Patents by Inventor Chih-Wei Chao

Chih-Wei Chao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200279838
    Abstract: A light-emitting diode (LED) device includes a substrate, an electrically conductive layer, a first LED chip, and an anti-electrostatic discharge element. The substrate has opposite upper and lower surfaces. The electrically conductive layer is formed on the upper surface of the substrate, and has first and second regions that are electrically separated from each other by a trench structure. The trench structure has a first segment and a second segment which connects and is not collinear with the first segment. The first LED chip is disposed across the first segment, and the anti-electrostatic discharge element is disposed across the second segment, both interconnecting the first and second regions.
    Type: Application
    Filed: May 19, 2020
    Publication date: September 3, 2020
    Inventors: Shunyi CHEN, Junpeng SHI, Weng-Tack WONG, Chen-ke HSU, Chih-Wei CHAO
  • Publication number: 20200227890
    Abstract: The laser device includes a substrate, a laser element disposed on the substrate for emitting a laser light ray, a light guide member disposed on the substrate, and a wavelength conversion layer. The light guide member is light-transmissible and thermally conductive, and has at least one reflection surface for reflecting the laser light ray from the laser element so as to change travelling direction of the laser light ray. The wavelength conversion layer converts wavelength of the laser light ray from the light guide member to result in a laser beam, and contacts the light guide member so that heat from the wavelength conversion layer is transferred to the substrate through the light guide member.
    Type: Application
    Filed: March 26, 2020
    Publication date: July 16, 2020
    Inventors: Hui CHEN, Junpeng SHI, Xinglong LI, CHI-WEI LIAO, Weng-Tack WONG, CHIH-WEI CHAO, Chen-ke HSU
  • Publication number: 20200203582
    Abstract: The present invention provides a white light LED package structure and a white light source system, which includes a substrate, an LED chip, and a wavelength conversion material layer. The peak emission wavelength of the LED chip is between 400 nm and 425 nm; the peak emission wavelength of the wavelength conversion material layer is between 440 nm and 700 nm, and the wavelength conversion material layer absorbs light emitted from the LED chip and emits a white light source; and the emission spectrum of the white light source is set as P(?), the emission spectrum of a blackbody radiation having the same color temperature as the white light source is S(?), P(?max) is the maximum light intensity within 380-780 nm, S(?max) is the maximum light intensity of the blackbody radiation within 380-780 nm, D(?) is a difference between the spectrum of the white light LED and the spectrum of the blackbody radiation, and within 510-610 nm, the white light source satisfies: D(?)=P(?)/P(?max)?S(W)/S(?max), ?0.
    Type: Application
    Filed: March 5, 2020
    Publication date: June 25, 2020
    Inventors: Senpeng HUANG, Junpeng SHI, Weng-Tack WONG, Shunyi CHEN, Zhenduan LIN, Chih-wei CHAO, Chen-ke HSU
  • Patent number: 10658550
    Abstract: A light-emitting diode (LED) package structure includes: a support; an LED chip; and a package cover, wherein: a support circuit is formed over the support; the LED chip is arranged over the support and electrically coupled to the support circuit; a lower surface periphery of the package cover is provided with a groove structure filled with organic binder; and the package cover is arranged over the LED chip and connected to the support via the organic binder.
    Type: Grant
    Filed: November 10, 2018
    Date of Patent: May 19, 2020
    Assignee: XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
    Inventors: Junpeng Shi, Qiuxia Lin, Zhenduan Lin, Chen-Ke Hsu, Chih-Wei Chao
  • Publication number: 20200094293
    Abstract: The present disclosure describes a wafer cleaning process in which a drained cleaning solution, which is used to remove metal contaminants from the wafer, is sampled and analyzed to determine the concentration of metal ions in the solution. The wafer cleaning process includes dispensing, in a wafer cleaning station, a chemical solution on one or more waters; collecting the dispensed chemical solution; determining a concentration of contaminants in the chemical solution; in response to the concentration of the contaminants being greater than a baseline value, adjusting one or more parameters in the cleaning process; and in response to the concentration of the contaminants being equal to or less than the baseline value, transferring the one or more wafers out of the wafer cleaning station.
