Patents by Inventor Chih-Jen Yang
Chih-Jen Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240146205Abstract: A flyback power converter includes a power transformer, a first lossless voltage conversion circuit, a first low-dropout linear regulator and a secondary side power supply circuit. The first low-dropout linear regulator (LDO) generates a first operation voltage as power supply for being supplied to a sub-operation circuit. The secondary side power supply circuit includes a second lossless voltage conversion circuit and a second LDO. The second LDO generates a second operation voltage. The first operation voltage and the second operation voltage are shunted to a common node. When a first lossless conversion voltage is greater than a first threshold voltage, the second LDO is enabled to generate the second operation voltage to replace the first operation voltage as power supply supplied to the sub-operation circuit; wherein the second lossless conversion voltage is lower than the first lossless switching voltage.Type: ApplicationFiled: September 23, 2023Publication date: May 2, 2024Inventors: Shin-Li Lin, He-Yi Shu, Shih-Jen Yang, Ta-Yung Yang, Yi-Min Shiu, Chih-Ching Lee, Yu-Chieh Hsieh, Chao-Chi Chen
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Publication number: 20240119875Abstract: A mending method for a display includes the steps of making a display device light to make a plurality of light emitting positions thereof shine, searching out a plurality of defect positions among the light emitting positions, providing a transferring device having a transferring surface with a plurality of miniature light emitting elements positioned correspondingly to the light emitting positions, planning a mending procedure which includes in the area the transferring surface corresponds to, choosing in chief the largest number of defect positions able to be mended at a single time according to the positions of the miniature light emitting elements and then in the area the transferring surface corresponds to, planning the rest of the defect positions according to the rest of the miniature light emitting elements, and according to the mending procedure, moving the transferring device to weld the miniature light emitting elements at the defect positions.Type: ApplicationFiled: October 5, 2023Publication date: April 11, 2024Inventors: Tsan-Jen CHEN, Chih-Hao TSAI, Yu-Cheng YANG, Jen-Hung Lo, Yan-Ru TSAI
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Publication number: 20240113113Abstract: Methods of cutting gate structures, and structures formed, are described. In an embodiment, a structure includes first and second gate structures over an active area, and a gate cut-fill structure. The first and second gate structures extend parallel. The active area includes a source/drain region disposed laterally between the first and second gate structures. The gate cut-fill structure has first and second primary portions and an intermediate portion. The first and second primary portions abut the first and second gate structures, respectively. The intermediate portion extends laterally between the first and second primary portions. First and second widths of the first and second primary portions along longitudinal midlines of the first and second gate structures, respectively, are each greater than a third width of the intermediate portion midway between the first and second gate structures and parallel to the longitudinal midline of the first gate structure.Type: ApplicationFiled: December 1, 2023Publication date: April 4, 2024Inventors: Chih-Chang Hung, Chia-Jen Chen, Ming-Ching Chang, Shu-Yuan Ku, Yi-Hsuan Hsiao, I-Wei Yang
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Patent number: 11934027Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: GrantFiled: June 21, 2022Date of Patent: March 19, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
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Publication number: 20240087861Abstract: In an embodiment, a magnetic assembly includes: an inner permeance annulus; and an outer permeance annulus connected to the inner permeance annulus via magnets, wherein the outer permeance annulus comprises a peak region with a thickness greater than other regions of the outer permeance annulus.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Inventors: Tsung-Jen YANG, Yi-Zhen CHEN, Chih-Pin WANG, Chao-Li SHIH, Ching-Hou SU, Cheng-Yi HUANG
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Publication number: 20230229080Abstract: A photosensitive composition and film prepared from the same are provided. The photosensitive composition includes 100 parts by weight of polyimide, 0.25-50 parts by weight of initiator and 0.25-100 parts by weight of crosslinking agent. The polyimide is a product of a reactant (a) and a reactant (b) via a reaction. The reactant (a) consists of a first dianhydride and a second dianhydride. The molar ratio of the first dianhydride to the second dianhydride is 3:7 to 8:2. The reactant (b) includes a first diamine. The first dianhydride, the second dianhydride and the first diamine are disclosed in the specification.Type: ApplicationFiled: March 24, 2023Publication date: July 20, 2023Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yu-Yang SU, Chih-Jen YANG, Yung-Lung TSENG
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Publication number: 20230092986Abstract: An electronic device may include a display and an optical sensor formed underneath the display. A pixel removal region on the display may at least partially overlap with the sensor. The pixel removal region may include a plurality of non-pixel regions each of which is devoid of thin-film transistors. The plurality of non-pixel regions is configured to increase the transmittance of light through the display to the sensor. In addition to removing thin-film transistors in the pixel removal region, additional layers in the display stack-up may be removed. In particular, a cathode layer, polyimide layer, and/or substrate in the display stack-up may be patterned to have an opening in the pixel removal region. A polarizer may be bleached in the pixel removal region for additional transmittance gains. The cathode layer may be removed using laser ablation with a spot laser or blanket illumination.Type: ApplicationFiled: February 2, 2021Publication date: March 23, 2023Inventors: Warren S. Rieutort-Louis, Meng-Huan Ho, Abbas Jamshidi Roudbari, Chih Jen Yang, Chin Wei Hsu, Jae Won Choi, Jean-Pierre S. Guillou, Ming Xu, Rui Liu, Yi Qiao, Yu-Wen Liu, Yuchi Che, Yue Cui
