Abstract: A 3D recording and playing method is applied to a laptop which has sound receiving elements and two audio output elements. The 3D recording and playing method comprises receiving input signals by the sound receiving elements, localizing and separating the input signals so as to obtain preliminarily processed signals, filtering each of the preliminarily processed signal using a head related transfer function to generate a left channel signal and a right channel signal, generating a left channel signal set according to the left channel signal corresponding to each of the preliminarily processed signals, and generating a right channel signal set according to the right channel signal corresponding to each of the preliminarily processed signals, and outputting the left channel signal set and the right channel signal set by the two audio output elements respectively.

Abstract: The invention provides a server device. The server device includes a casing, an electronic assembly, and a heat dissipation assembly. The casing includes a housing and a partition. The partition is disposed in the housing and forms an accommodation space and a heat dissipation space in the housing that are not communicated with each other. The housing has a plurality of first vent holes communicated with the heat dissipation space. The electronic assembly is located in the accommodation space. The heat dissipation assembly includes a heat dissipation component and a heat pipe. The heat dissipation component is located in the heat dissipation space. The heat pipe includes a heat absorption portion and a condensation portion connected to each other. The heat pipe is disposed through the partition, the heat absorption portion is thermally coupled to the electronic assembly, and the condensation portion is coupled to the heat dissipation component.

Abstract: Provided is a memory device including a substrate, a stack structure, a first set of vertical channel structures, a second set of vertical channel structures, and a first slit. The stack structure is disposed on the substrate. The first and second sets of vertical channel structures are arranged along a Y direction and penetrate through the stack structure to contact the substrate. The first slit is disposed between the first and second sets of vertical channel structures, and penetrates through the stack structure to expose the substrate. The first slit includes a plurality of first sub-slits discretely disposed along a X direction.

Abstract: A user equipment terminal (UE) in a wireless network calculates a measurement period for measuring the signal-to-interference-plus-noise ratio (SINR) for a serving cell within a frequency range. The calculation is based on a channel measurement resource (CMR) and an interference measurement resource (IMR). The calculation includes evaluation of a sharing factor P, which is a maximum of PCMR of the CMR and PIMR of the IMR. The PCMR and the PIMR are evaluated, at least in part, based on periodicity of the CMR and the IMR in relation to other periodic measurements performed by the UE. The UE performs a channel measurement and an interference measurement using the CMR and the IMR, respectively, over the measurement period. The UE calculates the SINR based on the channel measurement and the interference measurement; and transmits an SINR measurement report indicating the calculated SINR to a base station.

Abstract: A heat pipe structure is used for cooling a heat source. The heat pipe structure includes a sleeve tube and a shaft. The sleeve tube includes an inner wall. The sleeve tube has a trench on the inner wall. The trench is at an outlet end of the sleeve tube. The trench extends in a circumferential direction of the sleeve tube. The shaft is connected to the heat source. The shaft is inserted into the sleeve tube from the outlet end such that the shaft is rotatable relative to the sleeve tube. The trench surrounds the shaft.

Abstract: Provided is a three-dimensional memory device including a substrate, first and second stacked structures and an etching stop layer. The substrate has a cell region and a periphery region. The first stacked structure is disposed on the cell region and the periphery region, and has a first vertical channel pillar on the cell region that penetrates through the first stacked structure. The second stacked structure is located on the first stacked structure, is disposed on the cell region and the periphery region, and has a second vertical channel pillar on the cell region that penetrates through the second stacked structure. The second vertical channel pillar is electrically connected to the first vertical channel pillar. The etching stop layer is located between the first and second stacked structures, is disposed on the cell region and extends onto the periphery region, and surrounds the lower portion of the second vertical channel pillar.

Abstract: A heat pipe structure is used for cooling a heat source. The heat pipe structure includes a sleeve tube and a shaft. The sleeve tube includes an inner wall. The sleeve tube has a trench on the inner wall. The trench is at an outlet end of the sleeve tube. The trench extends in a circumferential direction of the sleeve tube. The shaft is connected to the heat source. The shaft is inserted into the sleeve tube from the outlet end such that the shaft is rotatable relative to the sleeve tube. The trench surrounds the shaft.

Abstract: An antenna assembly with compact layout traces includes a circuit board and at least one wireless antenna unit, wherein the circuit board is provided with an antenna module, the at least one wireless antenna unit can be located at the same edge or at different edges of the circuit board, each of the at least one wireless antenna unit includes two antennas of the planar inverted-F antenna (PIFA) structure and a neutralization line, and the two antennas are spaced apart from each other and the two ends of the neutralization line are electrically connected to and overlap the two antennas respectively. By arranging antennas of the same working band along the same edge of the circuit board, the corresponding layout traces can be effectively shortened.

Abstract: A heat dissipation system includes a single fan, first and second heat sources, first, second, and third heat pipes, and first and second heat dissipation arrays. The first heat pipe is thermally coupled with the first heat source. The second heat pipe is thermally coupled with the second heat source. The third heat pipe has a first position thermally coupled with the first heat pipe and a second position thermally coupled with the second heat pipe. The first heat dissipation array is arranged around the first position and thermally coupled with the third heat pipe. The second heat dissipation array is arranged around the second position and thermally coupled with the third heat pipe. The single fan is between the first and second heat sources, and configured to blow airflows towards the first and second heat sources, the first and second heat dissipation arrays.

