Patents by Inventor Chih-Hsien Tsai
Chih-Hsien Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240162418Abstract: Disclosed is an anode material for a lithium-ion secondary battery, comprising: lithium titanate and a modified layer coating on the surface of the lithium titanate, wherein the modified layer is a fluorocarbon. The anode material forms a surface modification containing C—F bond on the surface of lithium oxide and can be used for the lithium electronic secondary battery, and the lithium electronic secondary battery comprises the anode material can avoid the formation of solid electrolyte layer on the surface of the electrode and obtain good conductivity and avoid gas production.Type: ApplicationFiled: February 22, 2023Publication date: May 16, 2024Applicant: CPC CORPORATION, TAIWANInventors: Jen-Hsien HUANG, Meng-Jer TSAI, Chih-Chieh WANG
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Patent number: 11982860Abstract: An optical member driving mechanism is provided. The optical member driving mechanism includes a fixed portion, a movable portion, an electromagnetic driving assembly and an elastic member. The fixed portion has a base and a frame that is disposed on the base. The movable portion is movable relative to the fixed portion, and includes a carrier for carrying an optical member with an incident optical axis. The carrier includes a body and a sidewall that extends along the edge of the body, wherein the carrier further includes a first stopping portion and a second stopping portion protruding towards the fixed portion. The electromagnetic driving assembly drives the movable portion to move relative to the fixed portion. The movable portion is movably connected to the fixed portion via the elastic member.Type: GrantFiled: April 8, 2022Date of Patent: May 14, 2024Assignee: TDK TAIWAN CORP.Inventors: Chia-Che Wu, Sung-Mao Tsai, Chao-Chang Hu, Che-Wei Chang, Chen-Hsien Fan, Chih-Wei Weng
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Publication number: 20240145403Abstract: An electronic package is provided, in which electronic elements and at least one packaging module including a semiconductor chip and a shielding structure covering the semiconductor chip are disposed on a carrier structure, an encapsulation layer encapsulates the electronic elements and the packaging module, and a shielding layer is formed on the encapsulation layer and in contact with the shielding structure. Therefore, the packaging module includes the semiconductor chip and the shielding structure and has a chip function and a shielding wall function simultaneously.Type: ApplicationFiled: February 6, 2023Publication date: May 2, 2024Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Chih-Chiang HE, Ko-Wei CHANG, Chia-Yang CHEN
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Patent number: 11973043Abstract: An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.Type: GrantFiled: January 30, 2023Date of Patent: April 30, 2024Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsien Chiu, Wen-Jung Tsai
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Publication number: 20240128249Abstract: An electronic package is provided, in which a circuit structure is stacked on a carrier structure having a routing layer via support structures, where electronic elements are disposed on upper and lower sides of the circuit structure and the carrier structure, and the electronic elements and the support structures are encapsulated by a cladding layer, such that the electronic package can effectively increase the packaging density to meet the requirements of multi-functional end products.Type: ApplicationFiled: December 8, 2022Publication date: April 18, 2024Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Chi-Ching HO
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Patent number: 11934027Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: GrantFiled: June 21, 2022Date of Patent: March 19, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
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Patent number: 11929314Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.Type: GrantFiled: March 12, 2021Date of Patent: March 12, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Hsien Huang, Peng-Fu Hsu, Yu-Syuan Cai, Min-Hsiu Hung, Chen-Yuan Kao, Ken-Yu Chang, Chun-I Tsai, Chia-Han Lai, Chih-Wei Chang, Ming-Hsing Tsai
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Patent number: 11929318Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.Type: GrantFiled: May 10, 2021Date of Patent: March 12, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
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Publication number: 20240079268Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip structure. The method may be performed by forming a plurality of interconnect layers within a first interconnect structure disposed over an upper surface of a first semiconductor substrate. An edge trimming process is performed to remove parts of the first interconnect structure and the first semiconductor substrate along a perimeter of the first semiconductor substrate. The edge trimming process results in the first semiconductor substrate having a recessed surface coupled to the upper surface by way of an interior sidewall disposed directly over the first semiconductor substrate. A dielectric capping structure is formed onto a sidewall of the first interconnect structure after performing the edge trimming process.Type: ApplicationFiled: November 10, 2023Publication date: March 7, 2024Inventors: Chih-Hui Huang, Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu, Sheng-Chan Li