    Type: Application
    Filed: July 24, 2019
    Publication date: March 26, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Wei Chao, Shu-Yen Wang
  • Patent number: 10567970
    Abstract: A cloud radio access network system includes remote signal sources, a baseband processing unit pool, an access management server, a software defined network controller and a network signal forwarder. The software defined network controller is electrically connected to the access management server and the network signal forwarder. The network signal forwarder includes at least two network connectors, each of which is configured to be connected to one remote signal source or the baseband processing unit pool. The software defined network controller obtains connection relation between the network connectors and the remote signal sources or the baseband processing unit pool, and provides network resource information to the network signal forwarder according to the connection relation. The network signal forwarder establishes communication between one remote signal source and the baseband processing unit pool according to the network resource information.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: February 18, 2020
    Assignee: ALPHA NETWORKS INC.
    Inventors: Chih-Wei Chao, Li-Chung Hsu, Yu-Hsin Kuo, Po-Wei Shih, Shih-Chi Lee
  • Patent number: 10559732
    Abstract: A surface-mounted light-emitting device is fabricated by epitaxial growth: forming the LED epitaxial structure over a growth substrate through epitaxial growth; chip fabrication: determining P and N electrode regions and an isolating region over the LED epitaxial structure surface and fabricating the P and N electrode pads and the insulator over the P and N electrode regions and the isolating region, wherein the P and N electrode pads have sufficient thicknesses to support the LED epitaxial structure, and the insulator is formed between the P and N electrode pads to prevent the P and N electrode pads from a short circuit; removing the growth substrate and unitizing the LED epitaxial structure to form the chip; and SMT packaging: providing the supporting substrate and directly mounting the P and N electrode pads of the chip over the supporting substrate through SMT packaging to thereby form the surface-mounted LED light-emitting device.
    Type: Grant
    Filed: December 3, 2016
    Date of Patent: February 11, 2020
    Assignee: XIAMEN SANAN OPTO ELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Shaohua Huang, Xiaoqiang Zeng, Chih-Wei Chao
  • Publication number: 20200029220
    Abstract: A cloud radio access network system includes remote signal sources, a baseband processing unit pool, an access management server, a software defined network controller and a network signal forwarder. The software defined network controller is electrically connected to the access management server and the network signal forwarder. The network signal forwarder includes at least two network connectors, each of which is configured to be connected to one remote signal source or the baseband processing unit pool. The software defined network controller obtains connection relation between the network connectors and the remote signal sources or the baseband processing unit pool, and provides network resource information to the network signal forwarder according to the connection relation. The network signal forwarder establishes communication between one remote signal source and the baseband processing unit pool according to the network resource information.
    Type: Application
    Filed: December 12, 2018
    Publication date: January 23, 2020
    Inventors: CHIH-WEI CHAO, LI-CHUNG HSU, YU-HSIN KUO, PO-WEI SHIH, SHIH-CHI LEE
  • Publication number: 20200029247
    Abstract: A cloud radio access network system includes remote signal sources, a baseband processing unit pool, an access management server, a software defined network controller and a network signal forwarder. Each remote signal source is configured to transmit an access signal. The baseband processing unit pool provides a baseband processing signal. The access management server provides an access state signal. Different maximum transmission rates are transmitted via the access state signal. When the baseband processing unit pool has authenticated one remote signal source, the baseband processing unit pool transmits an authentication notification signal to the access management server. Then, the access management server informs the software defined network controller according to the authentication notification signal to increase an upper limit of a signal transmission rate between the baseband processing unit pool and the authenticated remote signal source to a higher one of the maximum transmission rates.
