Abstract: According to various embodiments of this disclosure, an electrochemical sensor/cell includes a substrate with a cavity formed on a first side of the substrate, an ionic conductor is disposed within the cavity, and a lid assembly positioned over the cavity. The lid assembly may include a plurality of electrodes attached to a glass or ceramic panel. The glass or ceramic panel may have one or more apertures allowing gas to flow therethrough. The plurality of electrodes include a working electrode configured to react a molecular species (e.g., gas or aerosolized substance) that diffuses through the one or more apertures, wherein said reaction produces ions mobile in the ionic conductor between two or more of the plurality of electrodes. The lid assembly may further include a three-phase interface positioned over at least a portion of the plurality of electrodes.

Abstract: An electrochemical sensor assembly is disclosed. In some implementations, the electrochemical sensor assembly comprises at least one electrochemical sensor/cell including a substrate with a cavity formed on a first side of the substrate, an ionic conductor is disposed within the cavity, and a lid assembly positioned over the cavity. The lid assembly may include a plurality of electrodes and a gas permeable region positioned over the plurality of electrodes, where the plurality of electrodes include a working electrode configured to react a molecular species when the molecular species is received through the gas permeable region. The lid assembly may be sealed to the substrate with a bonding layer disposed between the lid assembly and the substrate. The bonding layer may be curable with light or thermally curable at a suitably low temperature to avoid thermal damage to the ionic conductor.

Abstract: A mobile sterilization assembly, a mobile sterilization device, and method for sterilization using a mobile sterilization device are described for providing a low-cost and compact sterilization system using an ultraviolet light-emitting diode for sterilization. In an implementation, a mobile sterilization assembly includes a sterilization assembly couplable to a mobile device with a controller, the sterilization assembly including at least one light dispersive element; and an optical coupler configured to couple the at least one light dispersive element to a mobile device; where the at least one light dispersive element at least one of transmits and disperses light from at least one light-emitting diode or transmits light to a photodiode, where the at least one light-emitting diode or the photodiode are configured to be communicatively coupled to the controller.

Abstract: Aspects of the invention include microcooling system that provides a simple, unitary, two dimensional construct with capacity to remove heat effectively from the internal structures of microelectronic devices.

Abstract: A two part curable composition is provided, where the composition comprises: (a) a first part comprising: (i) a (meth)acrylate component; (ii) 1,4-quinones, such as napthoquinone or benzoquinone and derivatives thereof in an amount less than or equal to about 0.05 weight percent; (iii) triaryl or alkaryl phenylphosphine in an amount greater than or equal to about 0.5 weight percent; and (iv) an amine; and (b) a second part comprising: (i) benzoyl peroxide in an amount greater than about 1.0 weight percent.

Abstract: The present invention provides fast fixturing two part adhesive compositions which include a first part containing a (meth)acrylic component and a cure system for the epoxy resin component of the second part and a second part containing an epoxy resin component and a cure system for the (meth)acrylic component of the first part.

Abstract: A mobile sterilization assembly, a mobile sterilization device, and method for sterilization using a mobile sterilization device are described for providing a low-cost and compact sterilization system using an ultraviolet light-emitting diode for sterilization. In an implementation, a mobile sterilization assembly includes a sterilization assembly couplable to a mobile device with a controller, the sterilization assembly including at least one light dispersive element; and an optical coupler configured to couple the at least one light dispersive element to a mobile device; where the at least one light dispersive element at least one of transmits and disperses light from at least one light-emitting diode or transmits light to a photodiode, where the at least one light-emitting diode or the photodiode are configured to be communicatively coupled to the controller.

Abstract: A two part curable composition is provided, where the composition comprises: (a) a first part comprising: (i) a (meth)acrylate component; (ii) 1,4-quinones, such as napthoquione or benzoquinone and derivatives thereof in an amount less than or equal to about 0.05 weight percent; (iii) triaryl or alkaryl phenylphosphine in an amount greater than or equal to about 0.5 weight percent; and (iv) an amine; and (b) a second part comprising: (i) benzoyl peroxide in an amount greater than about 1.0 weight percent.

