Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: Disclosed are calibration techniques that can be implemented by a device that conducts biological tests. In certain embodiments, the device for testing a biological specimen includes a receiving mechanism to receive a carrier, a camera module arranged to capture imagery of the carrier, and a processor. Some examples of the processor can detect a calibration mode trigger. In calibration mode, the processor can divide the captured imagery into segments and selectively perform one or more calibration procedures for each segment. Then, the processor records a calibration result for each segment.

Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.

Abstract: An ammonium fluoride gas may be used to form a protection layer for one or more interlayer dielectric layers, one or more insulating caps, and/or one or more source/drain regions of a semiconductor device during a pre-clean etch process. The protection layer can be formed through an oversupply of nitrogen trifluoride during the pre-clean etch process. The oversupply of nitrogen trifluoride causes an increased formation of ammonium fluoride, which coats the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) with a thick protection layer. The protection layer protects the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) during the pre-clean process from being etched by fluorine ions formed during the pre-clean process.

Abstract: A method includes etching a dielectric layer of a substrate to form an opening in the dielectric layer, forming a metal layer extending into the opening, performing an anneal process, so that a bottom portion of the metal layer reacts with a semiconductor region underlying the metal layer to form a source/drain region, performing a plasma treatment process on the substrate using a process gas including hydrogen gas and a nitrogen-containing gas to form a silicon-and-nitrogen-containing layer, and depositing a metallic material on the silicon-and-nitrogen-containing layer.

Abstract: A method of forming a semiconductor device includes forming source/drain regions on opposing sides of a gate structure, where the gate structure is over a fin and surrounded by a first dielectric layer; forming openings in the first dielectric layer to expose the source/drain regions; selectively forming silicide regions in the openings on the source/drain regions using a plasma-enhanced chemical vapor deposition (PECVD) process; and filling the openings with an electrically conductive material.

Abstract: A semiconductor device includes a first connector, a second connector, and a redistribution structure disposed between the first connector and the second connector. The redistribution structure includes a first connection tree electrically connecting the first connector to the second connector. The first connection tree includes a plurality of first conductive pads disposed in a plurality of respective levels, and a plurality of first via structures each disposed between adjacent ones of the plurality of first conductive pads. Any lateral end of each of the plurality of first conductive pads is spaced from the first connector within a first minimum pitch associated with the second connector.

Abstract: A RF shielding socket, including a first tab shield portion on a first side of the socket; a second tab shield portion on a second side of the socket; an extension shield portion extending along a first direction between the first tab shield portion and the second tab shield portion, the extension shield portion including a plurality of clips, each of the clips protruding from the extension shield portion in a second direction traverse to the first direction; a plurality of pins positioned on a third side of the socket, the third side extending between the first side and the second side, a subset of the plurality of pins include a tabbed feature protruding from a body of the respective pin, wherein the tabbed feature of each of the subset of the plurality of pins is in contact with at least one of the clips of the plurality of clips.

Abstract: The present invention discloses a data transmission apparatus having clock gating mechanism. Each of data transmission circuits has a flip-flop depth of N and receives a write clock signal and one of read clock signals to receive and output one of data signals. A write clock gating circuit receives a write clock gating enabling signal to transmit the write clock signal to the data transmission circuits. Each of read clock gating circuits receives one of read clock gating enabling signals to transmit one of the read clock signals. The gating signal transmission circuit has a flip-flop depth of N+M and receives the write and the read clock signals to receive the write clock gating enabling signal and output the read clock gating enabling signals. A largest timing difference among the read clock signals is P clock cycles and M is at least [P].

Abstract: A key structure includes an upper cover, a movable element, an elastic element, a pressure sensing module, a base, and a circuit board. The pressure sensing module is arranged on the base, and the pressure sensing module is electrically connected with the circuit board. The pressure sensing module includes a pressure sensing element and a conducting element, and the pressure sensing element is configured for contacting with the movable element after being pressed, monitoring a pressure on the movable element, and converting the pressure into a pressure signal; the conducting element is configured for conducting the pressure signal to the circuit board.

Abstract: An eye diagram measuring method includes: sampling a compensated input signal according to a reference voltage and a reference clock to obtain a first sampling result; and sampling a to-be-compensated input signal according to a scan voltage and a scan clock to obtain a second sampling result, including: (b1) storing a minimum phase and a voltage level which render the first sampling result identical to the second sampling result; (b2) increasing the voltage level and repeating operation (b1); (b3) decreasing the voltage level and repeating operation (b1); (b4) storing a maximum phase and the voltage level which render the first sampling result identical to the second sampling result; (b5) increasing the voltage level and repeating operation (b4); and (b6) decreasing the voltage level and repeating operation (b4). Voltage levels, maximum phases and minimum phases that are stored are for adjusting the reference voltage and the reference clock.

