulating element and the bezel. The thermal insulating element and the sealed vacuum space are configured to thermally insulate heat generated by the at least one light source and prevent heat from transferring to the bezel and display panel.

Abstract: A handlebar end cap for a bicycle contains: a body, a retaining member, and a cover. The body includes a hole, at least one end face, and a fixing groove with a second inner diameter. The hole has a first inner diameter, and the body further includes a slot. The retaining member includes a recess and a first outer diameter, the first outer diameter has a circular locking loop, and the locking loop has a second outer diameter. The retaining member further includes a positioning rib and a limiting notch, the positioning rib has a third inner diameter, and the limiting notch has a fourth inner diameter. The cover includes a covering face, and the cover includes a first locating trench and a defining portion. The first locating trench has a third outer diameter, and the defining portion has a fourth outer diameter.

Abstract: A handlebar end cap for a bicycle contains: a body, a retaining member, and a cover. The body includes a hole, at least one end face, and a fixing groove with a second inner diameter. The hole has a first inner diameter, and the body further includes a slot. The retaining member includes a recess and a first outer diameter, the first outer diameter has a circular locking loop, and the locking loop has a second outer diameter. The retaining member further includes a positioning rib and a limiting notch, the positioning rib has a third inner diameter, and the limiting notch has a fourth inner diameter. The cover includes a covering face, and the cover includes a first locating trench and a defining portion, wherein the first locating trench has a third outer diameter, the defining portion has a fourth outer diameter.