Abstract: An EMI shielding composite film for use in printed circuit boards has at least two layers, a top layer electrically conductive in all directions (isotropic), and a bottom layer electrically conductive only in the Z (thickness) direction (anisotropic) after thermo-compression. The bottom layer is in contact with the grounding pads of the circuitry of the electronic device to be shielded. The conductive top layer functions similarly to metallic boxes to prevent the electromagnetic radiation from both entering the boxes and escaping into the environment. The bottom layer interconnects the top conductive layer to the grounding pads on the PCB after thermo-compression so that electromagnetic waves collected by the top layer are directed and released to PCB grounding pads through the bottom layer.

Abstract: The present invention provides fast fixturing two part adhesive compositions which include a first part containing a (meth)acrylic component and a cure system for the epoxy resin component of the second part and a second part containing an epoxy resin component and a cure system for the (meth)acrylic component of the first part.

Abstract: A particle filled resin system is produced by cavitation. A method of producing a filled resin system comprises providing a resin and a filler, and subjecting the resin and filler to cavitation. A method of changing the rheology of a filled resin system comprises subjecting the filled resin system to cavitation.

Abstract: The present invention concerns adhesive compositions that provide corrosion-preventative properties and improved adhesive bonding on corrodible surfaces, such as may be found in electronic components. These compositions provide the substrates with greatly increased resistance to corrosion, especially during long term exposure to high temperatures and/or high humidity. When used on conductive substrates, the compositions also maintain good initial and ongoing electrical conductivity.

Abstract: A radio frequency identification (“RFID”) system antenna having adhesive pre-applied to one or more of its contact pads to allow for high speed attachment of the antenna to the RFID die or die strap. Also disclosed is a method for attaching an RFID antenna having pre-applied adhesive to a die or die strap.

Abstract: A fast curing composition that comprises a polymeric resin, a conductive filler and one or more near-infrared absorbing additives and optionally an oxygen scavenger or corrosion inhibitor or both, and other additives such as reactive or nonreactive diluents, inert fillers, and adhesion promoters. The composition may be conductive, resistive or anisotropically conductive. In another embodiment, this invention is a method for improving the cure speed of a composition by exposing the composition to a near infrared energy source.

Abstract: A low stress conductive film or paste adhesive that comprises a) one or more functional acrylic copolymers or terpolymers; b) epoxy; and c) conductive filler. Additional ingredients, such as adhesion promoters and conductivity enhancers may also be utilized. The conductive film or paste adhesive provides higher adhesion strength than traditional flexible conductive film adhesives and a lower stress between the bonded components than existing high adhesion strength conductive films.

Abstract: An anisotropic conductive adhesive that provides strong adhesion to metals and organic substrates to generate stable and reliable electric interconnects. The adhesive provides the benefits of short thermocompression bond time at low temperatures. The adhesive contains cationic curable resin, latent cationic catalyst that thermally cures the resin at high speeds and low temperatures, conductive filler, optionally a film forming thermoplastic solid resin and optionally nano size filler. The optional nano filler provides the benefit of reducing the coefficient of thermal energy mismatch, improving the adhesion strength and reducing the total heat of reaction for the system.

Abstract: A composition for use as a thermal interface material in a heat-generating electronic device is provided. The composition comprises a blend of acrylic polymer, one or more liquid resins, conductive filler particles and optionally one or more solid resins.

Abstract: A radio frequency identification (“RFID”) system antenna having adhesive pre-applied to one or more of its contact pads to allow for high speed attachment of the antenna to the RFID die or die strap.

Abstract: A composition that comprises a) an admixing of at least one epoxy resin and aliphatic amine wherein the ratio of epoxy function group/amine is greater than 1; b) a conductive filler; c) one or more corrosion inhibitors, oxygen scavengers or both; d) imidazole as a curing agent/catalyst; and e) optionally other additives such as organic solvents, flow additives, adhesion promoters and rheology modifiers. The reaction of epoxy and aliphatic amine with excess epoxy functionality results in a flexible resin with remaining active epoxy groups. The compositions exhibit improved electrical stability and impact resistance over other conductive adhesive compositions that do not comprise the admixture.

Abstract: A low stress conductive film or paste adhesive that comprises a) one or more functional acrylic copolymers or terpolymers; b) epoxy; and c) conductive filler. Additional ingredients, such as adhesion promoters and conductivity enhancers may also be utilized. The conductive film or paste adhesive provides higher adhesion strength than traditional flexible conductive film adhesives and a lower stress between the bonded components than existing high adhesion strength conductive films.