    Type: Application
    Filed: December 12, 2018
    Publication date: January 23, 2020
    Inventors: CHIH-WEI CHAO, LI-CHUNG HSU, YU-HSIN KUO, PO-WEI SHIH, SHIH-CHI LEE
  • Publication number: 20200028789
    Abstract: A cloud radio access network system includes remote signal sources, a baseband processing unit pool, an access management server, a software defined network controller and a network signal forwarder. Each remote signal source is configured to transmit an access signal. The baseband processing unit pool provides a baseband processing signal. The access management server provides an access state signal. The software defined network controller is electrically connected to the access management server and the network signal forwarder. The remote signal sources and the baseband processing unit pool are electrically connected to the network signal forwarder so that the access signal and the baseband processing signal are transmitted through the network signal forwarder. Signal transmission between the software defined network controller and the access management server are independent of the at least one network signal forwarder.
    Type: Application
    Filed: December 12, 2018
    Publication date: January 23, 2020
    Inventors: CHIH-WEI CHAO, LI-CHUNG HSU, YU-HSIN KUO, PO-WEI SHIH, SHIH-CHI LEE
  • Patent number: 10510938
    Abstract: A light-emitting diode (LED) package includes a substrate with upper and lower surfaces, including: a metal block; an electrically insulating region surrounding at least a portion of the metal block; an LED chip mounted on the substrate and in electrical communication with the metal block; and an encapsulant covering at least an upper surface of the LED chip. A light-emitting system includes a plurality of light-emitting diode (LED) chips; and a package support for the plurality of LED chips.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: December 17, 2019
    Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Jun-Peng Shi, Pei-Song Cai, Hao Huang, Xing-Hua Liang, Zhen-Duan Lin, Chih-Wei Chao, Chen-Ke Hsu
  • Patent number: 10505088
    Abstract: A packaging structure of a vertical LED chip includes at least a support system, a glue cup that connects to periphery of the support system, a LED chip with light absorption substrate over the support system and packaging glue distributed in periphery of the LED chip. The light absorption substrate has a side forming a bubble structure at an interface with the packaging glue. A reflecting layer is formed from material refractivity difference of the packaging glue, the bubble structure and the light absorption substrate for eliminating or reducing light absorption by the substrate.
    Type: Grant
    Filed: February 28, 2016
    Date of Patent: December 10, 2019
    Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Chih-Wei Chao, Yen-Chih Chiang
  • Publication number: 20190362962
    Abstract: In an embodiment, a method includes: receiving a wafer from a first dilution tank; immersing the wafer in a deionization tank, wherein the deionization tank comprises a tank solution that comprises a deionizing solution; determining a metal ion concentration within the tank solution; performing remediation within the deionization tank in response to determining that the metal ion concentration is greater than a threshold value; and moving the wafer to a second dilution tank.
    Type: Application
    Filed: May 24, 2018
    Publication date: November 28, 2019
    Inventors: Chih-Wei Chao, Shu-Yen Wang
  • Publication number: 20190319169
    Abstract: A light emitting device includes an LED chip, a light-transmissible member and a light-reflecting member. The LED chip has a plurality of interconnecting side surfaces having a roughened structure and a plurality of corners. The light-transmissible member covers the side surfaces and the corners and includes a light-transmissible material layer having a breadth value W(A) of a viscosity coefficient (A) range of the light-transmissible material, which satisfies a relation of W(A)?B*D/C: where B represents a thickness of the light-transmissible material layer, represents a thickness of the LED chip measured from the first surface to the second surface, and D represents a roughness of the roughened structure. A method for manufacturing the light emitting device is also provided.