Abstract: A heat dissipation system configured to be in thermal contact with a heat source. The heat dissipation system includes a centrifugal fan, a heat pipe, a heat dissipater, and a heat conduction assembly. The centrifugal fan includes a housing and an impeller. The housing has an accommodation space, an inlet, and an outlet. The inlet and the outlet are connected to the accommodation space. The impeller is located in the accommodation space. The heat pipe is configured to be in thermal contact with the heat source. The heat dissipater is located at the outlet and in thermal contact with the heat pipe. The heat conduction assembly includes a first part configured for the heat source to be mounted thereon and in thermal contact with the heat source, and a second part disposed on the housing and partially located in the accommodation space.

Abstract: A centrifugal fan including an impeller housing and an impeller. The impeller housing has an accommodation space, an air inlet and an air outlet. The air inlet and the air outlet are connected to the accommodation space. The impeller is located in the accommodation space. The impeller includes a hub, a plurality of blades, and at least one heat conductive annular portion. The hub is rotatably disposed in the impeller housing. The plurality of blades are connected to an outer circumferential surface of the hub. The at least one heat conductive annular portion is connected to the plurality of blades.

Abstract: A heat dissipation system configured to be in thermal contact with a heat source. The heat dissipation system includes a centrifugal fan, a heat pipe, a heat dissipater, and a heat conduction assembly. The centrifugal fan includes a housing and an impeller. The housing has an accommodation space, an inlet, and an outlet. The inlet and the outlet are connected to the accommodation space. The impeller is located in the accommodation space. The heat pipe is configured to be in thermal contact with the heat source. The heat dissipater is located at the outlet and in thermal contact with the heat pipe. The heat conduction assembly includes a first part configured for the heat source to be mounted thereon and in thermal contact with the heat source, and a second part disposed on the housing and partially located in the accommodation space.

Abstract: A cooling fan includes a base, a tube, a bearing, a stator, a rotor, and fan blades. The base includes a base protrusion. Each of the fan blades includes a first notch. When the cooling fan is working, the base protrusion passes through the first notch on each of the fan blades. The base protrusion and the first notch not only increase the heat exchange area of the base but break the thermal boundary layer on the base repeatedly to improve the heat dissipating effect when the cooling fan is working.

Abstract: A heat dissipation assembly and portable electronic device including the same wherein heat dissipation assembly includes first heat pipe. The first heat pipe includes first end part and second end part that are opposite to each other. The second end part includes inner peripheral wall and outer peripheral wall surrounding the inner peripheral wall. A vapor channel is formed between the outer peripheral wall and the inner peripheral wall. The inner peripheral wall forms insertion hole. A central line of the insertion hole is at first distance from the outer peripheral wall along first direction. The central line of the insertion hole is at second distance from the outer peripheral wall along second direction. The first direction is different from the second direction, and the first distance is different from the second distance.

Abstract: Provided is a three-dimensional memory device including a substrate, first and second stacked structures and an etching stop layer. The substrate has a cell region and a periphery region. The first stacked structure is disposed on the cell region and the periphery region, and has a first vertical channel pillar on the cell region that penetrates through the first stacked structure. The second stacked structure is located on the first stacked structure, is disposed on the cell region and the periphery region, and has a second vertical channel pillar on the cell region that penetrates through the second stacked structure. The second vertical channel pillar is electrically connected to the first vertical channel pillar. The etching stop layer is located between the first and second stacked structures, is disposed on the cell region and extends onto the periphery region, and surrounds the lower portion of the second vertical channel pillar.

Abstract: The present disclosure provides a cooling fan and a heat dissipating module including the same. The cooling fan includes a base, a tube, a bearing, a stator, a rotor, and fan blades. The base includes a base convex structure. Each of the fan blades includes a first concave structure. When the cooling fan is working, the base convex structure pass through the first concave structure on each of the fan blades. The base convex structure and the first concave structure not only increase the heat exchange area of the base but break the thermal boundary layer on the base repeatedly to improve the heat dissipating effect when the cooling fan is working.

Abstract: A heat dissipation assembly and portable electronic device including the same wherein heat dissipation assembly includes first heat pipe. The first heat pipe includes first end part and second end part that are opposite to each other. The second end part includes inner peripheral wall and outer peripheral wall surrounding the inner peripheral wall. A vapor channel is formed between the outer peripheral wall and the inner peripheral wall. The inner peripheral wall forms insertion hole. A central line of the insertion hole is at first distance from the outer peripheral wall along first direction. The central line of the insertion hole is at second distance from the outer peripheral wall along second direction. The first direction is different from the second direction, and the first distance is different from the second distance.

Abstract: This disclosure relates to a thermal insulation structure including a base plate and a thermal insulation component. The thermal insulation component is disposed on the base plate and is made of aerogel. The thermal conductivity of the base plate is higher than the thermal conductivity of the thermal insulation component.

Abstract: An antenna assembly with compact layout traces includes a circuit board and at least one wireless antenna unit, wherein the circuit board is provided with an antenna module, the at least one wireless antenna unit can be located at the same edge or at different edges of the circuit board, each of the at least one wireless antenna unit includes two antennas of the planar inverted-F antenna (PIFA) structure and a neutralization line, and the two antennas are spaced apart from each other and the two ends of the neutralization line are electrically connected to and overlap the two antennas respectively. By arranging antennas of the same working band along the same edge of the circuit board, the corresponding layout traces can be effectively shortened.

Abstract: A method for enhancing sound volume includes the following steps: delivering a sound-source signal comprising a low-frequency signal to a processor by a set of sound-source equipment; generating a sound-enhancing signal by the processor according to the low-frequency signal within a delay period; and outputting an enhanced sound source signal comprising the low-frequency signal and the sound-enhancing signal to a speaker by the processor; wherein a waveform of the sound-enhancing signal is identical to a waveform of the low-frequency signal, and the delay period causes a phase difference between the sound-enhancing signal and the low-frequency signal.