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Patent number: 11886102Abstract: An illumination system, configured to provide an illumination beam, is provided. The illumination system includes a first excitation light source, a wavelength conversion element, and a controller. The first excitation light source is configured to provide a first excitation beam. The wavelength conversion element is located on a transmission path of the first excitation beam. The wavelength conversion element includes multiple wavelength conversion regions and multiple non-wavelength conversion regions. The controller controls whether the first excitation light source emits light. During a first time interval, the controller turns off the first excitation light source. During a second time interval, the controller controls the first excitation light source to emit light. The first excitation beam is transmitted to one of the wavelength conversion regions to form a converted beam. The illumination beam includes the converted beam. Another illumination system and multiple projection devices are also provided.Type: GrantFiled: April 15, 2021Date of Patent: January 30, 2024Assignee: Coretronic CorporationInventors: Chi-Tang Hsieh, Chih-Hsien Tsai, Mei-Chun Shih, Wei-Chen Hsiao, Shun-Tai Chen
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Patent number: 11841612Abstract: An illumination system includes a light source providing a first light beam, a first light uniformizing element disposed on a transmission path of the first light beam, a wavelength conversion element, and an optical part. The wavelength conversion element is disposed on the same transmission path and converts the first light beam into a second light beam. The optical part is disposed on a transmission path of the second light beam. The wavelength conversion element is disposed between the first light uniformizing element and the optical part. The second light beam includes a first portion, which is transmitted toward the first light uniformizing element, and a second portion, which is transmitted toward the optical part, reflected by the optical part, and further transmitted and passes through the wavelength conversion element for being transmitted toward the first light uniformizing element. A projection device including the illumination system is also provided.Type: GrantFiled: October 21, 2021Date of Patent: December 12, 2023Assignee: Coretronic CorporationInventors: Jyun-Cong Lai, Haw-Woei Pan, Chih-Hsien Tsai
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Patent number: 11768314Abstract: The invention provides a projection method and system. The method includes providing a first sensing group sensing a space and generating a first sensing result to determine whether a user is in an entering or exiting state relative to the space; providing a second sensing group sensing a first or second object in the space according to the first sensing result and generating a second sensing result; and generating a prompt information according to the second sensing result and displaying the prompt information. The system includes a first sensing group, a second sensing group, and a display device. The method and system of the invention sense the space according to the entering and exiting state of the user to effectively reduce the inspection steps of the user for the space, thereby effectively improving the safety of the space, and improving the operating convenience of the user of the space.Type: GrantFiled: June 23, 2021Date of Patent: September 26, 2023Assignee: Coretronic CorporationInventors: Chi-Tang Hsieh, Chih-Hsien Tsai, Yu-Hsien Wu
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Patent number: 11467479Abstract: A polarizing rotation device including a rotation shaft, a driving element and a polarizing element is provided. The driving element is configured to drive the rotation shaft to rotate. The polarizing element is connected to the rotation shaft and is disposed on a transmission path of at least one beam, where the driving element is configured to drive the polarizing element to rotate sequentially while taking the rotation shaft as a rotation central axis, and when the polarizing element is rotated, the at least one beam penetrates through the polarizing element, and the at least one beam penetrating through the polarizing element has different polarization states at different time. Therefore, when a projection device is in a polarized stereoscopic mode, a color or brightness of a display image is uniform, and a user observes a 3D display image with good uniformity.Type: GrantFiled: September 12, 2019Date of Patent: October 11, 2022Assignee: Coretronic CorporationInventors: Yao-Shun Lin, Chi-Tang Hsieh, Chih-Hsien Tsai, Haw-Woei Pan
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Publication number: 20220291515Abstract: A display system including a display device and a light combining device is provided. The display device includes a first display region and a second display region. The light combining device has a first surface and a second surface opposite to the first surface. The first surface is capable of reflecting a first light beam from the first display region to an observing region for forming a first virtual image. The second surface is capable of reflecting a second light beam from the second display region to the observing region for forming a second virtual image. A curvature of the first surface is different from a curvature of the second surface, and a position of the first virtual image is different from a position of the second virtual image.Type: ApplicationFiled: May 27, 2022Publication date: September 15, 2022Applicant: Young Optics Inc.Inventors: Chih-Hsien Tsai, Chao-Shun Chen