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Patent number: 11171313Abstract: Display panel stack-up structures are described. In an embodiment, a display panel includes a substrate, a light source, and a multiple layer thin film encapsulation over the light source. In an embodiment, the display panel additionally includes an anti-reflection layer over the light source. In an embodiment, an incoherence layer is located within the thin film encapsulation.Type: GrantFiled: June 21, 2019Date of Patent: November 9, 2021Assignee: Apple Inc.Inventors: Yifan Zhang, Amin Salehi, Yun Liu, Paul S. Drzaic, Tae-Wook Koh, Chih Jen Yang, Bhadrinarayana Lalgudi Visweswaran, Chieh-Wei Chen
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Patent number: 11106134Abstract: A photosensitive composite material is provided. The photosensitive composite material includes 0.1-20.5 parts by weight of a nanoporous silica material, 10.9-68.6 parts by weight of a siloxane polymer, and 10.9-89 parts by weight of a photosensitive siloxane composition, including a siloxane polymer having at least one terminal functional group being vinyl group and a siloxane polymer having at least one terminal functional group being thiol group, based on 100 parts by weight of the photosensitive composite material. The siloxane polymer is a homopolymer of a monomer having a structure of Formula (I) wherein each of R is independently a linear or branched C1-C10 alkyl group, n is a positive integer between 10 and 1000, X includes an alkoxysilyl group, a methacrylate group, an epoxy group, a vinyl group, or an acrylate group.Type: GrantFiled: December 19, 2018Date of Patent: August 31, 2021Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yu-Yang Su, Chih-Jen Yang, Chyi-Ming Leu
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Patent number: 10707282Abstract: A display may have organic light-emitting diode pixels formed from thin-film circuitry. An organic layer including planarization layers and a pixel definition layer may overlap the thin-film circuitry. Thin-film encapsulation may overlap the organic layer. The thin-film encapsulation may be formed from an organic dielectric layer interposed between two layers of inorganic dielectric material. A strip of peripheral crack-stopper structures may run along an edge of the display and may surround the array of pixels. The crack-stopper structures may include parallel inorganic lines formed from a first inorganic layer such as an inorganic layer of the thin-film circuitry. A strip of the organic layer may overlap the parallel inorganic lines. The crack-stopper structures may have parallel tapered polymer lines. The polymer lines may be overlapped by a second inorganic dielectric layer formed from the inorganic material of the thin-film encapsulation layer.Type: GrantFiled: June 5, 2018Date of Patent: July 7, 2020Assignee: Apple Inc.Inventors: Chih Jen Yang, Prashant Mandlik, Chia-Hao Chang, Chien-Chung Wang, Te-Hua Teng, Yu Cheng Chen
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Publication number: 20200099012Abstract: Display panel stack-up structures are described. In an embodiment, a display panel includes a substrate, a light source, and a multiple layer thin film encapsulation over the light source. In an embodiment, the display panel additionally includes an anti-reflection layer over the light source. In an embodiment, an incoherence layer is located within the thin film encapsulation.Type: ApplicationFiled: June 21, 2019Publication date: March 26, 2020Inventors: Yifan Zhang, Amin Salehi, Yun Liu, Paul S. Drzaic, Tae-Wook Koh, Chih Jen Yang, Bhadrinarayana Lalgudi Visweswaran, Chieh-Wei Chen
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Patent number: 10392493Abstract: The present disclosure provides a dispersion solution, including: a first solvent; a second solvent miscible with the first solvent; an inorganic nano sheet material dispersed in the first solvent; and a polymer dissolved in the second solvent, wherein the boiling point of the first solvent is different from that of the second solvent. The present disclosure also provides a method for preparing the dispersion solution and an organic/inorganic hybrid material having a lower coefficient of thermal expansion.Type: GrantFiled: May 2, 2016Date of Patent: August 27, 2019Assignee: Industrial Technology Research InstituteInventors: Chyi-Ming Leu, Chih-Jen Yang, Li-Ting Huang
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Patent number: 10354891Abstract: An electronic package and a method for fabricating the same are provided. The method includes forming a filling material, such as an underfill, between a carrier and a plurality of electronic components and filling the filling material in a space between the electronic components to form a spacing portion. The spacing portion has a first segment and a second segment separated from each other to serve as a stress buffer zone. Therefore, when an encapsulation layer encapsulating the electronic components is subsequently ground, the present disclosure can effectively prevent the electronic components from being cracked due to stresses induced by the external grinding force.Type: GrantFiled: April 4, 2018Date of Patent: July 16, 2019Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Po-Hao Wang, Chih-Jen Yang, Yu-Chih Cheng, Chee-Key Chung, Chang-Fu Lin
