Abstract: A device includes: a stack of semiconductor nanostructures; a gate structure wrapping around the semiconductor nanostructures, the gate structure extending in a first direction; a source/drain region abutting the gate structure and the stack in a second direction transverse the first direction; a contact structure on the source/drain region; a backside conductive trace under the stack, the backside conductive trace extending in the second direction; a first through via that extends vertically from the contact structure to a top surface of the backside dielectric layer; and a gate isolation structure that abuts the first through via in the second direction.

Abstract: A semiconductor device includes a first dielectric layer, a stack of semiconductor layers disposed over the first dielectric layer, a gate structure wrapping around each of the semiconductor layers and extending lengthwise along a direction, and a dielectric fin structure and an isolation structure disposed on opposite sides of the stack of semiconductor layers and embedded in the gate structure. The dielectric fin structure has a first width along the direction smaller than a second width of the isolation structure along the direction. The isolation structure includes a second dielectric layer extending through the gate structure and the first dielectric layer, and a third dielectric layer extending through the first dielectric layer and disposed on a bottom surface of the gate structure and a sidewall of the first dielectric layer.

Abstract: Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.

Abstract: A particle removal method includes loading a particle attracting member with a coating layer into a processing chamber of a processing apparatus. The processing chamber is configured to perform a lithography exposure process on a semiconductor wafer. The method also includes fixing the particle attracting member on a reticle holder in the processing chamber in a cleaning cycle, attracting particles in the processing chamber by the coating layer of the particle attracting member due to a potential difference between the particles and the coating layer, and loading the particle attracting member with the coating layer and the attracted particles out of the processing chamber, after the cleaning cycle. The method also includes loading the semiconductor wafer into the processing chamber, and performing the lithography exposure process on the semiconductor wafer in the processing chamber using a reticle fixed on the reticle holder after the cleaning cycle.

Abstract: An IC device includes first through third rows of fin field-effect transistors (FinFETs), wherein the second row is between and adjacent to each of the first and third rows, the FinFETs of the first row are one of an n-type or p-type, the FinFETs of the second and third rows are the other of the n-type or p-type, the FinFETs of the first and third rows include a first total number of fins, and the FinFETs of the second row include a second total number of fins one greater or fewer than the first total number of fins.

Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.

Abstract: A switch device includes a P-type substrate, a first gate structure, a first N-well, a shallow trench isolation structure, a first P-well, a second gate structure, a first N-type doped region, a second P-well, and a second N-type doped region. The first N-well is formed in the P-type substrate and partly under the first gate structure. The shallow trench isolation structure is formed in the first N-well and under the first gate structure. The first P-well is formed in the P-type substrate and under the first gate structure. The first N-type doped region is formed in the P-type substrate and between the first gate structure and the second gate structure. The second P-well is formed in the P-type substrate and under the second gate structure. The second N-type doped region is formed in the second P-well and partly under the second gate structure.

Abstract: A transmission interface between at least a first module and a second module is proposed. The transmission interface includes at least two physical transmission mediums. Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated. The at least two physical transmission mediums include a first physical transmission medium arranged to carry a first multiplexed signal including a first IF signal and a reference clock signal. The first IF signal and the reference clock signal are at different frequencies.

Abstract: A method for identifying hard-coded strings in source code is disclosed. In one embodiment, such a method parses source code and associated localization resource files to identify hard-coded strings and their associated context. The method provides a confidence score for each hard-coded string that indicates whether the hard-coded string is translatable or non-translatable. Based on the confidence score for each hard-coded string, the method transforms each hard-coded string into a single equivalence word. The method then prepares training data by tagging the hard-coded strings in the source code and associated localization resource files as one of translatable and non-translatable. The method then trains a parts-of-speech (POS) tagging model using the training data. At runtime, the method fetches potential hard-coded strings and tags each hard-coded string as one of translatable and non-translatable using the POS tagging model. A corresponding system and computer program product are also disclosed.

Abstract: A light sensor having a voltage reversing mechanism is provided. A photoelectric component converts a first light signal into a first photocurrent. A capacitor is charged to a first voltage by the first photocurrent. A counter counts a first coarse count value according to the first voltage. The photoelectric component converts a second light signal into a second photocurrent. The capacitor is charged from a reversed first voltage to a second voltage by the second photocurrent. The counter counts a second coarse count value according to the second voltage. The counter counts a fine count value according to the second coarse count value. One of the first light signal and the second light signal is emitted by both of an ambient light source and a light-emitting component and then reflected by a tested object, and the other one of them is emitted by only the ambient light source.

