Abstract: A light-weight resilient mechanism is used to synchronize server secure keying data with member devices in a highly-scalable distributed group virtual private network (VPN). A server device generates an initial secure keying data set, for the VPN, that includes a first version identifier, and sends, to member devices and via point-to-point messages, the secure keying data set. The server device sends, to the member devices, heartbeat push messages including the first version identifier. The server device generates an updated secure keying data set with a second version identifier and sends, to the member devices, a key push message that includes the updated data set. The server device sends, to the member devices, heartbeat push messages including the second version identifier. Member devices may use the first and second version identifiers to confirm that secure keying data sets are current and quickly identify if updates are missed.

Abstract: A server device initiates a traffic encapsulation key (TEK) re-key sequence for a group virtual private network (VPN), based on an upcoming expiration time for an existing TEK. The server device sends, via a push message during a first time period immediately after the initiating, a new TEK to members of the group VPN. The server device receives, during a second time period that immediately follows the first time period, a pull request, for the new TEK, from one of the members of the group VPN, and sends, to the one of the members, the new TEK, where the re-key sequence transitions all the members of the group VPN from the existing TEK key to the new TEK key before the expiration time for the existing TEK.

Abstract: A light-weight resilient mechanism is used to synchronize server secure keying data with member devices in a highly-scalable distributed group virtual private network (VPN). A server device generates an initial secure keying data set, for the VPN, that includes a first version identifier, and sends, to member devices and via point-to-point messages, the secure keying data set. The server device sends, to the member devices, heartbeat push messages including the first version identifier. The server device generates an updated secure keying data set with a second version identifier and sends, to the member devices, a key push message that includes the updated data set. The server device sends, to the member devices, heartbeat push messages including the second version identifier. Member devices may use the first and second version identifiers to confirm that secure keying data sets are current and quickly identify if updates are missed.

Abstract: A light-weight resilient mechanism is used to synchronize server secure keying data with member devices in a highly-scalable distributed group virtual private network (VPN). A server device generates an initial secure keying data set, for the VPN, that includes a first version identifier, and sends, to member devices and via point-to-point messages, the secure keying data set. The server device sends, to the member devices, heartbeat push messages including the first version identifier. The server device generates an updated secure keying data set with a second version identifier and sends, to the member devices, a key push message that includes the updated data set. The server device sends, to the member devices, heartbeat push messages including the second version identifier. Member devices may use the first and second version identifiers to confirm that secure keying data sets are current and quickly identify if updates are missed.

Abstract: A device may reserve a slot for a received packet in a packet ordering queue (POQ), convey the packet to one of a plurality of threads for processing, obtain the packet from the one of the plurality of threads after the packet has been processed, organize the packet in the POQ in accordance with a position of the reserved slot, and release the packet from the POQ if the reserved slot is a head of the POQ.

Abstract: A LED chip including a substrate, a semiconductor device layer, a current blocking layer, a current spread layer, a first electrode and a second electrode is provided. The semiconductor device layer is disposed on the substrate. The current blocking layer is disposed on a part of the semiconductor device layer and includes a current blocking segment and a current distribution adjusting segment. The current spread layer is disposed on a part of the semiconductor device layer and covers the current blocking layer. The first electrode is disposed on the current spread layer, wherein a part of the current blocking segment is overlapped with the first electrode. Contours of the current blocking segment and the first electrode are similar figures. Contour of the first electrode and is within contour of the current blocking segment. The current distribution adjusting segment is not overlapped with the first electrode.

Abstract: In a fabricating method of an LED, a first-type doped semiconductor material layer, a light emitting material layer, and a second-type doped semiconductor material layer are sequentially formed on a substrate. The first-type and second-type doped semiconductor material layers and the light emitting material layer are patterned to form a first-type doped semiconductor layer, an active layer, and a second-type doped semiconductor layer. The active layer is disposed on a portion of the first-type doped semiconductor layer. The second-type doped semiconductor layer is disposed on the active layer and has a first top surface. A wall structure is formed on the first-type doped semiconductor layer that is not covered by the active layer, and the wall structure surrounds the active layer and has a second top surface higher than the first top surface of the second-type doped semiconductor layer. Electrodes are formed on the first-type and second-type doped semiconductor layers.

Abstract: A display device includes a first substrate, a heating layer formed on the first substrate, an insulating layer having a first opening formed on the heating layer, at least one switching device, two contact pads formed on the insulating layer, and respectively electrically connected to the scan line and the data line, a capacitor, a passivation layer covering the switching device and the capacitor, and a pixel electrode formed on the passivation layer and electrically connected to the drain of the switching device. The source of the switching device is connected to the data line. The passivation layer has a plurality of second openings exposing the contact pads.

Abstract: A method may include receiving a packet at an ingress line interface in a forwarding plane of a network element, the packet including header information. The method may also include conducting a flow table lookup in the forwarding plane to identify an existing flow for the packet and determining, in the forwarding plane and based on the header information, whether a predicted flow can be identified for the packet if an existing flow can not be identified. The method may further include performing a service access control list (ACL) lookup in the forwarding plane if a predicted flow can not be identified; and forwarding the packet to one of a services plane or an egress line interface in the forwarding plane based on one of the existing flow, the predicted flow, or the service ACL lookup.

