Abstract: The present invention provides an organic/inorganic composite film, which includes a poly(vinylidene fluoride) (PVDF) and inorganic nano-platelets dispersed therein. A weight ratio of the PVDF and the inorganic nano-platelets is between about 97:3 and 20:80. The inorganic nano-platelets have a particle size of about 20-80 nm, wherein the organic/inorganic composite film has a transparency of greater than about 85% at a wavelength between 380 and 780 nm. In addition, a method for forming the organic/inorganic composite film is also provided.

Abstract: Methods for diagnosis of non-small cell lung cancers by detection of endogenous peptides in exhaled breath condensate (EBC) are provided. Diagnostic peptides derived from dermcidin (DCD) are provided. A specific dermcidin-derived peptide E-R11, having the sequence ENAGEDPGLAR, is provided. E-R11 peptide levels in EBC, as measured by mass spectrometry (MS), are highly diagnostic of non-small cell lung cancers. A method for inhibiting growth of lung cancer cells by inhibiting DCD expression by RNA interference also is provided.

Abstract: An organic/inorganic hybrid material is provided, including an organic polymer, and a plurality of inorganic nano-platelets, wherein the inorganic nano-platelets are self-connected or connected via a linker to constitute an inorganic platelet network. By the formation of the inorganic network structure, the hybrid materials can keep their transparency and flexibility at a high inorganic content, and exhibit greatly reduced coefficients of thermal expansion A method for fabricating the organic/inorganic hybrid material is also provided.

Abstract: This invention is an electricity generating organic light-emitting display device (OLED) consisting of vertically stacked layers including an organic light emitting device (OLED), an insulation layer, a solar cell and thin film transistors. The device can reduce the reflection of ambient light, improve the contrast of the signal, and enhance sun-light readability by allowing the ambient light to be absorbed by the solar cells. Furthermore, additional power will be generated by the solar cell through absorption of ambient light and backward emission of OLEDs. The device, without using the polarizer, can exhibit low reflectance characteristics over the visible region and high display contrast.

Abstract: A short-prevented lead frame and a method for fabricating a semiconductor package with the lead frame are proposed, wherein each lead of the lead frame is formed with a thickness-reduced portion at a peripheral position of the lead frame, allowing thickness-reduced portions of adjacent leads to be arranged in a stagger manner. This stagger arrangement significantly increases pitches between the neighboring thickness-reduced portions of leads. Therefore, during a singulation process as to cut through the leads, lead bridging and short-circuiting between adjacent leads caused by cut-side burrs can be prevented from occurrence, whereby singulation quality and product yield and reliability are effectively improved.

Abstract: An organic light emitting diode is provided. The organic light emitting diode includes a substrate, an anode electrode structure formed on the substrate and including at least a metal layer and a metal oxide layer, an organic layer formed on the anode electrode structure and a cathode electrode structure formed on the organic layer.

Abstract: A cathode structure for inverted OLEDs is provided, which comprise a substrate, a conductive electrode layer, an organic material layer, a dielectric layer, and a metal layer. Wherein, the conductive electrode layer is disposed over the substrate, the organic structure layer is disposed over the conductive electrode layer, the dielectric layer is disposed over the organic material layer, and the metal layer is disposed over the dielectric layer. Such cathode structure can function without using the metals of low work function and high chemical activity so as to benefit the manufacturing of organic light emitting devices and displays, and provide a more stable working conditions.

Abstract: An organic electroluminescent panel having a silver alloy is disclosed, which has a substrate; a plurality of the first electrodes; a plurality of the second electrodes; a plurality of conducting lines containing a silver alloy; a plurality of isolating walls; and a plurality of organic electroluminescent media. The first electrodes are arranged in parallel on the substrate. The organic electroluminescent media are disposed on the first electrodes. The second electrodes are disposed on the organic electroluminescent media. The conducting lines containing the silver alloy connect to the first electrodes or the second electrodes. The silver alloy contained in the conducting lines has 80 to 99.8 mol % of silver; 0.1 to 10 mol % of copper; and 0.1 to 10 mol % of at least one transition metal selected from the group consisting of palladium (Pd), magnesium (Mg), gold (Au), platinum (Pt), and the combinations thereof.

Abstract: A short-prevented lead frame and a method for fabricating a semiconductor package with the lead frame are proposed, wherein each lead of the lead frame is formed with a thickness-reduced portion at a peripheral position of the lead frame, allowing thickness-reduced portions of adjacent leads to be arranged in a stagger manner. This stagger arrangement significantly increases pitches between the neighboring thickness-reduced portions of leads. Therefore, during a singulation process as to cut through the leads, lead bridging and short-circuiting between adjacent leads caused by cut-side burrs can be prevented from occurrence, whereby singulation quality and product yield and reliability are effectively improved.