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Publication number: 20220283304Abstract: A light source module configured to provide a detection light beam and including a plurality of light-emitting elements, a light spot shaping element, and a micro-mirror element, and a lidar device having a light-emitting end and comprising the light source module are provided. The light-emitting elements are configured to provide light beams. The light spot shaping element has a plurality of light spot shaping regions configured with different deflection angles and light beam convergence capabilities corresponding to the light beams. The micro-mirror element is located on a transmission path of the light beams from the light spot shaping element. A second light beam width of each light beam corresponds to an incidence angle of each light beam incident on a reflecting surface of the micro-mirror element, such that a light spot dimension of each light beam on the reflecting surface substantially coincides with a dimension of the reflecting surface.Type: ApplicationFiled: February 21, 2022Publication date: September 8, 2022Applicant: Coretronic CorporationInventors: Yao-Shun Lin, Haw-Woei Pan, Chih-Hsien Tsai, Fu-Ming Chuang
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Patent number: 11402738Abstract: An illumination system including an exciting light source module, a wavelength conversion device and a light uniforming module is provided. The exciting light source module is configured to emit an exciting beam. The wavelength conversion device is disposed on a transmission path of the exciting beam and is configured to rotate around a central axis. The light uniforming module is disposed on the transmission path of the exciting beam and between the exciting light source module and the wavelength conversion device. After the exciting beam emitted from the exciting light source module passes through the light uniforming module, the exciting beam forms a light spot on the wavelength conversion device. The energy intensity distribution of the light spot along the radial direction about the central axis is that the energy intensity is lower in the center and higher on the two sides. A projection apparatus is also provided.Type: GrantFiled: May 2, 2019Date of Patent: August 2, 2022Assignee: Coretronic CorporationInventors: Chi-Tang Hsieh, Chih-Hsien Tsai, Yao-Shun Lin
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Publication number: 20220229286Abstract: A MEMS device including a plurality of reflective elements, at least one movable frame, a fixed frame, and a controller is provided. The reflective elements are respectively coupled to the movable frame by a plurality of fast pivots, and the fixed frame is coupled to the at least one movable frame by a slow pivot. A swing frequency of the slow pivot is less than a swing frequency of each of the fast pivots. The controller is coupled to the fixed frame and selectively controls a swing of the reflective elements with the fast pivots and the slow pivot as a swing pivot. A first reflective element and a second reflective element in the reflective elements are respectively used to reflect a first beam and a second beam, to respectively form a first reflective beam and a second reflective beam.Type: ApplicationFiled: November 15, 2021Publication date: July 21, 2022Applicant: Coretronic CorporationInventor: Chih-Hsien Tsai
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Publication number: 20220171266Abstract: An illumination system includes a light source providing a first light beam, a first light uniformizing element disposed on a transmission path of the first light beam, a wavelength conversion element, and an optical part. The wavelength conversion element is disposed on the same transmission path and converts the first light beam into a second light beam. The optical part is disposed on a transmission path of the second light beam. The wavelength conversion element is disposed between the first light uniformizing element and the optical part. The second light beam includes a first portion, which is transmitted toward the first light uniformizing element, and a second portion, which is transmitted toward the optical part, reflected by the optical part, and further transmitted and passes through the wavelength conversion element for being transmitted toward the first light uniformizing element. A projection device including the illumination system is also provided.Type: ApplicationFiled: October 21, 2021Publication date: June 2, 2022Applicant: Coretronic CorporationInventors: Jyun-Cong Lai, Haw-Woei Pan, Chih-Hsien Tsai
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Patent number: 11347067Abstract: A display system including a display device and a light combining device is provided. The display device includes a first display region and a second display region. The light combining device has a first surface and a second surface opposite to the first surface. At least one part of a first light beam from the first display region is reflected by the first surface to an observing region so as to form a first virtual image. At least one part of a second light beam from the second display region penetrates through the first surface, is reflected by the second surface, penetrates through the first surface again, and is transmitted to the observing region in sequence, so as to form a second virtual image.Type: GrantFiled: December 12, 2014Date of Patent: May 31, 2022Assignee: Young Optics Inc.Inventors: Chih-Hsien Tsai, Chao-Shun Chen
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Patent number: RE49901Abstract: An electrical connector includes an insulative housing defining a front cavity for receiving and a rear cavity, a terminal assembly assembled in the rear cavity, and a ground member. The terminal assembly includes an upper terminal module, a lower terminal module sandwiching a shielding module therebetween. Said The upper terminal module includes a pair of upper ground terminals. Said The lower terminal module includes a plurality of lower ground terminals. Said The shielding module includes a metallic shielding plate. The ground member is associated with the shielding module to mechanically and electrically connect at least one of the upper ground terminals and the lower ground terminals with the shielding plate.Type: GrantFiled: July 29, 2021Date of Patent: April 2, 2024Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITEDInventors: Terrance F. Little, Chih-Hsien Chou, Chun-Hsiung Hsu, Kuei-Chung Tsai