Abstract: A method for fabricating a light emitting diode chip is provided. Firstly, a semiconductor device layer is formed on a substrate. Afterwards, a current spreading layer is formed on a portion of the semiconductor device layer. Then, a current blocking layer and a passivation layer are formed on a portion of the semiconductor device layer not covered by the current spreading layer. Finally, a first electrode is formed on the current blocking layer and the current spreading layer. Moreover, a second electrode is formed on the semiconductor device layer.

Abstract: An optical reflective touch panel and pixels and a system thereof are provided. Each pixel of the optical reflective touch panel includes a display circuit and a sensing circuit. The display circuit controls the display of the pixel. The sensing circuit is coupled to the display circuit for sensing a sensitization state of the pixel during a turned-on period and a turned-off period of a backlight module and outputting a digital signal to notify an optical reflective touch panel system that whether the pixel is touched or not.

Abstract: Exemplary embodiments of the present invention illustrate a probability time division multiplexing polling method and a wireless identifier reader controller thereof. The probability time division multiplexing polling method is used to control a plurality of wireless identifier readers to be turned on or off. First, one of the wireless identifier readers is randomly selected according to a probability model, wherein the probability model presents the probabilities for detecting an identifier tag of the wireless identifier readers. Then, the selected wireless identifier reader is turned on for a predetermined time period.

Abstract: A high bright LED comprises a substrate, a conductive layer, a first semiconductor layer, a luminous layer, a second semiconductor layer, a first electrode, a second electrode and an insulation structure. The conductive layer, the first semiconductor layer, the luminous layer and the second semiconductor layer are disposed upwards from an upper solder layer of the substrate in order. The first electrode is electrically connected to the conductive layer The second electrode penetrates through the conductive layer, the first semiconductor layer and the luminous layer to make the upper solder and the second semiconductor layer electrically connected. The insulation structure comprises at least two passivation layers peripherally wrapping the second electrode. The thicknesses of the at least two passivation layers are conformed to the distributed Bragg reflection technique to make the passivation layers jointly used as a reflector with high reflectance.

Abstract: In general, techniques are described for dynamically managing weighted queues. In accordance with the techniques, a network security device comprises a queue management module that assigns, for each queue of a plurality of queues, a quota desirable to a user that a processor of the network security device consumes to service each queue. The queue management module determines, based on the desirable quotas, a queue weight for each queue and computes. Based on the computation, the queue management module dynamically adjusts one or more of the weights such that subsequent amounts of processing time actually required to process the number of packets defined by each of the queue weights more accurately reflects the desirable quotas assigned to each of the queues. The network device outputs the number of packets in accordance with the adjusted weights.

Abstract: A method for fabricating a light emitting diode chip is provided. In the method, a half-tone mask process, a gray-tone mask process or a multi-tone mask process is applied and combined with a lift-off process to further reduce process steps of the light emitting diode chip. In the present invention, some components may also be simultaneously formed by an identical process to reduce the process steps of the light emitting diode chip. Consequently, the fabricating method of the light emitting diode provided in the present invention reduces the cost and time for the fabrication of the light emitting diode.

Abstract: A method for fabricating a light emitting diode chip is provided. In the method, a half-tone mask process, a gray-tone mask process or a multi-tone mask process is applied and combined with a lift-off process to further reduce process steps of the light emitting diode chip. In the present invention, some components may also be simultaneously formed by an identical process to reduce the process steps of the light emitting diode chip. Consequently, the fabricating method of the light emitting diode provided in the present invention reduces the cost and time for the fabrication of the light emitting diode.

Abstract: A method for fabricating a light emitting diode chip is provided. In the method, a half-tone mask process, a gray-tone mask process or a multi-tone mask process is applied and combined with a lift-off process to further reduce process steps of the light emitting diode chip. In the present invention, some components may also be simultaneously formed by an identical process to reduce the process steps of the light emitting diode chip. Consequently, the fabricating method of the light emitting diode provided in the present invention reduces the cost and time for the fabrication of the light emitting diode.

Abstract: A method for fabricating a light emitting diode chip is provided. In the method, a half-tone mask process, a gray-tone mask process or a multi-tone mask process is applied and combined with a lift-off process to further reduce process steps of the light emitting diode chip. In the present invention, some components may also be simultaneously formed by an identical process to reduce the process steps of the light emitting diode chip. Consequently, the fabricating method of the light emitting diode provided in the present invention reduces the cost and time for the fabrication of the light emitting diode.

Abstract: A method for fabricating a light emitting diode chip is provided. In the method, a half-tone mask process, a gray-tone mask process or a multi-tone mask process is applied and combined with a lift-off process to further reduce process steps of the light emitting diode chip. In the present invention, some components may also be simultaneously formed by an identical process to reduce the process steps of the light emitting diode chip. Consequently, the fabricating method of the light emitting diode provided in the present invention reduces the cost and time for the fabrication of the light emitting diode.

Abstract: A method for fabricating a light emitting diode chip is provided. In the method, a half-tone mask process, a gray-tone mask process or a multi-tone mask process is applied and combined with a lift-off process to further reduce process steps of the light emitting diode chip. In the present invention, some components may also be simultaneously formed by an identical process to reduce the process steps of the light emitting diode chip. Consequently, the fabricating method of the light emitting diode provided in the present invention reduces the cost and time for the fabrication of the light emitting diode.