Abstract: The disclosure relates to systems and methods for accurate generation of material maps of volume of interests, for example, that include implants, for proton radiation therapy. In one implementation, the method may include determining most probable energy (MPE) using particle energy determined from particle counting data. The method may include generating a plurality of simulations that simulate interactions using different combination of properties for the volume of interest determined from representation data and/or from a database to determine most probable energy (MPE) for each simulation. The method may include comparing the MPE determined using the particle counting data to the MPE determined from each simulation. The method may further include selecting one simulation of the plurality of simulations based on the comparing. The method may also include generating a material map for the volume of interest using the one or more properties corresponding to the one simulation.

Abstract: A system and method for image-guided microscopic illumination are provided. A processing module controls an imaging assembly such that a camera acquires an image or images of a sample in multiple fields of view, and the image or images are automatically transmitted to a processing module and processed by the first processing module automatically in real-time based on a predefined criterion so as to determine coordinate information of an interested region in each field of view. The processing module also controls an illuminating assembly to illuminate the interested region of the sample according to the received coordinate information regarding to the interested region, with the illumination patterns changing among the fields of view.

Abstract: A method for manufacturing a semiconductor structure includes: forming a patterned structure which includes a first semiconductor portion and a second semiconductor portion, the first and second semiconductor portions having different materials; and performing an oxide formation process to oxidize the first and second semiconductor portions such that a first oxidation layer formed on the first semiconductor portion has a thickness less than that of a second oxidation layer formed on the second semiconductor portion.

Abstract: The present disclosure provides a semiconductor structure, a forming method thereof, and a semiconductor device, and relates to the technical field of semiconductor packaging processes. The method includes: providing a semiconductor substrate; forming an oxide layer on a surface of the semiconductor substrate, and etching the oxide layer to form a recess, where a through-silicon via (TSV) is provided in the semiconductor substrate and the oxide layer, and an upper end of the TSV is connected to the recess; depositing a metal layer on a surface of the recess, and forming an opening in the metal layer on a bottom surface of the recess, where the opening is connected to the TSV; and filling a second conductive material into the recess, and forming a hole in the second conductive material above the opening.

Abstract: A semiconductor device and method of formation are provided. The semiconductor device comprises a silicide layer over a substrate, a metal plug in an opening defined by a dielectric layer over the substrate, a first metal layer between the metal plug and the dielectric layer and between the metal plug and the silicide layer, a second metal layer over the first metal layer, and an amorphous layer between the first metal layer and the second metal layer.

Abstract: The invention provides a semiconductor structure, the semiconductor structure includes a substrate, a resistance random access memory on the substrate, an upper electrode, a lower electrode and a resistance conversion layer between the upper electrode and the lower electrode, and a cap layer covering the outer side of the resistance random access memory, the cap layer has an upper half and a lower half, and the upper half and the lower half contain different stresses.

Abstract: A semiconductor structure and a method for forming a semiconductor structure are provided. The semiconductor structure includes an epitaxial structure and a metal silicide layer. The epitaxial structure includes a semiconductor material. The metal silicide layer is disposed on the epitaxial structure. The metal silicide layer includes the semiconductor material, a first metal material and a second metal material. An atomic size of the first metal material is greater than an atomic size of the second metal material, and a concentration of the first metal material in the metal silicide layer varies along a thickness direction.

Abstract: A semiconductor structure and method of forming a semiconductor structure are provided. In some embodiments, the method includes forming a gate structure over a substrate. An epitaxial source/drain region is formed adjacent to the gate structure. A dielectric layer is formed over the epitaxial source/drain region. An opening is formed, the opening extending through the dielectric layer and exposing the epitaxial source/drain region. Sidewalls of the opening are defined by the dielectric layer and a bottom of the opening is defined by the epitaxial source/drain region. A silicide layer is formed on the epitaxial source/drain region. A metal capping layer including tungsten, molybdenum, or a combination thereof is selectively formed on the silicide layer by a first deposition process. The opening is filled with a first conductive material in a bottom-up manner from the metal capping layer by a second deposition process different from the first deposition process.

Abstract: A method of forming a semiconductor device includes following operations. A substrate is provided with a gate stack thereon, an epitaxial layer therein, and a dielectric layer aside the gate stack and over the epitaxial layer. An opening is formed through the dielectric layer, and the opening exposes the epitaxial layer. A metal silicon-germanide layer is formed on the epitaxial layer, wherein the metal silicon-germanide layer includes a metal having a melting point of about 1700° C. or higher. A connector is formed over the metal silicon-germanide layer in the opening.