Abstract: A top emitting OLED is provided. The top emitting OLED comprises a substrate, a first electrode layer, an organic layer, and a second electrode layer. Wherein, the first electrode layer is formed on the substrate, the organic layer is formed on the first electrode layer, and the second electrode layer with a first refractive index is formed on the organic layer. Moreover, an anti-reflective layer with a second refractive index is formed on the second electrode layer. The first refractive index is different from the second refractive index, and the first thickness is matched and cooperated with the second thickness for reducing the reflectance of the OLED on visible light region.

Abstract: A short-prevented lead frame and a method for fabricating a semiconductor package with the lead frame are proposed, wherein each lead of the lead frame is formed with a thickness-reduced portion at a peripheral position of the lead frame, allowing thickness-reduced portions of adjacent leads to be arranged in a stagger manner. This stagger arrangement significantly increases pitches between the neighboring thickness-reduced portions of leads. Therefore, during a singulation process as to cut through the leads, lead bridging and short-circuiting between adjacent leads caused by cut-side burrs can be prevented from occurrence, whereby singulation quality and product yield and reliability are effectively improved.

Abstract: A semiconductor package with a die pad having a recessed portion is proposed, wherein a lead frame is used, having a die pad formed with at least a through hole, and a plurality of leads. A chip is mounted on the die pad and covers the through hole, with a bottom surface of the chip being partly exposed out the through hole. The through hole is formed at its peripheral edge with a recessed portion that dents from a top surface of the die pad and is associated with the through hole. During a molding process, the recessed portion is entirely filled with an encapsulating compound used for encapsulating the chip and die pad. This prevents forming of voids between the chip and die pad, and assures packaged products to be free of die crack or popcorn effect, thereby significantly improving yield and reliability of the packaged products.

Abstract: An organic electroluminescent panel having a silver alloy is disclosed, which has a substrate; a plurality of the first electrodes; a plurality of the second electrodes; a plurality of conducting lines containing a silver alloy; a plurality of isolating walls; and a plurality of organic electroluminescent media. The first electrodes are arranged in parallel on the substrate. The organic electroluminescent media are disposed on the first electrodes. The second electrodes are disposed on the organic electroluminescent media. The conducting lines containing the silver alloy connect to the first electrodes or the second electrodes. The silver alloy contained in the conducting lines has 80 to 99.8 mol % of silver; 0.1 to 10 mol % of copper; and 0.1 to 10 mol % of at least one transition metal selected from the group consisting of palladium (Pd), magnesium (Mg), gold (Au), platinum (Pt), and the combinations thereof.

Abstract: A method and an apparatus for transporting substrates in all organic light emitting diode (OLED) process is disclosed, which has a transferring chamber provided for transporting substrates between processing modules and the atmosphere condition therein is able to be adjusted to be the same as the processing module by an atmosphere conditioner unit. According to the present invention, the substrates are not contaminated by moisture and the process operation and the factory layout are more flexible. Moreover, the OLED yield is improved.

Abstract: A short-prevented lead frame and a method for fabricating a semiconductor package with the lead frame are proposed, wherein each lead of the lead frame is formed with a thickness-reduced portion at a peripheral position of the lead frame, allowing thickness-reduced portions of adjacent leads to be arranged in a stagger manner. This stagger arrangement significantly increases pitches between the neighboring thickness-reduced portions of leads. Therefore, during a singulation process as to cut through the leads, lead bridging and short-circuiting between adjacent leads caused by cut-side burrs can be prevented from occurrence, whereby singulation quality and product yield and reliability are effectively improved.

Abstract: A semiconductor package with a die pad having a recessed portion is proposed, wherein a lead frame is used, having a die pad formed with at least a through hole, and a plurality of leads. A chip is mounted on the die pad and covers the through hole, with a bottom surface of the chip being partly exposed out the through hole. The through hole is formed at its peripheral edge with a recessed portion that dents from a top surface of the die pad and is associated with the through hole. During a molding process, the recessed portion is entirely filled with an encapsulating compound used for encapsulating the chip and die pad. This prevents forming of voids between the chip and die pad, and assures packaged products to be free of die crack or popcorn effect, thereby significantly improving yield and reliability of the packaged products.

Abstract: A method and an apparatus for transporting substrates in all organic light emitting diode (OLED) process is disclosed, which has a transferring chamber provided for transporting substrates between processing modules and the atmosphere condition therein is able to be adjusted to be the same as the processing module by an atmosphere conditioner unit. According to the present invention, the substrates are not contaminated by moisture and the process operation and the factory layout are more flexible. Moreover, the OLED yield is improved.

Abstract: A method and an apparatus for transporting substrates in an organic light emitting diode (OLED) process is disclosed, which has a transferring chamber provided for transporting substrates between processing modules and the atmosphere condition therein is able to be adjusted to be the same as the processing module by an atmosphere conditioner unit. According to the present invention, the substrates are not contaminated by moisture and the process operation and the factory layout are more flexible. Moreover, the OLED yield is improved.