    Type: Application
    Filed: June 26, 2019
    Publication date: October 17, 2019
    Inventors: Senpeng HUANG, Zhen-duan LIN, Weng-Tack WONG, Junpeng SHI, Shunyi CHEN, Chih-Wei CHAO, Chen-ke HSU
  • Patent number: 10367126
    Abstract: A light-emitting device includes a base having an insulating part and a metal block; a light-emitting diode (LED) chip over the base; a water soluble paste between the LED chip and the base metal block for chip fixing and heat conduction; packaging glue covering the LED chip; and the LED chip bottom, water soluble paste and the base metal block form an all-metal thermal conducting path to achieve low a thermal resistance.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: July 30, 2019
    Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Junpeng Shi, Pei-Song Cai, Hao Huang, Zhenduan Lin, Chih-Wei Chao, Chen-Ke Hsu
  • Patent number: 10249789
    Abstract: A light-emitting diode chip includes an epitaxial layer with a plurality of recess portions and protrusion portions; and a light transmission layer having a plurality of light transmission portions between top ends of adjacent protrusion portions and forming holes with the recess portions. The light transmission portions have a horizontal dimension larger than a width of the top ends of two adjacent protrusion portions, and serve as current blocking layer. A current spreading layer covers the light transmission layer and the epitaxial layer not masked by the light transmission layer. A refractive index of the light transmission layer is between those of the epitaxial layer and the holes, indicating a difference of refractive index between the light transmission layer and the epitaxial layer. Light scattering probability can therefore be increased, thus avoiding light absorption by electrodes and improving light extraction efficiency.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: April 2, 2019
    Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Jiansen Zheng, Su-Hui Lin, Chen-Ke Hsu, Chih-Wei Chao
  • Publication number: 20190081216
    Abstract: A light-emitting diode (LED) package structure includes: a support; an LED chip; and a package cover, wherein: a support circuit is formed over the support; the LED chip is arranged over the support and electrically coupled to the support circuit; a lower surface periphery of the package cover is provided with a groove structure filled with organic binder; and the package cover is arranged over the LED chip and connected to the support via the organic binder.
    Type: Application
    Filed: November 10, 2018
    Publication date: March 14, 2019
    Applicant: XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
    Inventors: Junpeng SHI, Qiuxia LIN, Zhenduan LIN, Chen-Ke HSU, Chih-Wei CHAO
  • Patent number: 10230770
    Abstract: A system and method for providing a network proxy layer are disclosed. The network proxy layer may receive a connection establishment event for a client connection of an application session and send the client connection event to an application proxy for the application session, the application proxy being associated with an application of a server. Upon establishment of the client connection, the network proxy layer may receive one or more data packets from the client connection. The network proxy layer may further receive a connection establishment event for a server connection of the application session of the server, and receive one or more data packets from the server connection.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: March 12, 2019
    Assignee: A10 Networks, Inc.
    Inventors: Feilong Xu, Chih-Wei Chao, Lee Chen
  • Publication number: 20180316607
    Abstract: A device receives traffic; identifies an address associated with the traffic; determines whether the address is associated with an aggregate interface, the aggregate interface being associated with a first port and a second port. The first port corresponds to a first node in a first state, that indicates that the first node is available to forward the traffic, and the second port corresponds to a second node in a second state, that indicates that that the second node is not available to forward the traffic. The device transmits the traffic to the first node via the first port and to the second node, via the second port, when the address is associated with the aggregate interface. Transmitting the traffic enables the second node to forward the traffic when the first node changes from the first state to the second state.
    Type: Application
    Filed: July 2, 2018
    Publication date: November 1, 2018
    Inventors: Dongyi JIANG, Jin SHANG, David YU, Tsai-Zong LIN, Chih-Wei Chao
  • Patent number: 10015082
    Abstract: A device receives traffic; identifies an address associated with the traffic; determines whether the address is associated with an aggregate interface, the aggregate interface being associated with a first port and a second port. The first port corresponds to a first node in a first state, that indicates that the first node is available to forward the traffic, and the second port corresponds to a second node in a second state, that indicates that that the second node is not available to forward the traffic. The device transmits the traffic to the first node via the first port and to the second node, via the second port, when the address is associated with the aggregate interface. Transmitting the traffic enables the second node to forward the traffic when the first node changes from the first state to the second state.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: July 3, 2018
    Assignee: Juniper Networks, Inc.
    Inventors: Dongyi Jiang, Jin Shang, David Yu, Tsai-Zong Lin, Chih-Wei Chao