Abstract: A light sensor having a voltage reversing mechanism is provided. A photoelectric component converts a first light signal into a first photocurrent. A capacitor is charged to a first voltage by the first photocurrent. A counter counts a first coarse count value according to the first voltage. The photoelectric component converts a second light signal into a second photocurrent. The capacitor is charged from a reversed first voltage to a second voltage by the second photocurrent. The counter counts a second coarse count value according to the second voltage. The counter counts a fine count value according to the second coarse count value. One of the first light signal and the second light signal is emitted by both of an ambient light source and a light-emitting component and then reflected by a tested object, and the other one of them is emitted by only the ambient light source.

Abstract: A light sensing method having a sensing order adjusting mechanism is provided. The method includes steps of: in a previous sensing cycle, sensing a first light signal that is emitted by both of an ambient light source and a light-emitting component and then is reflected by a tested object; in the previous sensing cycle, sensing a second light signal that is emitted by both of the ambient light source and the light-emitting component and then is reflected by the tested object; in the previous sensing cycle, sensing an ambient light signal emitted by only the ambient light source; and in a next sensing cycle, sensing the first light signal, the second light signal and the ambient light signal in an order different from that in the previous sensing cycle.

Abstract: A MEMS structure is provided. The MEMS structure includes a substrate and a backplate, the substrate has an opening portion, and the backplate is disposed on one side of the substrate and has acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate, and the diaphragm extends across the opening portion of the substrate and includes outer ventilation holes and inner ventilation holes arranged in a concentric manner. The outer ventilation holes and the inner ventilation holes are relatively arranged in a ring shape and surround the center of the diaphragm. The MEMS structure further includes a pillar disposed between the backplate and the diaphragm. The pillar prevents the diaphragm from being electrically connected to the backplate.

Abstract: Floating fastener includes base including main body provided with through hole, resisting ring protruded inside through hole, seat body extended around main body and docking portion protruded from seat body, positioning member having shank inserted into through hole, head located at one end of shank outside main body, joint portion located at an opposite end of shank to move in and out of docking portion and stopper provided between joint portion and shank to abut against resisting ring, elastic member set on shank and stopped between head and resisting ring, and pad provided with inner hole which is inserted outside docking portion of base, so that pad abuts against seat body near the docking portion. The pad is made of soft material, which can achieve the purpose of absorbing the shaking and vibration of the floating fastener under the influence of external force.

Abstract: A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate and having acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate and extending across the opening portion of the substrate. The diaphragm includes ventilation holes, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a coverage structure disposed on the sidewall of at least one ventilation hole.

Abstract: Embodiments of the disclosure provide a method for determining a specific linear model and a video processing device. The method includes: determining a plurality of linear model parameters of each of a plurality of linear models; determining a chroma template reconstruction and a luma template, wherein the chroma template reconstruction and the luma template are associated with a specific chroma block; determining a chroma template prediction corresponding to each of the plurality of linear models based on the luma template and the corresponding linear model parameters; determining a template cost of each of the plurality of linear models based on the chroma template reconstruction and the corresponding chroma template prediction; and selecting the specific linear model from the linear models based on the template cost of each of the plurality of linear models.

Abstract: A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate. The opening portion of the substrate is under the diaphragm, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a pillar structure connected with the backplate and the diaphragm and a protection post structure extending from the backplate into the air gap. From a top view of the backplate, the protection post structure surrounds the pillar structure.

Abstract: A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate and having acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate and extending across the opening portion of the substrate. The diaphragm includes a ventilation hole, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a protrusion extending into the air gap.

Abstract: A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate and having acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate and extending across the opening portion of the substrate. The diaphragm includes a ventilation hole, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a filler structure disposed on the diaphragm, and a portion of the filler structure is disposed in the ventilation hole.

Abstract: A multiphase power converter having a daisy chain control circuit and a method for controlling the same are provided. A main control circuit outputs an initial pulse width modulation signal having a plurality of initial pulses. One of a plurality of slave control circuits is connected to an output terminal of the main control circuit, and outputs a pulse width modulation signal according to the received initial pulse width modulation signal. Each of the rest of the plurality of slave control circuits outputs the next pulse width modulation signal to the next slave control circuit or the main control circuit according to the pulse width modulation signal received from the previous slave control circuit. The main control circuit automatically counts a quantity of the control circuits according to the received pulse width modulation signal and outputted initial pulse width modulation signal.