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Publication number: 20190204740Abstract: A photosensitive composite material is provided. The photosensitive composite material includes 0.1-20.5 parts by weight of a nanoporous silica material, 10.9-68.6 parts by weight of a siloxane polymer, and 10.9-89 parts by weight of a photosensitive siloxane composition, including a siloxane polymer having at least one terminal functional group being vinyl group and a siloxane polymer having at least one terminal functional group being thiol group, based on 100 parts by weight of the photosensitive composite material. The siloxane polymer is a homopolymer of a monomer having a structure of Formula (I) wherein each of R is independently a linear or branched C1-C10 alkyl group, n is a positive integer between 10 and 1000, X includes an alkoxysilyl group, a methacrylate group, an epoxy group, a vinyl group, or an acrylate group.Type: ApplicationFiled: December 19, 2018Publication date: July 4, 2019Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yu-Yang SU, Chih-Jen YANG, Chyi-Ming LEU
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Publication number: 20190196098Abstract: An optical waveguide includes a lower clad layer, a core layer, and an upper clad layer, wherein the core layer is disposed between the lower clad layer and the upper clad layer. The lower clad layer has a composition including unetchable closed-loop polyimide and plate-shaped clay in a range of 20 wt %-60 wt %. The core layer has a composition including etchable closed-loop polyimide and plate-shaped clay in a range of 20 wt %-60 wt %. The upper clad layer has a composition including an organic material and plate-shaped clay in a range of 20 wt %-60 wt %. The core layer has a refractive index lager than that of the upper clad layer and the lower clad layer.Type: ApplicationFiled: December 28, 2017Publication date: June 27, 2019Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chih-Jen YANG, Li-Ting HUANG, Dong-Sen CHEN, Chyi-Ming LEU
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Publication number: 20190181021Abstract: An electronic package and a method for fabricating the same are provided. The method includes forming a filling material, such as an underfill, between a carrier and a plurality of electronic components and filling the filling material in a space between the electronic components to form a spacing portion. The spacing portion has a first segment and a second segment separated from each other to serve as a stress buffer zone. Therefore, when an encapsulation layer encapsulating the electronic components is subsequently ground, the present disclosure can effectively prevent the electronic components from being cracked due to stresses induced by the external grinding force.Type: ApplicationFiled: April 4, 2018Publication date: June 13, 2019Inventors: Po-Hao Wang, Chih-Jen Yang, Yu-Chih Cheng, Chee-Key Chung, Chang-Fu Lin
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Patent number: 10310179Abstract: An optical waveguide includes a lower clad layer, a core layer, and an upper clad layer, wherein the core layer is disposed between the lower clad layer and the upper clad layer. The lower clad layer has a composition including unetchable closed-loop polyimide and plate-shaped clay in a range of 20 wt %-60 wt %. The core layer has a composition including etchable closed-loop polyimide and plate-shaped clay in a range of 20 wt %-60 wt %. The upper clad layer has a composition including an organic material and plate-shaped clay in a range of 20 wt %-60 wt %. The core layer has a refractive index lager than that of the upper clad layer and the lower clad layer.Type: GrantFiled: December 28, 2017Date of Patent: June 4, 2019Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chih-Jen Yang, Li-Ting Huang, Dong-Sen Chen, Chyi-Ming Leu
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Patent number: 10268547Abstract: A memory protection device is used for protecting a memory. The memory protection device includes a filtering unit and an encoding unit. The filtering unit searches an input data and outputs an encoding selection signal based on a bit component pattern of the input data. The encoding unit selects one or more encoding implementations among a plurality of encoding implementations based on the encoding selection signal from the filtering unit, to encode the input data.Type: GrantFiled: November 25, 2015Date of Patent: April 23, 2019Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Li-Ren Huang, Chih-Jen Yang, Yung-Chang Chang, Kung-Ming Ji
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Publication number: 20180191029Abstract: A gel electrolyte and applications thereof are provided. The composition of the gel electrolyte includes an organic base and hydrogen ion exchanged inorganic nano-platelets dispersed in the organic base. The hydrogen ion exchanged inorganic nano-platelets have a size of 20 nm-80 nm. The hydrogen ion exchanged inorganic nano-platelets are chemically bonded to each other via Si—O—Si bonding. A solid content of the gel electrolyte is 1-10 wt %.Type: ApplicationFiled: December 26, 2017Publication date: July 5, 2018Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chih-Jen Yang, Yu-Ruei Kung, Li-Ting Huang, Chyi-Ming Leu
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Patent number: 9929304Abstract: An apparatus for forming a solar cell includes a housing defining a vacuum chamber, a rotatable substrate support, at least one inner heater and at least one outer heater. The substrate support is inside the vacuum chamber configured to hold a substrate. The at least one inner heater is between a center of the vacuum chamber and the substrate support, and is configured to heat a back surface of a substrate on the substrate support. The at least one outer heater is between an outer surface of the vacuum chamber and the substrate support, and is configured to heat a front surface of a substrate on the substrate support.Type: GrantFiled: April 14, 2015Date of Patent: March 27, 2018Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Edward Teng, Ying-Chen Chao, Chih-Jen Yang